公开(公告)号：US20100027220A1

公开(公告)日：2010-02-04

申请号：US12535272

申请日：2009-08-04

申请人： Phillip N. Hughes ,  Robert J. Lipps

发明人： Phillip N. Hughes ,  Robert J. Lipps

IPC分类号： H05K7/20

CPC分类号： H05K7/20318 ,  H01L2924/0002 ,  H05K7/20445 ,  H05K7/2049 ,  H05K7/20509 ,  H01L2924/00

摘要： Various embodiments disclose a system and an associated method to provide cooling to a plurality of electronic components mounted proximately to one another in an electronic enclosure is disclosed. The system comprises a cold plate that is mounted on the electronic enclosure to conduct heat thermally. The cold plate has a first surface to mount proximate to the plurality of electronic components and a second surface to mount distal from the plurality of electronic components. One or more heat risers are configured to be thermally coupled between the first surface of the cold plate and at least one of the plurality of electronic components.

摘要翻译： 公开了一种系统和相关方法，用于向电子外壳中彼此靠近安装的多个电子部件提供冷却。 该系统包括安装在电子外壳上以便热传导热量的冷板。 冷板具有靠近多个电子部件安装的第一表面，以及远离多个电子部件安装的第二表面。 一个或多个热提升管被配置为热耦合在冷板的第一表面和多个电子部件中的至少一个之间。

公开(公告)号：US08000103B2

公开(公告)日：2011-08-16

申请号：US12339583

申请日：2008-12-19

申请人： Robert J. Lipp ,  Phillip P. Hughes

发明人： Robert J. Lipp ,  Phillip P. Hughes

IPC分类号： H05K7/20 ,  G06F1/20

CPC分类号： F28D15/0266 ,  F28D1/05316 ,  F28D15/00 ,  F28D2021/0031 ,  F28F9/002 ,  F28F2255/02 ,  F28F2275/08 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K7/20818 ,  H01L2924/00

摘要： Various embodiments disclose a system and method to provide cooling to electronic components, such as electronic modules or the like. The system includes one or more cold plates that are configured to be thermally coupled to one or more of the electronic components. Internally, each of the cold plates has a cooling fluid flowing inside of at least one passageway. The cooling fluid thus removes heat from the electronic components primarily by conductive heat transfer. An input and an output header are attached to opposite ends of the passageway to allow entry and exit of the cooling fluid. The input and output headers are attached to an external system to circulate the cooling fluid.

摘要翻译： 各种实施例公开了向电子部件（例如电子模块等）提供冷却的系统和方法。 该系统包括被配置为热耦合到一个或多个电子部件的一个或多个冷板。 在内部，每个冷板具有在至少一个通道内流动的冷却流体。 因此，冷却流体主要通过导电热传递从电子部件移除热量。 输入和输出头部附接到通道的相对端，以允许冷却流体的进入和离开。 输入和输出接头连接到外部系统以使冷却液循环。

公开(公告)号：US08270170B2

公开(公告)日：2012-09-18

申请号：US12535272

申请日：2009-08-04

申请人： Phillip N. Hughes ,  Robert J. Lipps

发明人： Phillip N. Hughes ,  Robert J. Lipps

IPC分类号： H05K7/20

CPC分类号： H05K7/20318 ,  H01L2924/0002 ,  H05K7/20445 ,  H05K7/2049 ,  H05K7/20509 ,  H01L2924/00

摘要： Various embodiments disclose a system and an associated method to provide cooling to a plurality of electronic components mounted proximately to one another in an electronic enclosure is disclosed. The system comprises a cold plate that is mounted on the electronic enclosure to conduct heat thermally. The cold plate has a first surface to mount proximate to the plurality of electronic components and a second surface to mount distal from the plurality of electronic components. One or more heat risers are configured to be thermally coupled between the first surface of the cold plate and at least one of the plurality of electronic components.

摘要翻译： 公开了一种系统和相关方法，用于向电子外壳中彼此靠近安装的多个电子部件提供冷却。 该系统包括安装在电子外壳上以便热传导热量的冷板。 冷板具有靠近多个电子部件安装的第一表面，以及远离多个电子部件安装的第二表面。 一个或多个热提升管被配置为热耦合在冷板的第一表面和多个电子部件中的至少一个之间。