公开(公告)号：US09620389B2

公开(公告)日：2017-04-11

申请号：US14967490

申请日：2015-12-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeong-Kyu Ha ,  Youngshin Kwon ,  KwanJai Lee ,  Jae-Min Jung ,  KyongSoon Cho ,  Sang-Uk Han

IPC: H01L23/14 ,  H01L23/498 ,  H01L21/48 ,  H05K1/11 ,  H05K3/10 ,  H01L23/00 ,  H01L23/495 ,  H05K3/00 ,  H01L21/56 ,  H01L21/78 ,  H05K1/18 ,  H05K3/42

CPC classification number: H01L21/486 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/78 ,  H01L23/145 ,  H01L23/49524 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/50 ,  H01L2924/12042 ,  H05K1/114 ,  H05K1/115 ,  H05K1/189 ,  H05K3/0052 ,  H05K3/107 ,  H05K3/42 ,  H05K2203/1545 ,  Y10T156/1052 ,  H01L2924/00

Abstract: A tape film package is provided including an insulating pattern; a via contact in a via hole in the insulating pattern; first interconnection patterns extending from the via contact to a cutting surface of the insulating pattern; and second interconnection patterns connected to the via contact below the insulating pattern. The second interconnection patterns are parallel to the first interconnection patterns and spaced apart from the cutting surface of the insulating pattern.

公开(公告)号：US09241407B2

公开(公告)日：2016-01-19

申请号：US13747832

申请日：2013-01-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeong-Kyu Ha ,  Youngshin Kwon ,  KwanJai Lee ,  Jae-Min Jung ,  KyongSoon Cho ,  Sang-Uk Han

IPC: H01L23/14 ,  H05K1/11 ,  H05K3/10 ,  H01L23/00 ,  H05K3/00 ,  H05K1/18 ,  H05K3/42

CPC classification number: H01L21/486 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/78 ,  H01L23/145 ,  H01L23/49524 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/50 ,  H01L2924/12042 ,  H05K1/114 ,  H05K1/115 ,  H05K1/189 ,  H05K3/0052 ,  H05K3/107 ,  H05K3/42 ,  H05K2203/1545 ,  Y10T156/1052 ,  H01L2924/00

Abstract: A tape film package is provided including an insulating pattern; a via contact in a via hole in the insulating pattern; first interconnection patterns extending from the via contact to a cutting surface of the insulating pattern; and second interconnection patterns connected to the via contact below the insulating pattern. The second interconnection patterns are parallel to the first interconnection patterns and spaced apart from the cutting surface of the insulating pattern.

Abstract translation: 提供包括绝缘图案的胶带包装; 绝缘图案中的通孔中的通孔接触; 从所述通孔接触延伸到所述绝缘图案的切割表面的第一互连图案; 以及连接到绝缘图案下方的通孔接点的第二互连图案。 第二互连图案平行于第一互连图案并与绝缘图案的切割表面间隔开。

公开(公告)号：US10347611B2

公开(公告)日：2019-07-09

申请号：US15406925

申请日：2017-01-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jichul Kim ,  Jae Choon Kim ,  Hansung Ryu ,  KyongSoon Cho ,  YoungSang Cho ,  Yeo-Hoon Yoon

IPC: H01L23/48 ,  H01L25/10 ,  H01L21/48 ,  H01L21/56 ,  H01L23/538 ,  H01L23/00 ,  H01L25/00 ,  H01L23/498 ,  H01L29/06

Abstract: A semiconductor package is provided which includes a redistribution substrate, an interconnect substrate on the redistribution substrate, a metal layer on the semiconductor chip, a semiconductor chip on the redistribution substrate and in the hole of the interconnect substrate, and a mold layer in a gap between the semiconductor chip and the interconnect substrate. The interconnect substrate includes a hole penetrating thereinside. The interconnect substrate includes base layers and a conductive member extending through the base layers. A top surface of the interconnect substrate is positioned either above or below the level of the top surface of the metal layer.

公开(公告)号：US20140369009A1

公开(公告)日：2014-12-18

申请号：US14291684

申请日：2014-05-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： KyongSoon Cho

IPC: H05K1/11 ,  H05K1/18

CPC classification number: H05K1/118 ,  G02F1/13452 ,  H05K1/189 ,  H05K2201/09409 ,  H05K2201/09709 ,  H05K2201/10128

Abstract: A display device includes a display panel including panel bumps, a flexible circuit film connected to the display panel and including a chip, and panel bonding leads connecting the display panel to the chip. The panel bumps include first panel bumps arranged along a first row, and second panel bumps arranged along a second row which is spaced apart from the first row toward the chip. Each second panel bump is disposed between two adjacent first panel bumps when viewed from a column direction perpendicular to a row direction. The panel bonding leads includes first panel bonding leads connected to the first panel bumps and second panel bonding leads connected to the second panel bumps. Each first panel bonding lead includes a first portion having a first thickness, and a second portion adjacent to the second panel bump having a second thickness smaller than the first thickness.

Abstract translation: 显示装置包括显示面板，包括面板凸块，连接到显示面板并包括芯片的柔性电路薄膜，以及将显示面板连接到芯片的面板接合引线。 面板凸块包括沿着第一排布置的第一面板凸块和沿着与第一行朝向芯片间隔开的第二排布置的第二面板凸块。 当从垂直于行方向的列方向观察时，每个第二面板凸块设置在两个相邻的第一面板凸块之间。 面板接合引线包括连接到第一面板凸块的第一面板接合引线和连接到第二面板凸块的第二面板接合引线。 每个第一面板接合引线包括具有第一厚度的第一部分和与第二面板凸起相邻的第二部分，其具有小于第一厚度的第二厚度。

公开(公告)号：US09468102B2

公开(公告)日：2016-10-11

申请号：US14291684

申请日：2014-05-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： KyongSoon Cho

IPC: H05K1/11 ,  H05K1/18 ,  G02F1/1345

CPC classification number: H05K1/118 ,  G02F1/13452 ,  H05K1/189 ,  H05K2201/09409 ,  H05K2201/09709 ,  H05K2201/10128

Abstract: A display device includes a display panel including panel bumps, a flexible circuit film connected to the display panel and including a chip, and panel bonding leads connecting the display panel to the chip. The panel bumps include first panel bumps arranged along a first row, and second panel bumps arranged along a second row which is spaced apart from the first row toward the chip. Each second panel bump is disposed between two adjacent first panel bumps when viewed from a column direction perpendicular to a row direction. The panel bonding leads includes first panel bonding leads connected to the first panel bumps and second panel bonding leads connected to the second panel bumps. Each first panel bonding lead includes a first portion having a first thickness, and a second portion adjacent to the second panel bump having a second thickness smaller than the first thickness.

Abstract translation: 显示装置包括显示面板，包括面板凸块，连接到显示面板并包括芯片的柔性电路薄膜，以及将显示面板连接到芯片的面板接合引线。 面板凸块包括沿着第一排布置的第一面板凸块和沿着与第一行朝向芯片间隔开的第二排布置的第二面板凸块。 当从垂直于行方向的列方向观察时，每个第二面板凸块设置在两个相邻的第一面板凸块之间。 面板接合引线包括连接到第一面板凸块的第一面板接合引线和连接到第二面板凸块的第二面板接合引线。 每个第一面板接合引线包括具有第一厚度的第一部分和与第二面板凸起相邻的第二部分，其具有小于第一厚度的第二厚度。

公开(公告)号：US09177904B2

公开(公告)日：2015-11-03

申请号：US13769520

申请日：2013-02-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae-Min Jung ,  Sang-Uk Han ,  KwanJai Lee ,  KyongSoon Cho ,  Jeong-Kyu Ha

IPC: G02F1/1343 ,  H01L23/498 ,  H01L51/52

CPC classification number: H01L25/167 ,  H01L23/49827 ,  H01L23/4985 ,  H01L27/323 ,  H01L27/3276 ,  H01L27/3288 ,  H01L51/52 ,  H01L51/524 ,  H01L2251/5338 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Chip-on-film packages and device assemblies including the same may be provided. The device assembly includes a film package including a semiconductor chip, a panel substrate connected to one end of the film package, a display panel disposed on the panel substrate, and a controlling part connected to another end of the film package. The film package includes a film substrate, a first wire disposed on a top surface of the film substrate, and a second wire disposed on a bottom surface of the film substrate.

Abstract translation: 可以提供包括其的片上胶片包装和装置组件。 该装置组件包括：薄膜封装，其包括半导体芯片，连接到薄膜封装的一端的面板基板，设置在面板基板上的显示面板，以及连接到薄膜封装的另一端的控制部件。 薄膜封装包括薄膜基板，设置在薄膜基板的顶表面上的第一布线和设置在薄膜基板的底表面上的第二布线。

公开(公告)号：US20130186680A1

公开(公告)日：2013-07-25

申请号：US13747832

申请日：2013-01-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeong-Kyu Ha ,  Youngshin Kwon ,  KwanJai Lee ,  Jae-Min Jung ,  KyongSoon Cho ,  Sang-UK Han

IPC: H05K1/11 ,  H05K3/10

CPC classification number: H01L21/486 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/78 ,  H01L23/145 ,  H01L23/49524 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/50 ,  H01L2924/12042 ,  H05K1/114 ,  H05K1/115 ,  H05K1/189 ,  H05K3/0052 ,  H05K3/107 ,  H05K3/42 ,  H05K2203/1545 ,  Y10T156/1052 ,  H01L2924/00

Abstract: A tape film package is provided including an insulating pattern; a via contact in a via hole in the insulating pattern; first interconnection patterns extending from the via contact to a cutting surface of the insulating pattern; and second interconnection patterns connected to the via contact below the insulating pattern. The second interconnection patterns are parallel to the first interconnection patterns and spaced apart from the cutting surface of the insulating pattern.

Abstract translation: 提供包括绝缘图案的胶带包装; 绝缘图案中的通孔中的通孔接触; 从所述通孔接触延伸到所述绝缘图案的切割表面的第一互连图案; 以及连接到绝缘图案下方的通孔接点的第二互连图案。 第二互连图案平行于第一互连图案并与绝缘图案的切割表面间隔开。

公开(公告)号：US10937771B2

公开(公告)日：2021-03-02

申请号：US16430428

申请日：2019-06-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jichul Kim ,  Jae Choon Kim ,  Hansung Ryu ,  KyongSoon Cho ,  YoungSang Cho ,  Yeo-Hoon Yoon

IPC: H01L23/48 ,  H01L25/10 ,  H01L21/48 ,  H01L21/56 ,  H01L23/538 ,  H01L23/00 ,  H01L25/00 ,  H01L21/683 ,  H01L23/498 ,  H01L29/06

Abstract: A semiconductor package is provided which includes a redistribution substrate, an interconnect substrate on the redistribution substrate, a metal layer on the semiconductor chip, a semiconductor chip on the redistribution substrate and in the hole of the interconnect substrate, and a mold layer in a gap between the semiconductor chip and the interconnect substrate. The interconnect substrate includes a hole penetrating thereinside. The interconnect substrate includes base layers and a conductive member extending through the base layers. A top surface of the interconnect substrate is positioned either above or below the level of the top surface of the metal layer.

公开(公告)号：US09313889B2

公开(公告)日：2016-04-12

申请号：US14262658

申请日：2014-04-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyoungsuk Yang ,  Jeong-Kyu Ha ,  PaLan Lee ,  Narae Shin ,  Soyoung Lim ,  Jae-Min Jung ,  KyongSoon Cho

IPC: H05B33/00 ,  H05K1/02 ,  H05K5/00 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18

CPC classification number: H05K1/118 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/0949 ,  H05K2201/10128

Abstract: Provided is a display apparatus. The display apparatus includes a display panel, a flexible circuit film having a rear surface connected to the display panel, and a front surface opposite to the rear surface, the front surface having a chip mounted thereon, and a first lead bonding portion electrically connecting the chip to the display panel. The first lead bonding portion includes a first portion connected to the chip and overlying a portion of the flexible circuit film, a second portion passing through the flexible circuit film, and a third portion disposed between the flexible circuit film and the display panel on the rear surface of the flexible circuit film, where the third portion overlaps the first portion.

Abstract translation: 提供了一种显示装置。 显示装置包括显示面板，具有连接到显示面板的后表面的柔性电路薄膜和与背面相对的前表面，前表面具有安装在其上的芯片，以及第一引线接合部分， 芯片到显示面板。 第一引线接合部分包括连接到芯片并覆盖柔性电路膜的一部分的第一部分，穿过柔性电路膜的第二部分和设置在柔性电路膜和后面的显示面板之间的第三部分 柔性电路膜的表面，其中第三部分与第一部分重叠。