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发明授权
CN101211802B 非流动、下装填方式的倒装片安装方法 失效 - 权利终止

非流动、下装填方式的倒装片安装方法
摘要：
本发明涉及一种具备高度控制功能的非流动、下装填方式的倒装片安装方法。在该方法中，可靠地使隆起焊盘接触到基板的焊径电极上，能以高可靠性进行回流锡焊。在该方法中，在基板上事先涂敷树脂之后，在上述基板上装上附有隆起焊盘的半导体，基板的焊径电极与隆起焊盘接合，其特征在于：将上述基板装在回流夹具的基台上面，在该基板上涂敷高度充填有填料的树脂，在该基板的规定位置上装上上述附有隆起焊盘的半导体，同时，在该半导体的上部装上比上述基板的产品外形尺寸大的按压板，并且，在该按压板的下面和上述基台上面之间介设垫片，限制按压板的按压量，同时，用直立设置于上述基台上面的定位用的导向销，限制该按压板的水平移动。
摘要（英）：

The invention relates to a non-flow and down-filling type flip chip mounting method, with high control function. In the method, a convex welding pad is contacted with the pad electrode of a substrate reliably. In the method, a semiconductor adhered with the convex welding pad is arranged on the substrate after coating resins on the substrate, and the pad electrode of the substrate is connected with the convex welding pad. The invention is characterized in that the substrate is arranged on a base station of a reflow clamp; the substrate is coated with resins which are filled with fillings in the height direction; a semiconductor adhered with the convex welding pad is arranged at the preset position of the substrate; also, a pressing board whose outer size is larger than that of the substrate is arranged on the upper part of the semiconductor; also, a gasket is arranged between the lower side of the pressing board and the upper side of the base station so as to limit the pressing amountof the pressing board; besides, the horizontal movement of the pressing board is limited by a guiding pin which is vertically arranged on the base station.

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