公开(公告)号：US20220333953A1

公开(公告)日：2022-10-20

申请号：US17713583

申请日：2022-04-05

Applicant: TDK CORPORATION

Inventor： Tsuyoshi UMEHARA ,  Hiraku HIRABAYASHI ,  Yongfu CAI

IPC: G01D5/16 ,  G01R33/09 ,  G01B7/00 ,  G02B7/10

Abstract: A magnetic sensor includes first to fourth resistors, a power supply port, a ground port, a first output port, and a second output port. The first resistor and the second resistor are located in a first region and connected in series via a first connection point connected to the first output port. The third resistor and the fourth resistor are located in a second region and connected in series via a second connection point connected to the second output port, at least a part of the second region being located at a position different from the first region in a direction parallel to an X direction. The first and second resistors are located between the third and fourth resistors in a direction parallel to a Y direction.

公开(公告)号：US20220208627A1

公开(公告)日：2022-06-30

申请号：US17696253

申请日：2022-03-16

Applicant: TDK Corporation

Inventor： Yongfu CAI ,  Shuhei MIYAZAKI

IPC: H01L23/29 ,  H01L21/56 ,  H01L23/00

Abstract: In an assembly in which a space between two elements is filled with a filler containing resin, a configuration that can limit both the size of the assembly and the cost of the fillers is provided. An assembly of stacked elements has: first element having first surface; resin layer that is arranged on first surface and that contains a plurality of fillers; and second element that is arranged on resin layer and that has second surface that is in contact with resin layer. In a section that is perpendicular to second surface, the average flattening ratio of fillers that are in contact with second surface is larger than the average flattening ratio of fillers that are not in contact with second surface. Here, the flattening ratio is a ratio of the maximum length of the filler in a direction parallel to second surface to the maximum thickness of the filler in a direction perpendicular to second surface.

公开(公告)号：US20210255000A1

公开(公告)日：2021-08-19

申请号：US17114664

申请日：2020-12-08

Applicant: TDK CORPORATION

Inventor： Yongfu CAI

IPC: G01D5/16 ,  G02B27/64 ,  G02B7/09 ,  G03B5/00 ,  G03B13/36 ,  G03B30/00 ,  H04N5/225

Abstract: A position detection device includes a magnetic field generator and a magnetic sensor. The magnetic field generator is configured so that a mode of variation of a direction of a target magnetic field relative to variations in a position of a lens is such that the direction of the target magnetic field varies nonlinearly relative to the variations in the position of the lens. The magnetic sensor is configured so that a mode of variation of a detection signal relative to variations in the direction of the target magnetic field is such that the detection signal varies nonlinearly relative to the variations in the direction of the target magnetic field.

公开(公告)号：US20240230376A9

公开(公告)日：2024-07-11

申请号：US18404023

申请日：2024-01-04

Applicant: TDK CORPORATION

Inventor： Keisuke UCHIDA ,  Yongfu CAI

IPC: G01D5/16

CPC classification number: G01D5/16

Abstract: A position detection device includes a magnet that generates a magnetic field to be detected, and a magnetic sensor. The magnetic sensor detects the magnetic field to be detected and generates a detection value corresponding to the position of the magnet. The magnetic field to be detected has a first direction that changes within a first plane, at a reference position in the first plane. The magnetic sensor includes four MR elements. Each of the MR elements includes a first magnetic layer having first magnetization that can change in direction within a second plane corresponding to the each of the MR elements. The first plane and the second plane intersect at a dihedral angle α other than 90°. A detection value depends on the direction of the first magnetization.

公开(公告)号：US20240019507A1

公开(公告)日：2024-01-18

申请号：US18347768

申请日：2023-07-06

Applicant: TDK CORPORATION

Inventor： Yongfu CAI

IPC: G01R33/09 ,  G01D5/14

CPC classification number: G01R33/091 ,  G01D5/142

Abstract: A magnetic sensor device includes a magnetic sensor, a die pad, and four leads. The magnetic sensor includes a bridge circuit including a plurality of arms and a plurality of pads electrically connected to the bridge circuit. One of the plurality of arms is provided between one of the plurality of pads and a different one of the plurality of pads in circuit configuration. The magnetic sensor further includes a sub-pad electrically connected between one end and another end of the one arm and also electrically connected to the die pad.

公开(公告)号：US20200294876A1

公开(公告)日：2020-09-17

申请号：US16351769

申请日：2019-03-13

Applicant: TDK Corporation

Inventor： Yongfu CAI

IPC: H01L23/29 ,  H01L43/02 ,  H01L23/552 ,  G06K7/10

Abstract: An electronic device has a function part 3, a first product information part 6 made of metal, a molded resin 11 that covers the function part 3 and the first product information part 6, and a barrier layer 8 interposed between the first product information part 6 and the molded resin 11.

公开(公告)号：US20200286802A1

公开(公告)日：2020-09-10

申请号：US16685141

申请日：2019-11-15

Applicant: TDK Corporation

Inventor： Yongfu CAI ,  Shuhei MIYAZAKI

IPC: H01L23/29 ,  H01L23/00 ,  H01L21/56

Abstract: In an assembly in which a space between two elements is filled with a filler containing resin, a configuration that can limit both the size of the assembly and the cost of the fillers is provided.Assembly 10 of stacked elements has: first element 2 having first surface 21; resin layer 61 that is arranged on first surface 21 and that contains a plurality of fillers F; and second element 4 that is arranged on resin layer 61 and that has second surface 41 that is in contact with resin layer 61. In a section that is perpendicular to second surface 41, the average flattening ratio of fillers F2 that are in contact with second surface 41 is larger than the average flattening ratio of fillers F1, F3 that are not in contact with second surface 41. Here, the flattening ratio is a ratio of the maximum length of the filler in a direction parallel to second surface 41 to the maximum thickness of the filler in a direction perpendicular to second surface 41.

公开(公告)号：US20200158794A1

公开(公告)日：2020-05-21

申请号：US16653233

申请日：2019-10-15

Applicant: TDK Corporation

Inventor： Yongfu CAI

IPC: G01R33/09 ,  G01R33/00

Abstract: A magnetic sensor capable of reducing noise caused by an interference magnetic field and capable of outputting a highly accurate signal in accordance with changes in a detected magnetic field includes a magnetic detection element, a first magnetic body having a first surface and a second surface, which is opposite to the first surface, and a second magnetic body positioned approximately in the center of the first magnetic body in the short direction on the first surface of the first magnetic body. The magnetic detection element is provided to be opposite to the second magnetic body with the first magnetic body interposed in between and positioned approximately in the center of the first magnetic body in the short direction. The magnetic sensing direction of the magnetic detection element is a direction approximately parallel to the short direction of the first magnetic body and the second magnetic body, and a width W1 of the first magnetic body is larger than a width W2 of the second magnetic body.

公开(公告)号：US20200035574A1

公开(公告)日：2020-01-30

申请号：US16407623

申请日：2019-05-09

Applicant: TDK Corporation

Inventor： Yongfu CAI ,  Shuhei MIYAZAKI ,  Kazuma YAMAWAKI

IPC: H01L23/28 ,  H01L23/498 ,  H01L23/00

Abstract: An electronic component package of an embodiment of the disclosure includes a base, a first plated layer, a first electronic component chip, a second plated layer, and a second electronic component chip. The base includes a first surface and a second surface. The first plated layer covers the first surface. The first electronic component chip is provided on the first plated layer with a first insulating layer being interposed therebetween. The second plated layer covers the second surface. The second electronic component chip is provided on the second plated layer with a second insulating layer being interposed therebetween. The first plated layer and the second plated layer each include a first metal material that is less likely to undergo an ion migration phenomenon than silver (Ag).

公开(公告)号：US20190285709A1

公开(公告)日：2019-09-19

申请号：US16356210

申请日：2019-03-18

Applicant: TDK Corporation

Inventor： Yongfu CAI ,  Toshihide SUTO

IPC: G01R33/09 ,  G01R33/00

Abstract: A magnetism detection device according to an embodiment of the disclosure includes a sensor section and a resistive section. The sensor section includes a first magnetism detection element. The first magnetism detection element has a first stacked structure and is configured to detect a magnetic field to be detected. The resistive section includes a first resistive element and is coupled to the sensor section. The first resistive element has the first stacked structure.