公开(公告)号：US20230343717A1

公开(公告)日：2023-10-26

申请号：US18302807

申请日：2023-04-19

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： GunHyuck LEE ,  SangHyun SON

IPC: H01L23/538 ,  H01L25/16

CPC classification number: H01L23/5385 ,  H01L25/162

Abstract: An interconnect device comprises an insulating frame. The insulating frame comprises: a top insulating layer formed uppermost of the insulating frame and occupying an entirety of a top surface of the insulating frame; a bottom insulating layer formed lowermost of the insulating frame and occupying an entirety of a bottom surface of the insulating frame; and a central insulating layer that includes a plurality of insulators disposed between the top insulating layer and the bottom insulating layer, wherein the plurality of insulators form a plurality of through-holes between a first lateral surface and a second lateral surface of the central insulating layer. The interconnect device further comprises a plurality of bridge conductors, wherein each of the plurality of bridge conductors is disposed within a respective one of the plurality of through-holes and extends between the first lateral surface and the second lateral surface of the central insulating layer.

公开(公告)号：US20240105467A1

公开(公告)日：2024-03-28

申请号：US18460621

申请日：2023-09-04

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： MyungHo JUNG ,  SangHyun SON ,  YoungUk NOH

IPC: H01L21/48 ,  H01L23/498

CPC classification number: H01L21/4853 ,  H01L23/49811 ,  H01L23/3121

Abstract: A semiconductor device and a method for forming the same are provided. The method includes: providing a package including: a substrate including a first substrate surface and a second substrate surface opposite to the first substrate surface; a first conductive bump formed on the first substrate surface; and a first encapsulant disposed on the first substrate surface and encapsulating the first conductive bump; forming a groove in the first encapsulant to expose at least a portion of the first conductive bump; and forming a second conductive bump on the exposed portion of the first conductive bump using a laser soldering apparatus.

公开(公告)号：US20240096920A1

公开(公告)日：2024-03-21

申请号：US18459014

申请日：2023-08-30

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： MyungHo JUNG ,  SangHyun SON ,  YoungUk NOH ,  BumRyul MAENG

IPC: H01L27/146

CPC classification number: H01L27/14636 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14632 ,  H01L27/14685 ,  H01L27/14687

Abstract: Provided is a sensor assembly, comprising: a sensor, wherein the sensor comprises a sensor front surface comprising a sensor area and an interconnect area; at least one filter layer formed on top of the sensor front surface, wherein the at least one filter layer covers and is in direct contact with the sensor area of the sensor; a first encapsulant layer formed on top of the at least one filter layer, wherein the first encapsulant layer is transmissive to light; and wherein the interconnect area is at least partially exposed from the at least one filter layer and the first encapsulant layer.