公开(公告)号：US20090278798A1

公开(公告)日：2009-11-12

申请号：US11828463

申请日：2007-07-26

Applicant: Young-Seok Kim ,  Thenkurussi Kesavadas

Inventor： Young-Seok Kim ,  Thenkurussi Kesavadas

IPC: G06F3/033

CPC classification number: G06F3/0346 ,  G06F3/011 ,  G06F3/014 ,  G06F3/016 ,  G06F3/017 ,  G06F2203/0331

Abstract: A finger-mounted implement including a kinesthetic sensor, at least one tactile sensor, and means for securing the kinesthetic sensor and the at least one tactile sensor to a fingertip. The tactile sensor may be a thin-film force transducer, a piezoelectric accelerometer, or a combination thereof. An artificial fingernail may be connected to the accelerometer. The kinesthetic sensor may include a magnetic transducer and may sense an X-Y-Z position and an angular orientation of a fingertip to which the kinesthetic sensor is secured. The securing means may include at least one means selected from the group consisting of adhesive tape, an elastically deformable cover, and detachable adhesive. The implement can be further connected to a computer processing system for, amongst other things, the virtual representation of sensed objects. The implement can also be used as part of a method of haptic sensing of objects.

Abstract translation: 一种手指式工具，其包括运动感应传感器，至少一个触觉传感器，以及用于将感觉传感器和至少一个触觉传感器固定到指尖的装置。 触觉传感器可以是薄膜力传感器，压电加速度计或其组合。 人造指甲可以连接到加速度计。 动觉传感器可以包括磁换能器，并且可以感测X-Y-Z位置和固定感觉传感器的指尖的角度定向。 固定装置可以包括从粘合带，可弹性变形的盖和可拆卸粘合剂组成的组中选择的至少一种装置。 该装置可以进一步连接到计算机处理系统，用于除其他之外，感测对象的虚拟表示。 该工具还可以用作触觉感测物体的方法的一部分。

公开(公告)号：US20140347776A1

公开(公告)日：2014-11-27

申请号：US14351321

申请日：2012-08-20

Applicant: Hyeok-Hwi Na ,  Young-Seok Kim ,  Sang-Hoon Ahn ,  Sung-Beum Park ,  Seung-Wook Park ,  Hyun-Mok Cho ,  Sun-Bok Park ,  Jae-Goo Park ,  Ho-Suk Hwang

Inventor： Hyeok-Hwi Na ,  Young-Seok Kim ,  Sang-Hoon Ahn ,  Sung-Beum Park ,  Seung-Wook Park ,  Hyun-Mok Cho ,  Sun-Bok Park ,  Jae-Goo Park ,  Ho-Suk Hwang

IPC: H02J7/00 ,  H02H7/18 ,  H02H3/08 ,  H02H1/00

CPC classification number: H02J7/0029 ,  H01L2224/48145 ,  H01L2224/49111 ,  H01L2924/19105 ,  H01M2/0217 ,  H01M2/0473 ,  H01M2/34 ,  H01M10/0525 ,  H01M10/4257 ,  H01M2010/4271 ,  H01M2200/00 ,  H01M2200/103 ,  H01M2200/106 ,  H02H1/0038 ,  H02H3/085 ,  H02H7/18 ,  Y02P70/54 ,  H01L2924/00012

Abstract: The present invention pertains to a package module of a battery protection circuit, and the package module of the battery protection circuit according to the present invention comprises: a first internal connection terminal area and a second internal connection terminal area, which are respectively disposed at both edge parts thereof, and in which first and second internal connection terminals connected to a battery can provided with a bare cell are respectively disposed; an external connection terminal area, which is adjacent to the first internal connection terminal area, and in which a plurality of external connection terminals are disposed; and a protection circuit area comprising a device area in which a plurality of passive devices forming the battery protection circuit are disposed and a chip area, which is adjacent to the device area, and in which a protection IC and a dual FET chip forming the battery protection circuit are disposed, are disposed between the external connection terminal area and the second internal connection terminal area, and has a packaged structure to expose the plurality of external connection terminals on the upper surface thereof and expose the first internal connection terminal and the second internal connection terminal on the lower surface thereof. According to the present invention, a manufacturing process is minimized when compared with existing methods requiring a separate module manufacturing process, and a battery pack is easily formed and is able to be miniaturized and integrated.

Abstract translation: 本发明涉及电池保护电路的封装模块，根据本发明的电池保护电路的封装模块包括：第一内部连接端子区域和第二内部连接端子区域，分别设置在两个 分别设置有与电池连接的第一和第二内部连接端子可以设置有裸电池的边缘部分， 外部连接端子区域，与第一内部连接端子区域相邻，并且其中设置有多个外部连接端子; 以及保护电路区域，包括其中设置有形成电池保护电路的多个无源器件的器件区域和与器件区域相邻的芯片区域，并且其中形成电池的保护IC和双FET芯片 保护电路设置在外部连接端子区域和第二内部连接端子区域之间，并且具有用于暴露其上表面上的多个外部连接端子的封装结构，并露出第一内部连接端子和第二内部连接端子 连接端子在其下表面。 根据本发明，与需要单独的模块制造工艺的现有方法相比，制造工艺最小化，并且电池组容易形成并且能够被小型化和集成。

公开(公告)号：US08565813B2

公开(公告)日：2013-10-22

申请号：US13150523

申请日：2011-06-01

Applicant: Young-Seok Kim

Inventor： Young-Seok Kim

IPC: H04W88/06

CPC classification number: H03F3/24 ,  H03F1/56 ,  H03F3/189 ,  H03F2200/387

Abstract: A transmission apparatus and a method thereof in a mobile terminal are provided. More particularly, an apparatus and a method for securing a space of a mobile terminal and reducing manufacturing costs by integrating power amplifying units into one module in the mobile terminal that supports a multi-mode are provided. The power amplifier of a mobile terminal includes a first amplifying unit and a second amplifying unit. The first amplifying unit defines a frequency of a GSM quad band as a low frequency band and a high frequency band, and then amplifies a signal of the low frequency band of the GSM quad band. The second amplifying unit amplifies a signal of the high frequency band of the GSM quad band and a signal of a TD-SCDMA band.

Abstract translation: 提供了一种移动终端中的发送装置及其方法。 更具体地，提供了一种用于通过将功率放大单元集成到支持多模式的移动终端中的一个模块中来确保移动终端的空间并降低制造成本的装置和方法。 移动终端的功率放大器包括第一放大单元和第二放大单元。 第一放大单元将GSM四频带的频率定义为低频带和高频带，然后放大GSM四频带的低频带的信号。 第二放大单元放大GSM四频带的高频信号和TD-SCDMA频带的信号。

公开(公告)号：US08441992B2

公开(公告)日：2013-05-14

申请号：US12286196

申请日：2008-09-29

Applicant: Eui-Seok Hwang ,  Jeong-Jae Won ,  Young-Seok Kim ,  Su-Won Lee ,  Xiaoyu Liu

Inventor： Eui-Seok Hwang ,  Jeong-Jae Won ,  Young-Seok Kim ,  Su-Won Lee ,  Xiaoyu Liu

IPC: H04W4/00

CPC classification number: H04W36/04

Abstract: A broadband wireless communication system is provided. An apparatus for an information server (IS) comprises an event module for determining whether updating the network information of at least one access network (AN) is needed, a generator module for generating at least one Information_Get_Request packet for requesting the network information of the at least one AN when the updating is needed, a communication module for transmitting at least one Information_Get_Request packet to the at least one AN, and a database (DB) module for storing network information within an Information_Get_Response packet received from the at least one AN.

公开(公告)号：US08324571B2

公开(公告)日：2012-12-04

申请号：US12713261

申请日：2010-02-26

Applicant: Young-Seok Kim ,  Jong-Sun Peak ,  Young-Nam Kim ,  Hyung-Suk Cho ,  Sun-Jin Kang ,  Bu-Dl Yoo

Inventor： Young-Seok Kim ,  Jong-Sun Peak ,  Young-Nam Kim ,  Hyung-Suk Cho ,  Sun-Jin Kang ,  Bu-Dl Yoo

IPC: G01N23/20

CPC classification number: H01L22/20 ,  H01L22/12

Abstract: An apparatus for measuring a semiconductor device is provided. The apparatus includes a beam emitter configured to irradiate an electron beam onto a sample having the entire region composed of a critical dimension (CD) region, which is formed by etching or development, and a normal region connected to the CD region, and an analyzer electrically connected to the beam emitter, and configured to select and set a wavelength range of a region in which a difference in reflectance between the CD region and the normal region occurs, after obtaining reflectance from the electron beam reflected by a surface of the sample according to the wavelength of the electron beam. A method of measuring a semiconductor device using the measuring apparatus is also provided. Therefore, it is possible to minimize a change in reflectance due to the thickness and properties of the semiconductor device, and set a wavelength range to monitor a specific wavelength, thereby accurately measuring and analyzing a CD value of a measurement part of the semiconductor device.

Abstract translation: 提供了一种用于测量半导体器件的设备。 该装置包括：射束发射器，被配置为将电子束照射到具有由蚀刻或显影形成的临界尺寸（CD）区域和连接到CD区域的法线区域构成的整个区域的样品上;以及分析器 电连接到射束发射器，并且被配置为在从由样品表面反射的电子束获得反射率之后，选择和设置发生CD区域和法线区域之间的反射率差的区域的波长范围， 到电子束的波长。 还提供了使用测量装置测量半导体器件的方法。 因此，可以使半导体器件的厚度和特性的反射率变化最小化，并且设定波长范围来监视特定波长，从而精确地测量和分析半导体器件的测量部分的CD值。

公开(公告)号：US08134709B2

公开(公告)日：2012-03-13

申请号：US12277346

申请日：2008-11-25

Applicant: Jong-Sun Peak ,  Young-Seok Kim

Inventor： Jong-Sun Peak ,  Young-Seok Kim

IPC: G01B11/00

CPC classification number: G03F9/7046 ,  H01L23/544 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2924/0002 ,  H01L2924/00

Abstract: In a method of aligning a substrate, a first alignment mark in a single shot region on the substrate may be identified. A second alignment mark in the single shot region may be selectively identified in accordance with the identification of the first alignment mark. The substrate may then be aligned using identified any one of the first alignment mark and the second alignment mark. Thus, although the substrate may be accurately aligned, the accurately aligned substrate may not be determined to be misaligned.

Abstract translation: 在对准衬底的方法中，可以识别衬底上的单次注射区域中的第一对准标记。 可以根据第一对准标记的识别来选择性地识别单个拍摄区域中的第二对准标记。 然后可以使用标识的第一对准标记和第二对准标记中的任何一个来对准衬底。 因此，尽管衬底可以精确对准，但是可能不会确定精确对准的衬底不对准。

公开(公告)号：US20120008144A1

公开(公告)日：2012-01-12

申请号：US13237509

申请日：2011-09-20

Applicant: Young-Seok Kim ,  Jong-Sun Peak

Inventor： Young-Seok Kim ,  Jong-Sun Peak

IPC: G01B11/00

CPC classification number: G03F9/7046 ,  H01L23/544 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2924/0002 ,  H01L2924/00

Abstract: In a method of aligning a substrate, a first alignment mark and a second alignment mark in a first shot region on the substrate may be sequentially identified. The substrate may be primarily aligned using identified any one of the first alignment mark and the second alignment mark. A used alignment mark and an unused alignment mark during the primary alignment process of the first alignment mark and the second alignment mark in a second shot region on the substrate may be sequentially identified. The substrate may be secondarily aligned using identified any one of the used alignment mark and the unused alignment mark during the primary alignment process. Thus, a time for identifying the alignment mark may be reduced.

Abstract translation: 在对准衬底的方法中，可以顺序地识别衬底上的第一射出区域中的第一对准标记和第二对准标记。 可以使用所识别的第一对准标记和第二对准标记中的任一个来主要对准衬底。 可以顺序地识别在基板上的第二照射区域中的第一对准标记和第二对准标记的主对准处理期间使用的对准标记和未使用的对准标记。 可以在主对准过程期间使用所使用的对准标记和未使用的对准标记中的任何一个来二次对准衬底。 因此，可以减少用于识别对准标记的时间。

公开(公告)号：US08050231B2

公开(公告)日：2011-11-01

申请号：US11975707

申请日：2007-10-19

Applicant: Eui-Seok Hwang ,  Jeong-Jae Won ,  Su-Won Lee ,  Xiaoyu Liu ,  Young-Seok Kim ,  Jong-Ho Bang ,  Jae-Young Kim

Inventor： Eui-Seok Hwang ,  Jeong-Jae Won ,  Su-Won Lee ,  Xiaoyu Liu ,  Young-Seok Kim ,  Jong-Ho Bang ,  Jae-Young Kim

IPC: H04W36/00

CPC classification number: H04W36/005 ,  H04W36/04

Abstract: Vertical handover apparatus and method in a wireless communication system are provided. The method includes examining whether there exists an accessible target network while communicating with a serving network; when there exists the accessible target network, linking up to the target network; changing a communication state to an idle mode by de-registering the linked target network; and performing a network re-entry to the target network in a vertical handover to the target network. When the terminal can execute the vertical handover without the seamless service support and reduce the handover delay.

Abstract translation: 提供了一种无线通信系统中的垂直切换装置和方法。 该方法包括在与服务网络通信时检查是否存在可访问目标网络; 当存在可访问目标网络时，链接到目标网络; 通过取消注册链接的目标网络将通信状态改变为空闲模式; 以及在到目标网络的垂直切换中执行到目标网络的网络重新进入。 当终端可以执行垂直切换而无需无缝服务支持，并减少切换延迟。

公开(公告)号：US07864786B2

公开(公告)日：2011-01-04

申请号：US11190415

申请日：2005-07-27

Applicant: Jong-Hun Lee ,  Young-Seok Kim ,  Do-In Choi

Inventor： Jong-Hun Lee ,  Young-Seok Kim ,  Do-In Choi

IPC: H04L12/28 ,  H04L12/56 ,  H04J3/16 ,  H04J3/22

CPC classification number: H04L12/46

Abstract: Disclosed is an Ethernet-IEEE 1394 repeater apparatus as a network transmission equipment for connecting between networks having the same or different protocols is disclosed. The apparatus includes a first protocol physical element for performing a modulation/demodulation process of a first protocol data; a second protocol physical element for performing a modulation/demodulation process of a second protocol data; an output interface for outputting the data through an output transmission, media; a first switch for switching the data input to one of the first protocol physical element and the second protocol physical element; a second switch, tuned with the first switch, for switching an output path to one of the first protocol physical element and the second protocol physical element, the output path being connected to the output interface; and a control unit for receiving a protocol information of data sent from one of the first protocol physical element and the second protocol physical element to control the first switch and the second switch based on the received protocol information, the one being selectively connected based on the current switching condition.

Abstract translation: 公开了作为用于连接具有相同或不同协议的网络之间的网络传输设备的以太网-IEEE 1394中继器装置。 该装置包括用于执行第一协议数据的调制/解调处理的第一协议物理元件; 用于执行第二协议数据的调制/解调处理的第二协议物理元件; 输出接口，用于通过输出传输，媒体输出数据; 用于将数据输入切换到第一协议物理元件和第二协议物理元件之一的第一开关; 用第一开关调谐的第二开关，用于将输出路径切换到第一协议物理元件和第二协议物理元件之一，输出路径连接到输出接口; 以及控制单元，用于接收从所述第一协议物理元件和所述第二协议物理元件之一发送的数据的协议信息，以基于所接收的协议信息来控制所述第一交换机和所述第二交换机，所述协议信息基于所述协议信息被选择性地连接 当前开关条件。

公开(公告)号：US07629217B2

公开(公告)日：2009-12-08

申请号：US11107529

申请日：2005-04-15

Applicant: Jung-Hwan Kim ,  Hun-Hyeoung Leam ,  Jai-Dong Lee ,  Young-Seok Kim ,  Young-Sub You ,  Ki-Su Na ,  Woong Lee

Inventor： Jung-Hwan Kim ,  Hun-Hyeoung Leam ,  Jai-Dong Lee ,  Young-Seok Kim ,  Young-Sub You ,  Ki-Su Na ,  Woong Lee

IPC: H01L21/8242

CPC classification number: H01L27/11521 ,  H01L27/115

Abstract: In a method of manufacturing a floating gate of a non-volatile semiconductor memory, a pattern is formed on a substrate to have an opening that exposes a portion of the substrate. A first preliminary polysilicon layer is formed on the pattern and the exposed portion of the substrate to substantially fill the opening. A first polysilicon layer is formed by partially etching the first preliminary polysilicon layer until a first void formed in the first preliminary polysilicon layer is exposed. A second polysilicon layer is formed on the first polysilicon layer.

Abstract translation: 在制造非易失性半导体存储器的浮置栅极的方法中，在衬底上形成图案以具有露出衬底的一部分的开口。 在图案和基板的暴露部分上形成第一初步多晶硅层以基本上填充开口。 通过部分地蚀刻第一初步多晶硅层直到形成在第一初步多晶硅层中的第一空穴露出来形成第一多晶硅层。 在第一多晶硅层上形成第二多晶硅层。