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公开(公告)号：US20250029969A1
公开(公告)日：2025-01-23
申请号：US18905409
申请日：2024-10-03
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngki Jung , Sangmin Shin , Jinho Kim , Chulgyu Jung
Abstract: Provided are a light emitting diode (LED) module that enables a freedom in structure design thereof using a fan-out interconnection and an insulating layer, and a display device having the same. The LED module having a multi-layer structure includes substrate; a LED located on the substrate and emitting light toward the substrate; a plurality of upper electrodes located on the LED and connected to the LED; an upper insulating layer provided to surround the plurality of upper electrodes; a film on glass (FOG) electrode located on the upper insulating layer; and a fan out interconnection structure configured to connect the plurality of upper electrodes to the FOG electrode through the upper insulating layer.
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公开(公告)号：US12136616B2
公开(公告)日：2024-11-05
申请号：US17070417
申请日：2020-10-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngki Jung , Sangmin Shin , Jinho Kim , Chulgyu Jung
IPC: H01L29/10 , H01L23/00 , H01L25/16 , H01L29/76 , H01L31/036 , H01L31/112
Abstract: Provided are a light emitting diode (LED) module that enables a freedom in structure design thereof using a fan-out interconnection and an insulating layer, and a display device having the same. The LED module having a multi-layer structure includes substrate; a LED located on the substrate and emitting light toward the substrate; a plurality of upper electrodes located on the LED and connected to the LED; an upper insulating layer provided to surround the plurality of upper electrodes; a film on glass (FOG) electrode located on the upper insulating layer; and a fan out interconnection structure configured to connect the plurality of upper electrodes to the FOG electrode through the upper insulating layer.
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公开(公告)号：US20200302841A1
公开(公告)日：2020-09-24
申请号：US16824121
申请日：2020-03-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngki JUNG , Jinhee Kang , Jinho Kim , Sangmin Shin , Chulgyu Jung
Abstract: A display panel is provided. The display panel may include a glass, a driver formed on a first surface of the glass, and a circuit layer formed on a second surface of the glass. The circuit layer may include a plurality of pixel circuits configured to drive a plurality of micro light emitting diodes (LEDs) forming a plurality of pixels of the display panel; a plurality of driving circuits which are respectively connected to the driver via wiring formed over at least one side surface of the glass, and configured to supply driving signals to the plurality of pixel circuits based on signals received from the driver; and a plurality of redundancy driving circuits connected to the plurality of respective driving circuits in parallel, the plurality of redundancy driving circuits having a same circuit structure as the plurality of respective driving circuits.
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公开(公告)号：US20230016687A1
公开(公告)日：2023-01-19
申请号：US17945770
申请日：2022-09-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Donggun OH , Jinho Kim , Chulgyu Jung
Abstract: A display module and a method for manufacturing the same are provided. The display module manufacturing method includes: forming a semiconductor pattern on a substrate; forming a first insulating layer covering the semiconductor pattern on the substrate; forming a gate electrode on a region of the first insulating layer corresponding to a gate region of the semiconductor pattern; forming a second insulating layer covering the gate electrode on the first insulating layer; forming a first hole passing through the first insulating layer and the second insulating layer to expose a drain region of the semiconductor pattern and forming a second hole passing through the first insulating layer and the second insulating layer to expose a source region of the semiconductor pattern; and forming a first barrier pattern on the drain region in the first hole and a second barrier pattern on the source region in the second hole, and forming a drain electrode on the first barrier pattern and a source electrode on the second barrier pattern.
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公开(公告)号：US20230387144A1
公开(公告)日：2023-11-30
申请号：US18227162
申请日：2023-07-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngki JUNG , Chulgyu Jung
CPC classification number: H01L27/1248 , H01L25/167 , H01L33/58 , H01L27/124 , H01L24/05 , H01L24/08 , H01L24/06 , H01L2224/05573 , H01L2224/05557 , H01L2224/06181 , H01L2224/08145 , H01L2224/08225 , H01L2924/12041
Abstract: A display module includes: a plurality of pixels arranged in two dimensions; a display panel including: a back plate including: a transparent substrate; a pixel circuit layer; and a plurality of power electrode layers provided on the transparent substrate; and a plurality of inorganic light emitting elements provided on the back plate; and an image sensor provided on the rear of the display panel, wherein each of the plurality of pixels includes two or more inorganic light emitting elements among the plurality of inorganic light emitting elements, the display panel includes a plurality of transparent regions in a region corresponding to a position of the image sensor, and each transparent region of the plurality of transparent regions is configured to allow external light to be incident on the image sensor.
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Patent Agency Ranking
公开(公告)号：US11308831B2
公开(公告)日：2022-04-19
申请号：US16824121
申请日：2020-03-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngki Jung , Jinhee Kang , Jinho Kim , Sangmin Shin , Chulgyu Jung
Abstract: A display panel is provided. The display panel may include a glass, a driver formed on a first surface of the glass, and a circuit layer formed on a second surface of the glass. The circuit layer may include a plurality of pixel circuits configured to drive a plurality of micro light emitting diodes (LEDs) forming a plurality of pixels of the display panel; a plurality of driving circuits which are respectively connected to the driver via wiring formed over at least one side surface of the glass, and configured to supply driving signals to the plurality of pixel circuits based on signals received from the driver; and a plurality of redundancy driving circuits connected to the plurality of respective driving circuits in parallel, the plurality of redundancy driving circuits having a same circuit structure as the plurality of respective driving circuits.
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公开(公告)号：US20210111168A1
公开(公告)日：2021-04-15
申请号：US17070417
申请日：2020-10-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngki JUNG , Sangmin Shin , Jinho Kim , Chulgyu Jung
Abstract: Provided are a light emitting diode (LED) module that enables a freedom in structure design thereof using a fan-out interconnection and an insulating layer, and a display device having the same. The LED module having a multi-layer structure includes substrate; a LED located on the substrate and emitting light toward the substrate; a plurality of upper electrodes located on the LED and connected to the LED; an upper insulating layer provided to surround the plurality of upper electrodes; a film on glass (FOG) electrode located on the upper insulating layer; and a fan out interconnection structure configured to connect the plurality of upper electrodes to the FOG electrode through the upper insulating layer.
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公开(公告)号：US10957245B2
公开(公告)日：2021-03-23
申请号：US16706093
申请日：2019-12-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Chulgyu Jung , Jinho Kim , Sangmin Shin , Hoseop Lee , Youngki Jung
Abstract: A display apparatus including: a printed circuit board; and a plurality of display modules arranged adjacent in a length direction of the printed circuit board, each display modules of the plurality of the display modules including: a thin film transistor substrate; a plurality of micro LEDs arranged on a surface of the thin film transistor substrate; a flexible printed circuit board (FPCB) through which the printed circuit board and the thin film transistor substrate; and a driver controlling the plurality of micro LEDs disposed on a surface of the FPCB.
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公开(公告)号：US12040208B2
公开(公告)日：2024-07-16
申请号：US17540859
申请日：2021-12-02
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Myunghee Kim , Seungran Park , Youngki Jung , Chulgyu Jung
CPC classification number: H01L21/68 , H01L24/95 , H01L25/167 , H01L24/80 , H01L24/83 , H01L2224/80085 , H01L2224/80136 , H01L2224/80203 , H01L2224/80805 , H01L2224/83085 , H01L2224/83136 , H01L2224/83201 , H01L2224/95085 , H01L2224/95101 , H01L2224/95136 , H01L2924/12041
Abstract: A guide apparatus configured to transfer light-emitting devices in a liquid onto a substrate is provided. The guide apparatus includes a base configured to support the substrate; and a guide member configured to couple with the base to be seated on a mounting surface of the substrate in a state in which the substrate is supported on a surface of the base, wherein the guide member includes guide holes configured to respectively guide the light-emitting devices in the liquid to be disposed on the mounting surface of the substrate.
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10.发明申请公开(公告)号：US20220384231A1
公开(公告)日：2022-12-01
申请号：US17540859
申请日：2021-12-02
Applicant: Samsung Electronics Co., LTD.
Inventor： Myunghee KIM , Seungran Park , Youngki Jung , Chulgyu Jung
Abstract: A guide apparatus configured to transfer light-emitting devices in a liquid onto a substrate is provided. The guide apparatus includes a base configured to support the substrate; and a guide member configured to couple with the base to be seated on a mounting surface of the substrate in a state in which the substrate is supported on a surface of the base, wherein the guide member includes guide holes configured to respectively guide the light-emitting devices in the liquid to be disposed on the mounting surface of the substrate.
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