公开(公告)号：US20240355659A1

公开(公告)日：2024-10-24

申请号：US18758239

申请日：2024-06-28

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Wei-Chih CHEN ,  Shi-Chi CHEN ,  Ting-Wei WANG ,  Jen-Ti WANG ,  Kuo-Fong CHUANG

IPC: H01L21/677 ,  H01L21/67

CPC classification number: H01L21/67733 ,  H01L21/67259 ,  H01L21/67706

Abstract: A method includes moving a wafer transport device on a transport rail, wherein the wafer transport device comprises a hoist unit configured to grip a wafer container unit; stopping the wafer transport device above a load port; after stopping the wafer transport device, reading data of a rail mark located on the transport rail; aligning an orientation of the wafer transport device according to the data of the rail mark; after aligning the orientation of the wafer transport device according to the data of the rail mark, aligning the wafer transport device with respect to a top surface of the load port; after aligning the wafer transport device with respect to the top surface of the load port, lowering the hoist unit.

公开(公告)号：US20220285190A1

公开(公告)日：2022-09-08

申请号：US17748932

申请日：2022-05-19

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Wei-Chih CHEN ,  Shi-Chi CHEN ,  Ting-Wei WANG ,  Jen-Ti WANG ,  Kuo-Fong CHUANG

IPC: H01L21/677 ,  H01L21/67

Abstract: A method includes moving a wafer transport device to a position above a load port; lowering a hoist unit of the wafer transport device above the load port, wherein the wafer transport device has a plurality of belts, each of the belts is connected to the hoist unit and wound around a respective belt winding drum; detecting sound waves from the belts by using at least one acoustic sensor to measure tensions of the belts; and comparing the tensions from the belts to determine an inclination of the hoist unit.

公开(公告)号：US20210249297A1

公开(公告)日：2021-08-12

申请号：US16787966

申请日：2020-02-11

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Chi-Yuan CHU ,  Jen-Ti WANG ,  Wei-Chih CHEN ,  Kuo-Fong CHUANG ,  Cheng-Ho HUNG

IPC: H01L21/687 ,  H01L21/67 ,  H01L21/677

Abstract: A method of operating a transport system includes detecting an anomalous condition of a wafer transfer vehicle; sending the wafer transfer vehicle along a rail to a diagnosis station adjacent to the rail; and inspecting properties of the wafer transfer vehicle, such as a speed, a weight, an audio frequency, a noise level, a temperature, and an image of the wafer transfer vehicle, by using the diagnosis station.

公开(公告)号：US20200075378A1

公开(公告)日：2020-03-05

申请号：US16520599

申请日：2019-07-24

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Tzu-Chi CHIU ,  Jen-Ti WANG ,  Ting-Wei WANG ,  Kuo-Fong CHUANG

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/673

Abstract: A method for storage a workpiece used in fabrication of a semiconductor device includes disposing the workpiece on a workpiece carrier, disposing the workpiece carrier with the workpiece in a workpiece container via a workpiece storage system, identifying a content of the workpiece container, and adjusting a storage condition inside the workpiece container in response to the content of the workpiece container via the workpiece storage system.

公开(公告)号：US20220359252A1

公开(公告)日：2022-11-10

申请号：US17871984

申请日：2022-07-25

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Tzu-Chi CHIU ,  Jen-Ti WANG ,  Ting-Wei WANG ,  Kuo-Fong CHUANG

IPC: H01L21/677 ,  H01L21/673 ,  H01L21/67 ,  G05B15/02

Abstract: A method includes disposing, by using a transport module of a workpiece storage system, a first workpiece on a first workpiece carrier; disposing, by using the transport module, the first workpiece carrier with the first workpiece in a workpiece container; disposing, by using the transport module, a second workpiece in the workpiece container, wherein the first workpiece and the second workpiece have different sizes; and transferring, by using the transport module, the workpiece container containing the second workpiece and the first workpiece carrier with the first workpiece to a stocker to store the workpiece container.

公开(公告)号：US20220328330A1

公开(公告)日：2022-10-13

申请号：US17842340

申请日：2022-06-16

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Chi-Yuan CHU ,  Jen-Ti WANG ,  Wei-Chih CHEN ,  Kuo-Fong CHUANG ,  Cheng-Ho HUNG

IPC: H01L21/67 ,  H01L21/677

Abstract: A method of operating a transport system includes detecting an anomalous condition of a wafer transfer vehicle; sending the wafer transfer vehicle along a rail to a diagnosis station adjacent to the rail; and inspecting properties of the wafer transfer vehicle, such as a speed, a weight, an audio frequency, a noise level, a temperature, and an image of the wafer transfer vehicle, by using the diagnosis station.

公开(公告)号：US20200176294A1

公开(公告)日：2020-06-04

申请号：US16683998

申请日：2019-11-14

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Wei-Chih CHEN ,  Shi-Chi CHEN ,  Ting-Wei WANG ,  Jen-Ti WANG ,  Kuo-Fong CHUANG

IPC: H01L21/677 ,  H01L21/67

Abstract: A wafer transport device is moved on a transport rail, and stopped above a load port having a top surface. A light beam is projected onto the top surface of the load port, and image of the top surface is and the light beam is captured. A position of the hoist unit of the wafer transport device is aligned with respect to a position of the load port according to the image. The hoist unit is lowered toward the load port.

公开(公告)号：US20200105557A1

公开(公告)日：2020-04-02

申请号：US16217907

申请日：2018-12-12

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Chao-Hsiung YEH ,  Hsuan CHANG ,  Jen-Ti WANG ,  Chin-Tsan CHEN ,  Kuo-Fong CHUANG

IPC: H01L21/67 ,  G01B11/16

Abstract: A wafer processing tool is capable of detecting wafer warpage. The wafer processing tool includes a wafer holder on which a wafer is held and at least one sensor set. The at least one sensor set is disposed above the wafer or under the wafer, and a projection of each of the at least one sensor set on the wafer radially extending from a center of the wafer to an edge of the wafer. The at least one sensor set is configured to scan an entire surface of the wafer so as to measure warpage of the wafer while the wafer holder and the at least one sensor set are rotatable relative to each other.