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公开(公告)号：US20150288000A1
公开(公告)日：2015-10-08
申请号：US14742611
申请日：2015-06-17
Applicant: Velocys, Inc.
Inventor： Richard Q. Long , Francis Daly , Haibiao Chen , Terry J. Mazanec
CPC classification number: H01M4/8652 , C23C18/1662 , C23C18/1692 , C23C18/44 , H01M4/8621 , H01M4/8825 , H01M4/9016 , H01M4/9041 , H01M4/92 , Y10T428/24612
Abstract: A new electroless plating approach to generate a porous metallic coating is described in which a metal is electrolessly deposited on a surface. Microparticles in the metal are removed to leave pores in the metal coating. Another method of forming electroless coatings is described in which a blocking ligand is attached to the surface, followed by a second coating step. The invention includes coatings and coated apparatus formed by methods of the invention. The invention also includes catalyst structures comprising a dense substrate and a porous metal adhered to the dense substrate, which is further characterized by one or more of the specified features.
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公开(公告)号：US09893364B2
公开(公告)日：2018-02-13
申请号：US14742611
申请日：2015-06-17
Applicant: Velocys, Inc.
Inventor： Richard Q. Long , Francis Daly , Haibiao Chen , Terry J. Mazanec
CPC classification number: H01M4/8652 , C23C18/1662 , C23C18/1692 , C23C18/44 , H01M4/8621 , H01M4/8825 , H01M4/9016 , H01M4/9041 , H01M4/92 , Y10T428/24612
Abstract: A new electroless plating approach to generate a porous metallic coating is described in which a metal is electrolessly deposited on a surface. Microparticles in the metal are removed to leave pores in the metal coating. Another method of forming electroless coatings is described in which a blocking ligand is attached to the surface, followed by a second coating step. The invention includes coatings and coated apparatus formed by methods of the invention. The invention also includes catalyst structures comprising a dense substrate and a porous metal adhered to the dense substrate, which is further characterized by one or more of the specified features.
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公开(公告)号：US20150336074A1
公开(公告)日：2015-11-26
申请号：US14788876
申请日：2015-07-01
Applicant: Velocys, Inc.
Inventor： Anna Lee Tonkovich , Kai Tod Paul Jarosch , Jeffrey Dale Marco , Bin Yang , Sean Patrick Fitzgerald , Steven T. Perry , Thomas Yuschak , Francis P. Daly , Haibiao Chen
CPC classification number: B01F5/0646 , B01F5/0475 , B01F5/061 , B01F5/0655 , B01F13/0059 , B01J19/0093 , B01J2219/00783 , B01J2219/00835 , B01J2219/00844 , B01J2219/0086 , B01J2219/00867 , B01J2219/00873 , B01J2219/00889 , B01J2219/00905 , B01J2219/00918 , C01B3/38 , C01B2203/0233 , C01B2203/0833 , C01B2203/1041 , C01B2203/1082 , C01B2203/1241 , C07C5/48 , C07C45/38 , C07C2521/08 , C07C2523/28 , F28F3/048 , F28F13/003 , F28F2260/02 , Y02P20/582
Abstract: The disclosed technology relates to an apparatus, comprising: at least one microchannel, the microchannel comprising at least one heat transfer wall; a porous thermally conductive support in the microchannel in contact with the heat transfer wall; a catalyst or a sorption medium supported by the porous support; and a heat source and/or heat sink in thermal contact with the heat transfer wall.
Abstract translation: 所公开的技术涉及一种装置，包括：至少一个微通道，所述微通道包括至少一个传热壁; 在与所述传热壁接触的所述微通道中的多孔导热支撑件; 由多孔载体支撑的催化剂或吸附介质; 以及与传热壁热接触的热源和/或散热器。
