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公开(公告)号：US11552390B2
公开(公告)日：2023-01-10
申请号：US16564626
申请日：2019-09-09
Applicant: Rogers Corporation
Inventor： Murali Sethumadhavan , Michael S. White , Gianni Taraschi , Kristi Pance
Abstract: An electromagnetic device includes: an electrically conductive ground structure; at least one dielectric resonator antenna (DRA) disposed on the ground structure; at least one electromagnetic (EM) beam shaper disposed proximate a corresponding one of the DRA; and, at least one signal feed disposed electromagnetically coupled to a corresponding one of the DRA. The at least one EM beam shaper having: an electrically conductive horn; a body of dielectric material having a dielectric constant that varies across the body of dielectric material in a specific direction; or, both the electrically conductive horn and the body of dielectric material.
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公开(公告)号：US11355855B2
公开(公告)日：2022-06-07
申请号：US16504669
申请日：2019-07-08
Applicant: Viasat, Inc.
Inventor： Anders Jensen , Dominic Q. Nguyen , Donald L. Runyon
Abstract: A waveguide architecture for a dual-polarized antenna including multiple antenna elements. Aspects are directed to dual-polarized antenna architectures where each antenna element includes a polarizer having an individual waveguide with dual-polarization signal propagation and divided waveguides associated with each basis polarization. The waveguide architecture may include unit cells having corporate waveguide networks associated with each basis polarization connecting each divided waveguide of the polarizers of each antenna element in the unit cell with a respective common waveguide. The waveguide networks may have waveguide elements located within the unit-cell boundary with a small or minimized inter-element distance. Thus, unit cells may be positioned adjacent to each other in a waveguide device assembly for a dual-polarized antenna array without increased inter-element distance between antenna elements of adjacent unit cells. Antenna waveguide ports may be connected to unit cell common waveguides using elevation and azimuth waveguide networks of the corporate type.
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公开(公告)号：US11223138B2
公开(公告)日：2022-01-11
申请号：US16424951
申请日：2019-05-29
Applicant: The Boeing Company
Inventor： John E. Rogers
Abstract: An apparatus may include a substrate assembly having a first side and a second side. The apparatus may further include a waveguide antenna element positioned on the first side of the substrate assembly. The apparatus may also include a first reference ground plane positioned on the first side of the substrate assembly and enclosing the waveguide antenna. The apparatus may include a stripline positioned within the substrate assembly. The apparatus may further include a second reference ground plane positioned on the second side of the substrate assembly.
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公开(公告)号：US20210391638A1
公开(公告)日：2021-12-16
申请号：US17458911
申请日：2021-08-27
Applicant: Intel Corporation
Inventor： Vijay K. Nair , Digvijay Ashokkumar Raorane
IPC: H01Q1/22 , H01L21/48 , H01L23/13 , H01L23/538 , H01L23/66 , H01L23/00 , H01L25/065 , H01Q13/00
Abstract: Generally discussed herein are systems, devices, and methods that include a communication cavity. According to an example a device can include substrate with a first cavity formed therein, first and second antennas exposed in and enclosed by the cavity, and an interconnect structure formed in the substrate, the interconnect structure including alternating conductive material layers and inter-layer dielectric layers.
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公开(公告)号：US11095014B2
公开(公告)日：2021-08-17
申请号：US16735884
申请日：2020-01-07
Applicant: Aptiv Technologies Limited
Inventor： Scott D. Brandenburg , David W. Zimmerman , Shawn Shi
Abstract: An illustrative example embodiment of an antenna device includes a substrate, a plurality of antenna elements supported on the substrate, an integrated circuit supported on one side of the substrate, and a metallic waveguide antenna situated against the substrate. The metallic waveguide antenna includes a heat dissipation portion in a thermally conductive relationship with the integrated circuit. The heat dissipation portion is configured to reduce a temperature of the integrated circuit.
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公开(公告)号：US10673147B2
公开(公告)日：2020-06-02
申请号：US15802320
申请日：2017-11-02
Applicant: Benjamin Sikes , Erik Shipton , David Levesque , Mohsen Sazegar , Ryan Stevenson , Chris M. Eylander
Inventor： Benjamin Sikes , Erik Shipton , David Levesque , Mohsen Sazegar , Ryan Stevenson , Chris M. Eylander
Abstract: Antennas such as flat panel, leaky wave antennas with directional coupler feeds and waveguides are disclosed. In one example, an antenna includes a surface having antenna elements, a guided wave transmission line, and a coupling surface. The guided wave transmission line provides a guided feed wave. The coupling surface is between and separates the guided wave transmission line and the surface having antenna elements. The coupling surface controls coupling of the guided feed wave to the antenna elements. The coupling surface can also spatially filter the guided feed wave to provide a more uniform power density for the antenna elements. The guided feed wave can be a high power density electromagnetic wave or a density radially decaying electromagnetic wave.
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公开(公告)号：US10651564B2
公开(公告)日：2020-05-12
申请号：US16241194
申请日：2019-01-07
Applicant: AT&T Intellectual Property I, L.P.
Inventor： Paul Shala Henry , Robert Bennett , Irwin Gerszberg , Farhad Barzegar , Donald J. Barnickel , Thomas M. Willis, III
Abstract: Aspects of the subject disclosure may include, for example, a waveguide including a plurality of devices that facilitate generating scattered electromagnetic waves from electromagnetic waves propagating on a surface of a transmission medium. The scattered electromagnetic waves combine to generate a wireless signal having a directionality based on a separation between plurality of devices and a wavelength of the electromagnetic waves. Other embodiments are disclosed.
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公开(公告)号：US10608316B2
公开(公告)日：2020-03-31
申请号：US15584919
申请日：2017-05-02
Applicant: Hamid Moheb , Arpita Soni , Kyle Williamson
Inventor： Hamid Moheb , Arpita Soni , Kyle Williamson
IPC: H01Q1/12 , H01Q13/00 , F16M11/10 , F16M11/20 , F24S30/425
Abstract: According to an aspect, an antenna mount includes a pole canister and an assembly. The assembly includes a first bracket coupled in a fixed position to the pole canister. The assembly also includes a second bracket coupled to the first bracket at a pivot. The assembly also includes a third bracket movably coupled to the second bracket. The assembly further includes a first cam adapted to pivot the second bracket about the pivot in relation to the first bracket along a horizontal axis. The assembly also includes a second cam adapted to slide the third bracket in relation to the second bracket.
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公开(公告)号：US10566700B2
公开(公告)日：2020-02-18
申请号：US15804063
申请日：2017-11-06
Applicant: CommScope Technologies LLC
Inventor： Ronald J. Brandau
Abstract: In one embodiment, a sub-reflector assembly for a reflector antenna has (i) a waveguide transition at a waveguide end of the sub-reflector assembly and configured to fit within a waveguide, (ii) a dielectric radiator connected to the waveguide transition and extending both laterally and back towards the waveguide end of the sub-reflector assembly, and (iii) a sub-reflector connected to the dielectric radiator. By configuring the dielectric radiator to extend both laterally and back towards the dielectric end of the assembly, radiated energy from the waveguide is directed such that the sub-reflector assembly can be used with shallow reflector dishes (e.g., F/D ratio greater than 0.25) and still achieve sufficiently high directivity.
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公开(公告)号：US20200021007A1
公开(公告)日：2020-01-16
申请号：US16335535
申请日：2016-09-26
Applicant: Intel IP Corporation
Inventor： Vijay K. Nair , Digvijay Ashokkumar Raorane
IPC: H01Q1/22 , H01L23/538 , H01L23/66 , H01L23/13 , H01L25/065 , H01L21/48 , H01L23/00 , H01Q13/00
Abstract: Generally discussed herein are systems, devices, and methods that include a communication cavity. According to an example a device can include substrate with a first cavity formed therein, first and second antennas exposed in and enclosed by the cavity, and an interconnect structure formed in the substrate, the interconnect structure including alternating conductive material layers and inter-layer dielectric layers.
