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发明授权
CN101312617B 高密度印制电路板绝缘介质层的制作方法 有权

高密度印制电路板绝缘介质层的制作方法
摘要：
本发明提供一种高密度印制电路板绝缘介质层的制作方法，提供一种印制电路板，所述印制电路板包括核心板和位于核心板线路面上的导电凸块，采用丝网印刷工艺在核心板线路面上形成绝缘介质层。避免了采用现有技术的压制工艺形成绝缘介质层时导致形成的绝缘介质层厚度分布不均的缺陷。
摘要（英）：

The invention provides a production method for the insulated medium layer of a high density printed circuit board and provides a printed circuit board, wherein the printed circuit board comprises a core board and a conductive block on the face of the core board. The invention adopts screen printing method to form an insulated medium layer on the face of the core board. The invention eliminates theuneven thickness defect of the insulated medium layer caused by adopting the prior pressing method to form the insulated medium layer.

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