A production method of a suspension board with circuit that can form the ground terminal for connection with the ground, while reducing the number of man-hour and complicated processes, and reduce production cost. After an insulating base layer is formed on a metal supporting board in such a manner that the base opening portion is formed in the metal supporting board, a conductive pattern comprising a ground wiring pattern and a signal wiring pattern is formed on the insulating base layer. Then, an insulating cover layer to cover the conductive pattern is formed on the insulating base layer insuch a manner that a first cover opening portion and a second cover opening portion are formed in the insulating cover layer. Then, an electrolytic plating layer is formed on a surface of the groundterminal exposed from the first cover opening portion and on a surface of the ground connecting portion exposed from the second cover opening portion, feeding electric power from the ground wire. Thereafter, a metal filling layer is formed in the base opening portion so as to conduct the ground connecting portion and the metal supporting board.