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发明授权
CN100511618C 金属粒子分散组合物以及使用了它的方法 失效 - 权利终止

金属粒子分散组合物以及使用了它的方法
摘要：
本发明提供一种适用于倒装片安装法或隆起焊盘形成法中的组合物，其包括第一成分(3a)、第二成分(3b)、金属粒子(1，1’)及对流添加剂。在第二成分(3a)中，分散有金属粒子(1，1’)，并且含有对流添加剂。至少一部分的金属粒子(1)内置有第一成分(3a)，当因加热而使金属粒子(1)熔融时，第一成分(3a)与第二成分(3b)即接触而开始热硬化树脂(3c)的形成。另外，对流添加剂因被加热而产生气体，在组合物的内部产生对流。
摘要（英）：

A flip chip mounting process wherein a semiconductor chip and a circuit substrate are electrically interconnected. The process includes the steps of preparing a semiconductor chip on which a first plurality of electrodes are formed and a circuit substrate on which a second plurality of electrodes are formed; supplying a composition onto a surface of the circuit substrate, such surface being provided with second plurality of electrodes; bringing the semiconductor chip into contact with a surface of said composition such that the first plurality of electrodes are opposed to the second plurality of electrodes; and heating the circuit substrate, and thereby electrical connections including a metal component constituting the metal particles dispersed in the composition are formed between the first plurality of electrodes and the second plurality of electrodes. Also, a thermoset resin layer is formed between the semiconductor chip and the circuit substrate.

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