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发明授权
CN101218062B 用于粘接工件和微结构元件的方法 失效 - 权利终止

用于粘接工件和微结构元件的方法
摘要：
为了形成适于制造由多个单独层组成的微结构元件的非常坚固的粘接接头，提出了一种粘接方法，通过该方法，形成工件的粘接结构，所述粘接结构包括至少一个夹置于工件之间的金属粘接层，并且通过该方法，粘接结构被加热至低于所述至少一个粘接层的熔化温度的粘接温度。根据本发明，利用化学或者电解方法沉积所述至少一个粘接层。
摘要（英）：

For forming very strong bond joints suited for manufacturing micro-structured components consisting of a plurality of individual layers, a bonding method is proposed by which a bonding arrangement of the work pieces is formed that comprises at least one metallic bonding layer interposed therein between and by which the bonding arrangement is heated to a bonding temperature below the melting temperature of the at least one bonding layer. In accordance with the invention, the at least one bonding layer is deposited using a chemical or electrolytic method.

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