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    Semiconductor package and method of manufacturing the semiconductor package
    4.
    发明授权
    Semiconductor package and method of manufacturing the semiconductor package 有权

    公开(公告)号：US11552038B2

    公开(公告)日：2023-01-10

    申请号：US17342902

    申请日：2021-06-09

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Gyoyoung Jung ,  Jinsu Kim ,  Hyunsuk Yang ,  Kiju Lee ,  Hoyeon Jo ,  Ikkyu Jin

    IPC: H01L23/48 ,  H01L23/00 ,  H01L25/16

    Abstract: A semiconductor package including a core substrate, a semiconductor chip in the core substrate and having chip pads, a redistribution wiring layer covering a lower surface of the core substrate and including redistribution wirings electrically connected to the chip pads and a pair of capacitor pads exposed from an outer surface of the redistribution wiring layer, conductive pastes on the capacitor pads, respectively, and a capacitor via the conductive pastes and having first and second outer electrodes on the capacitor pads, respectively, may be provided. Each of the capacitor pads includes a pad pattern exposed from the outer surface of the redistribution wiring layer, and at least one via pattern at a lower portion of the pad pattern and electrically connected to at least one of the redistribution wirings. The via pattern is eccentric by a distance from a center line of the pad pattern.

    System for performing service by using biometric information, and control method therefor
    5.
    发明授权
    System for performing service by using biometric information, and control method therefor 有权

    公开(公告)号：US11546163B2

    公开(公告)日：2023-01-03

    申请号：US17058572

    申请日：2019-05-13

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jinsu Kim ,  Junbum Shin ,  Sungwook Kim

    IPC: G06F21/00 ,  H04L9/32 ,  H04L9/08 ,  H04L9/14

    Abstract: A system for performing a service by using biometric information is disclosed. A system according to the present disclosure comprises an electronic device, a first server and a second server, and a control method of the system comprises the steps of: allowing the electronic device to acquire first biometric information; allowing the electronic device to acquire first encrypted data, in which the first biometric information is encrypted, by using the acquired first biometric information and a first encryption key, and to transmit same to the first server, allowing the first server to acquire second encrypted data, in which the first encrypted data is encrypted, by using the first encrypted data received from the electronic device and a second encrypted key, and first user identification information corresponding to the first biometric information, and to transmit same to the second server; allowing the second server to match the second encrypted data and the first user identification information corresponding to the biometric information, which are received from the first server, and to store same; allowing the second server to acquire authentication information on the basis of the matched second encrypted data and first user identification information, and to transmit same to the first server, and allowing the first server to register the authentication information on the biometric information.

    Electronic device including thermosetting bonding sheet
    6.
    发明授权
    Electronic device including thermosetting bonding sheet 有权

    公开(公告)号：US12144115B2

    公开(公告)日：2024-11-12

    申请号：US18084994

    申请日：2022-12-20

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Youngsun Lee ,  Dohyeon Kim ,  Byeongkeol Kim ,  Jinsu Kim ,  Seokjoon Park ,  Jungje Bang ,  Hoyeon Seo ,  Jongbum Lee ,  Jongmin Jeon

    IPC: H05K1/14 ,  B32B3/26 ,  B32B7/12

    Abstract: An electronic device including a thermosetting bonding sheet may include: a base substrate including a base substrate body and a plurality of base pads disposed on the base substrate body, a connection substrate including a connection substrate body facing the base substrate body, a plurality of connection pads disposed on the connection substrate body and including a pad hole, and a plurality of connection lines disposed on the connection substrate body and connected to the plurality of connection pads, a solder, at least a portion of which is inserted into the pad hole, disposed on the base pad and configured to electrically connect the base pad to the connection pad, and a thermosetting bonding sheet provided between the base substrate body and the connection substrate body, bonded to the base substrate body and the connection substrate body, and enclosing the solder.

    Semiconductor device and semiconductor package having the same
    8.
    发明授权
    Semiconductor device and semiconductor package having the same 有权

    公开(公告)号：US11670568B2

    公开(公告)日：2023-06-06

    申请号：US17029334

    申请日：2020-09-23

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Seonho Lee ,  Jinsu Kim ,  Junwoo Myung ,  Yongjin Park ,  Jaekul Lee

    IPC: H01L23/373 ,  H01L23/498 ,  H01L23/053 ,  H01L23/31

    CPC classification number: H01L23/3735 ,  H01L23/053 ,  H01L23/3128 ,  H01L23/49822

    Abstract: A semiconductor device including a semiconductor chip having a first surface and a second surface opposite to the first surface, a first heat dissipation member on the second surface of the semiconductor chip, the first heat dissipation member having a vertical thermal conductivity in a direction perpendicular to the second surface, and a horizontal thermal conductivity in a direction parallel to the second surface, the first vertical thermal conductivity being smaller than the first horizontal thermal conductivity, and a second heat dissipation member comprising a vertical pattern penetrating the first heat dissipation member, the second heat dissipation member having a vertical thermal conductivity that is greater than the vertical thermal conductivity of the first heat dissipation member may be provided.

    Electronic device and authentication method thereof
    9.
    发明授权
    Electronic device and authentication method thereof 有权

    公开(公告)号：US11605145B2

    公开(公告)日：2023-03-14

    申请号：US16362050

    申请日：2019-03-22

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Kyungsun Cho ,  Jinsu Kim ,  Junbum Shin

    IPC: G06Q50/26 ,  G06Q50/00 ,  G06N20/00 ,  H04L9/40

    Abstract: An electronic device is provided. The electronic device includes a camera, a memory configured to store a model learned to determine whether a user performing authentication for a financial service is in a threat situation, and a processor configured to perform authentication for the financial service based on biometrics information of the user performing authentication for the financial service. The processor may acquire an image by photographing the user performing authentication through the camera, acquire information on whether the user performing authentication is in a threat situation from the learned model, with information acquired from the image as input of the learned model, and perform authentication for the financial service according to the acquired information. At least a part of the learned model is an artificial intelligent algorithm, which may be performed according to at least one of machine learning, neural network, or deep learning algorithm.

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