The invention relates to an electronic assembly body which comprises a circuit board, a chip, a substrate, a plurality of solder balls and a plurality of support frames. The substrate is provided witha first surface and a second surface corresponding to the first surface, wherein, the chip is arranged on the first surface and is electrically connected with the substrate. The solder balls are arranged between the second surface and the circuit board and the chip is electrically connected with the circuit board by the substrate and the solder balls. A plurality of support frames is arranged between the substrate and the circuit board to limit the space between the circuit board and the substrate; each support frame is provided with a binding face and the second surface is leaned on the binding face. In addition, the invention also provides a method for manufacturing the electronic assembly body.