Nonvolatile memory device and storage device

    公开(公告)号:US12165734B2

    公开(公告)日:2024-12-10

    申请号:US17895642

    申请日:2022-08-25

    Abstract: A nonvolatile memory device includes a memory cell region and a peripheral circuit region disposed below the memory cell region. The peripheral circuits include a page buffer, a row decoder, and other peripheral circuits, wherein the page buffer is included in a page buffer block disposed on a lower surface of the first semiconductor substrate to be distinguished from other circuits included in the peripheral circuit region in a first direction perpendicular to an upper surface of the first semiconductor substrate, is connected to the memory cell region through a connection portion penetrating through the first semiconductor substrate, and includes a plurality of vertical transistors each defined by a source region, a channel region, and a drain region stacked in sequence in the first direction.

    NON-VOLATILE MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20230118956A1

    公开(公告)日:2023-04-20

    申请号:US18047270

    申请日:2022-10-17

    Abstract: A non-volatile memory device includes a substrate, a stack structure that includes a first gate layer that extends in a horizontal direction and a second gate layer that extends in the horizontal direction and is disposed apart from the first gate layer in a vertical direction, a plurality of first channel structures that penetrate in the vertical direction through a first channel region of the stack structure, a plurality of second channel structures that penetrate in the vertical direction through a second channel region of the stack structure, a first anti-fuse structure and a second anti-fuse structure that each penetrate in the vertical direction through an anti-fuse region of the stack structure, a first anti-fuse transistor that is electrically connected to the first gate layer through the first anti-fuse structure, and a second anti-fuse transistor that is electrically connected to the second gate layer through the second anti-fuse structure.

    Electronic device and method for same controlling external device

    公开(公告)号:US11455140B2

    公开(公告)日:2022-09-27

    申请号:US17261956

    申请日:2019-05-15

    Abstract: Provided are an electronic device and a method of controlling an external device by the electronic device. According to various embodiments of the present disclosure, a method of controlling an external device by an electronic device includes displaying, on a screen, a first user interface (UI) corresponding to first UI data received from an external server, transmitting, to the external device, second UI data corresponding to the first UI, receiving, from the external device, coordinates selected by a user using the external device, obtaining additional information related to the first UI when the coordinates correspond to a position of the first UI displayed on the screen, and transmitting, to the external device, the additional information and an execution command of an application using the additional information.

    Reticle in an apparatus for extreme ultraviolet exposure

    公开(公告)号:US11409193B2

    公开(公告)日:2022-08-09

    申请号:US17028049

    申请日:2020-09-22

    Abstract: A reticle for an apparatus for EUV exposure and a method of manufacturing a reticle, the reticle including a substrate including an edge region and a main region; a multi-layer structure on the main region and the edge region, a sidewall of the multi-layer structure overlying the edge region; a capping layer covering an upper surface and the sidewall of the multi-layer structure and at least a portion of the edge region of the substrate; and an absorber layer on the capping layer, the absorber layer covering an entire upper surface of the capping layer on the edge region of the substrate, wherein a stacked structure of the capping layer and the absorber layer is on an upper surface of the edge region of the substrate, and a sidewall of the stacked structure of the capping layer and the absorber layer is perpendicular to an upper surface of the substrate.

    SEMICONDUCTOR DEVICE
    10.
    发明申请

    公开(公告)号:US20240405014A1

    公开(公告)日:2024-12-05

    申请号:US18405843

    申请日:2024-01-05

    Abstract: The present disclosure relates to semiconductor devices. An example semiconductor device includes a first well region and a second well region isolated from each other by a first device isolation film; an NPN transistor provided by a first collector region formed in the first well region and including first conductivity-type impurities, and a first emitter region formed in the second well region and including the first conductivity-type impurities; a PNP transistor provided by a second emitter region formed in the first well region and including second conductivity-type impurities different from the first conductivity-type, and a second collector region formed in the second well region and including the second conductivity-type impurities; and an NMOS transistor including a source region and a drain region formed in the second well region and including the first conductivity-type impurities, and a gate structure disposed between the source region and the drain region.

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