Precoating methods for previously adhering solder to areas to be soldered of a workpiece for an electronic part such as a printed circuit board, a chip part, or a wafer include the plating method, the hot leveling method, the solder paste method, the solder ball method etc. In these conventional precoating methods, solder do not uniformly adhere to areas to be soldered, solder do not adhere completely, and large equipment and much time were required. The present invention provides a method which can perform precoating with uniform application and without the occurrence of defects using simpleequipment and a workpiece to which solder is uniformly adhered. In the present invention, an excess amount of solder powder is dispersed atop an adhesive applied to a substrate, and then excess solder powder which is not adhered to the adhesive is removed. The surface on with solder powder is dispersed is then stacked on a workpiece to which flux is applied with the application of pressure, heating is then performed, and solder is adhered only to areas to be soldered.