Iii-v photocathode bonded to a foreign transparent substrate
    1.
    发明授权
    Iii-v photocathode bonded to a foreign transparent substrate 失效
    III-V光电子结合到外部透明基板

    公开(公告)号:US3769536A

    公开(公告)日:1973-10-30

    申请号:US3769536D

    申请日:1972-01-28

    Inventor: ANTYPAS G KINTER M

    CPC classification number: H01J29/38 H01J40/06

    Abstract: A III-V photocathode layer was bonded to a foreign transparent substrate, preferably glass, by heat treatment. The foreign substrate was selected on the basis of matching thermal expansion characteristics and transparency considerations. The photocathode layer and the foreign substrate were complimentarily shaped, preferably flat, pressed together, and then heat treated. The resulting flexibility and lowered surface tension of the substrate caused the substrate to microscopically conform to microscopic irregularities in the photocathode surface. External pressure was applied across the substrate-cathode interface to facilitate the bonding process. The time required to complete the bonding depended on the pressure and temperature of the heat treating step. An optional silicon dioxide passivating layer was provided between the photocathode layer and the substrate to prevent diffusion into the photocathode of poisonous substances commonly found in glass which are detrimental to the operation of the cathode.

    Abstract translation: 通过热处理将III-V光电阴极层与异物透明基板,优选玻璃结合。 在匹配的热膨胀特性和透明性考虑的基础上选择异物基材。 将光电阴极层和异物基板互补成形,优选为平坦的,压在一起,然后进行热处理。 由此产生的柔性和降低的基底表面张力导致基底在显微镜上符合光电阴极表面的微观不规则。 在衬底 - 阴极界面上施加外部压力以便于接合过程。 完成粘合所需的时间取决于热处理步骤的压力和温度。 在光电阴极层和基板之间设置了可选的二氧化硅钝化层,以防止对阴极操作有害的玻璃中常见的有毒物质的光电阴极扩散。

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