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1.
公开(公告)号:US11791394B2
公开(公告)日:2023-10-17
申请号:US18053777
申请日:2022-11-09
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sangjun Yun , Uihui Kwon , Seongnam Kim , Hyoshin Ahn
CPC classification number: H01L29/4966 , H01L21/28088 , H01L29/66545 , H01L29/66795 , H01L29/7851
Abstract: Provided are metal oxide field-effect transistor (MOSFET) devices having a metal gate structure, in which a work function of the metal gate structure is uniform along a length direction of a channel, and manufacturing methods thereof. The MOSFET devices include a semiconductor substrate, an active area on the semiconductor substrate and extending in a first direction, and a gate structure on the semiconductor substrate. The gate structure extends across the active area in a second direction that traverses the first direction and comprises a high-k layer, a first metal layer, a work function control (WFC) layer, and a second metal layer, which are sequentially stacked on the active area. A lower surface of the WFC layer may be longer than a first interface between a lower surface of the first metal layer and an upper surface of the high-k layer in the first direction.
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公开(公告)号:US20190140163A1
公开(公告)日:2019-05-09
申请号:US16021708
申请日:2018-06-28
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sangjun Yun , Sang-Kuk Kim , Jae Hoon Kim , Eunsun Noh , Se Chung Oh , Sung Chul Lee , Daeeun Jeong
Abstract: Magnetic memory devices are provided. A magnetic memory device includes a first electrode on a substrate, a magnetic tunnel junction pattern including a first magnetic layer, a tunnel barrier layer, and a second magnetic layer, which are sequentially stacked on the first electrode, and a second electrode on the magnetic tunnel junction pattern. A surface binding energy of the first electrode and/or the second electrode with respect to the magnetic tunnel junction pattern is relatively low.
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3.
公开(公告)号:US11522064B2
公开(公告)日:2022-12-06
申请号:US17206832
申请日:2021-03-19
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sangjun Yun , Uihui Kwon , Seongnam Kim , Hyoshin Ahn
Abstract: Provided are metal oxide field-effect transistor (MOSFET) devices having a metal gate structure, in which a work function of the metal gate structure is uniform along a length direction of a channel, and manufacturing methods thereof. The MOSFET devices include a semiconductor substrate, an active area on the semiconductor substrate and extending in a first direction, and a gate structure on the semiconductor substrate. The gate structure extends across the active area in a second direction that traverses the first direction and comprises a high-k layer, a first metal layer, a work function control (WFC) layer, and a second metal layer, which are sequentially stacked on the active area. A lower surface of the WFC layer may be longer than a first interface between a lower surface of the first metal layer and an upper surface of the high-k layer in the first direction.
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