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公开(公告)号：US10382137B2
公开(公告)日：2019-08-13
申请号：US16014932
申请日：2018-06-21
Applicant: STMicroelectronics S.r.l.
Inventor： Luca Maggi , Antonio Fincato , Salvatore Mario Rotolo , Matteo Alessio Traldi , Luigi Verga , Mark Andrew Shaw
IPC: G02B6/36 , H04B10/114 , H04J14/02 , H04B10/40 , G02B6/42 , H04B10/80 , H04B10/2575
Abstract: An optoelectronic device may include a package having a component for sending/receiving optical signals along a first direction, and a chip of semiconductor material housed within the package. The chip may have a main surface and a portion exposed on the main surface for sending/receiving the optical signals along a second direction different from the first direction. The optoelectronic device may further include a component for deflecting the optical signals between the first direction and the second direction, the component being mounted on the main surface.
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公开(公告)号：US20180302166A1
公开(公告)日：2018-10-18
申请号：US16014932
申请日：2018-06-21
Applicant: STMicroelectronics S.r.l.
Inventor： Luca Maggi , Antonio Fincato , Salvatore Mario Rotolo , Matteo Alessio Traldi , Luigi Verga , Mark Andrew Shaw
IPC: H04B10/40 , G02B6/42 , H04B10/2575
CPC classification number: H04B10/40 , G02B6/36 , G02B6/42 , G02B6/4206 , G02B6/4214 , G02B6/4246 , G02B6/4292 , H04B10/1143 , H04B10/2575 , H04B10/80 , H04J14/0209 , Y10T29/49002
Abstract: An optoelectronic device may include a package having a component for sending/receiving optical signals along a first direction, and a chip of semiconductor material housed within the package. The chip may have a main surface and a portion exposed on the main surface for sending/receiving the optical signals along a second direction different from the first direction. The optoelectronic device may further include a component for deflecting the optical signals between the first direction and the second direction, the component being mounted on the main surface..
