公开(公告)号：US12002883B2

公开(公告)日：2024-06-04

申请号：US17578383

申请日：2022-01-18

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Tsung-Yu Yang ,  Shin-Hung Li ,  Ruei-Jhe Tsao ,  Che-Hua Chang

IPC: H01L29/786 ,  H01L29/78

CPC classification number: H01L29/7802 ,  H01L29/78618 ,  H01L29/7869

Abstract: A semiconductor device includes a semiconductor substrate, a gate structure, a first drift region, a first source/drain region, and a gate oxide layer. The gate structure and the gate oxide layer are disposed on the semiconductor substrate. The first drift region is disposed in the semiconductor substrate. The first source/drain region is disposed in the first drift region. At least a part of a first portion of the gate oxide layer is disposed between the gate structure and the semiconductor substrate in a vertical direction. A second portion of the gate oxide layer is disposed between the first portion and the first source/drain region in a horizontal direction. The second portion includes a bottom extending downwards and a first depressed top surface located above the bottom. A part of the first drift region is located under the first portion and the second portion of the gate oxide layer.

公开(公告)号：US20240339534A1

公开(公告)日：2024-10-10

申请号：US18746063

申请日：2024-06-18

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Che-Hua Chang ,  Shin-Hung Li ,  Tsung-Yu Yang ,  Ruei-Jhe Tsao

IPC: H01L29/78 ,  H01L29/10 ,  H01L29/40 ,  H01L29/423 ,  H01L29/66

CPC classification number: H01L29/7825 ,  H01L29/1095 ,  H01L29/401 ,  H01L29/42368 ,  H01L29/66704

Abstract: A semiconductor device includes a semiconductor substrate, a trench, and a gate structure. The trench is disposed in the semiconductor substrate. The gate structure is disposed on the semiconductor substrate. The gate structure includes a gate electrode, a first gate oxide layer, and a second gate oxide layer. A first portion of the gate electrode is disposed in the trench, and a second portion of the gate electrode is disposed outside the trench. The first gate oxide layer is disposed between the gate electrode and the semiconductor substrate. At least a portion of the first gate oxide layer is disposed in the trench. The second gate oxide layer is disposed between the second portion of the gate electrode and the semiconductor substrate in a vertical direction. A thickness of the second gate oxide layer is greater than a thickness of the first gate oxide layer.

公开(公告)号：US12046671B2

公开(公告)日：2024-07-23

申请号：US17569527

申请日：2022-01-06

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Che-Hua Chang ,  Shin-Hung Li ,  Tsung-Yu Yang ,  Ruei-Jhe Tsao

IPC: H01L29/78 ,  H01L29/10 ,  H01L29/40 ,  H01L29/423 ,  H01L29/66

CPC classification number: H01L29/7825 ,  H01L29/1095 ,  H01L29/401 ,  H01L29/42368 ,  H01L29/66704

Abstract: A semiconductor device includes a semiconductor substrate, a trench, and a gate structure. The trench is disposed in the semiconductor substrate. The gate structure is disposed on the semiconductor substrate. The gate structure includes a gate electrode, a first gate oxide layer, and a second gate oxide layer. A first portion of the gate electrode is disposed in the trench, and a second portion of the gate electrode is disposed outside the trench. The first gate oxide layer is disposed between the gate electrode and the semiconductor substrate. At least a portion of the first gate oxide layer is disposed in the trench. The second gate oxide layer is disposed between the second portion of the gate electrode and the semiconductor substrate in a vertical direction. A thickness of the second gate oxide layer is greater than a thickness of the first gate oxide layer.

公开(公告)号：US20240274707A1

公开(公告)日：2024-08-15

申请号：US18645366

申请日：2024-04-24

Applicant: United Microelectronics Corp.

Inventor： Tsung-Yu Yang ,  Shin-Hung Li ,  Ruei-Jhe Tsao ,  Che-Hua Chang

IPC: H01L29/78 ,  H01L29/786

CPC classification number: H01L29/7802 ,  H01L29/78618 ,  H01L29/7869

Abstract: A semiconductor device includes a semiconductor substrate, a gate structure, a first drift region, a first source/drain region, and a gate oxide layer. The gate structure and the gate oxide layer are disposed on the semiconductor substrate. The first drift region is disposed in the semiconductor substrate. The first source/drain region is disposed in the first drift region. At least a part of a first portion of the gate oxide layer is disposed between the gate structure and the semiconductor substrate in a vertical direction. A second portion of the gate oxide layer is disposed between the first portion and the first source/drain region in a horizontal direction. The second portion includes a bottom extending downwards and a first depressed top surface located above the bottom. A part of the first drift region is located under the first portion and the second portion of the gate oxide layer.

公开(公告)号：US20230197843A1

公开(公告)日：2023-06-22

申请号：US17578383

申请日：2022-01-18

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Tsung-Yu Yang ,  Shin-Hung Li ,  Ruei-Jhe Tsao ,  Che-Hua Chang

IPC: H01L29/78 ,  H01L29/786

CPC classification number: H01L29/7802 ,  H01L29/7869 ,  H01L29/78618

Abstract: A semiconductor device includes a semiconductor substrate, a gate structure, a first drift region, a first source/drain region, and a gate oxide layer. The gate structure and the gate oxide layer are disposed on the semiconductor substrate. The first drift region is disposed in the semiconductor substrate. The first source/drain region is disposed in the first drift region. At least a part of a first portion of the gate oxide layer is disposed between the gate structure and the semiconductor substrate in a vertical direction. A second portion of the gate oxide layer is disposed between the first portion and the first source/drain region in a horizontal direction. The second portion includes a bottom extending downwards and a first concave top surface located above the bottom. A part of the first drift region is located under the first portion and the second portion of the gate oxide layer.

公开(公告)号：US20230187547A1

公开(公告)日：2023-06-15

申请号：US17569527

申请日：2022-01-06

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Che-Hua Chang ,  Shin-Hung Li ,  Tsung-Yu Yang ,  Ruei-Jhe Tsao

IPC: H01L29/78 ,  H01L29/10 ,  H01L29/423 ,  H01L29/40 ,  H01L29/66

CPC classification number: H01L29/7825 ,  H01L29/401 ,  H01L29/1095 ,  H01L29/42368 ,  H01L29/66704

Abstract: A semiconductor device includes a semiconductor substrate, a trench, and a gate structure. The trench is disposed in the semiconductor substrate. The gate structure is disposed on the semiconductor substrate. The gate structure includes a gate electrode, a first gate oxide layer, and a second gate oxide layer. A first portion of the gate electrode is disposed in the trench, and a second portion of the gate electrode is disposed outside the trench. The first gate oxide layer is disposed between the gate electrode and the semiconductor substrate. At least a portion of the first gate oxide layer is disposed in the trench. The second gate oxide layer is disposed between the second portion of the gate electrode and the semiconductor substrate in a vertical direction. A thickness of the second gate oxide layer is greater than a thickness of the first gate oxide layer.