The invention concerns a method for making a thin film, which consists in creating a brittle zone embedded by implantation of a chemical species in a substrate (1), so as to be able subsequently to provoke a fracture of the substrate (1) along said brittle zone to separate therefrom said thin film (6). The invention is characterized in that the manufacturing method comprises in particular the following steps: a) a main implantation in the substrate (1) at a main depth (5) of a main chemical species (4); b) at least one secondary implantation in the substrate (1), at a secondary depth (3) different from said main depth (5), and at a concentration higher than the concentration of the main species (4), of at least a secondary chemical species (2) less efficient than the main species (4) for embrittling the substrate (1); c) causing at least part of said secondary species (2) to migrate up to the proximity of the main depth (5); and d) provoking a fracture along the main depth (5). The invention also concerns the thin film obtained by the inventive method.