Abstract:
A III-V photocathode layer was bonded to a foreign transparent substrate, preferably glass, by heat treatment. The foreign substrate was selected on the basis of matching thermal expansion characteristics and transparency considerations. The photocathode layer and the foreign substrate were complimentarily shaped, preferably flat, pressed together, and then heat treated. The resulting flexibility and lowered surface tension of the substrate caused the substrate to microscopically conform to microscopic irregularities in the photocathode surface. External pressure was applied across the substrate-cathode interface to facilitate the bonding process. The time required to complete the bonding depended on the pressure and temperature of the heat treating step. An optional silicon dioxide passivating layer was provided between the photocathode layer and the substrate to prevent diffusion into the photocathode of poisonous substances commonly found in glass which are detrimental to the operation of the cathode.