公开(公告)号：US20220066022A1

公开(公告)日：2022-03-03

申请号：US17232300

申请日：2021-04-16

Applicant: Samsung Electro-Mechanics Co., Ltd

Inventor： Young Ki LEE ,  Joon Seok CHAE ,  Seog Moon CHOI ,  Tae Gyu RYU

IPC: G01S13/86 ,  G02B7/09 ,  G03B13/36 ,  G02B27/64 ,  G03B5/00 ,  G02B13/00 ,  B60R11/04 ,  G01S13/931 ,  H04N5/232 ,  H04N5/225

Abstract: A sensing device includes a fixed member, a rotation member disposed at both ends of the fixed member, a camera installed on the fixed member, and respective radar units installed on the rotation members, where the respective radar units are configured to sense respective objects at edges of a viewing angle of the camera and respective objects outside of the viewing angle of the camera.

公开(公告)号：US20210126353A1

公开(公告)日：2021-04-29

申请号：US16789968

申请日：2020-02-13

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Hong Seok LEE ,  Bo Hyun SEO ,  Sung Youl CHOI ,  Young Ki LEE ,  Tae Gyu RYU ,  Seog Moon CHOI

IPC: H01Q1/32 ,  H01Q13/02

Abstract: An antenna apparatus includes a substrate, a transmission antenna disposed on the substrate, and an auxiliary substrate disposed in an upper portion of the transmission antenna and having a radio wave guide unit having a horn shape. The auxiliary substrate further includes an insulator and a second metal pattern disposed in the radio wave guide unit on the insulator.

公开(公告)号：US20140174940A1

公开(公告)日：2014-06-26

申请号：US14179207

申请日：2014-02-12

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chang Hyun LIM ,  Seog Moon CHOI ,  Sang Hyun SHIN ,  Young Ki LEE ,  Sung Keun PARK

IPC: H05K3/02

CPC classification number: H05K3/02 ,  H05K1/0201 ,  H05K1/053 ,  H05K3/0061 ,  H05K2201/062 ,  H05K2201/09881 ,  H05K2201/09972 ,  H05K2203/0315

Abstract: Embodiments of the invention provide a heat-dissipating substrate and a fabricating method of the heat-dissipating substrate. According to various embodiments, the heat-dissipating substrate includes a plating layer divided by a first insulator formed in a division area. A metal plate is formed on an upper surface of the plating layer and filled with a second insulator at a position corresponding to the division area, with an anodized layer formed on a surface of the metal plate. A circuit layer is formed on the anodized layer which is formed on an upper surface of the metal plate. The heat-dissipating substrate and fabricating method thereof achieves thermal isolation by a first insulator formed in a division area and a second insulator.

Abstract translation: 本发明的实施例提供散热基板和散热基板的制造方法。 根据各种实施例，散热基板包括由形成在分割区域中的第一绝缘体分隔的镀层。 金属板形成在镀层的上表面上，并且在对应于分割区域的位置处填充有第二绝缘体，阳极氧化层形成在金属板的表面上。 在形成在金属板的上表面上的阳极氧化层上形成电路层。 散热基板及其制造方法通过形成在分割区域和第二绝缘体中的第一绝缘体进行热隔离。

公开(公告)号：US20140117524A1

公开(公告)日：2014-05-01

申请号：US13735603

申请日：2013-01-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kwang Soo KIM ,  Young Ho SOHN ,  Bum Seok SUH ,  Min Gyu PARK ,  Young Ki LEE

IPC: H01L23/00

CPC classification number: H01L24/25 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/49575 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/32 ,  H01L24/48 ,  H01L24/82 ,  H01L25/162 ,  H01L25/165 ,  H01L25/18 ,  H01L2224/2101 ,  H01L2224/2105 ,  H01L2224/211 ,  H01L2224/2201 ,  H01L2224/221 ,  H01L2224/2402 ,  H01L2224/24137 ,  H01L2224/24226 ,  H01L2224/2501 ,  H01L2224/25105 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/82105 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: There are provided a power semiconductor module and a manufacturing method thereof, the power semiconductor module including: a lead frame; a base substrate including a circuit wiring formed on an insulating layer thereof; a plurality of power semiconductor devices disposed to contact the circuit wiring; and a multilayer substrate formed by stacking a plurality of substrates and electrically connecting the power semiconductor devices and the lead frame to one another using a connection line formed therein and having conductivity.

Abstract translation: 提供功率半导体模块及其制造方法，功率半导体模块包括：引线框架; 基底基板，包括形成在其绝缘层上的电路布线; 设置成接触所述电路布线的多个功率半导体器件; 以及通过使用形成在其中并具有导电性的连接线将堆叠多个基板并将功率半导体器件和引线框架彼此电连接而形成的多层基板。

公开(公告)号：US20220203894A1

公开(公告)日：2022-06-30

申请号：US17407798

申请日：2021-08-20

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Dong Chang HONG ,  Young Ki LEE ,  Doo Hyung KWON

IPC: B60R1/00 ,  B60R11/04 ,  H04N5/225

Abstract: A vehicle surround viewing monitor (SVM) system includes: a tilt camera device including camera modules configured to image a surround view of a vehicle; and a control device configured to generate a control signal for adjusting a detection angle of the tilt camera device according to an operating mode of the vehicle, based on received vehicle information. The tilt camera device is configured to adjust a detection angle of each of the camera modules, in response to the control signal.

公开(公告)号：US20140185242A1

公开(公告)日：2014-07-03

申请号：US13789030

申请日：2013-03-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kwang Soo KIM ,  Tae Hyun KIM ,  Bum Seok SUH ,  In Wha JEONG ,  Young Ki LEE

IPC: H05K7/20

CPC classification number: H05K7/209 ,  H01L23/367 ,  H01L23/49833 ,  H01L23/49861 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/32245 ,  H01L2224/48229 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15159 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2924/00

Abstract: There is provided a power semiconductor module in which power semiconductor elements, integration of which may be difficult due to heating, are modularized. The power semiconductor module includes: a heat dissipation substrate electrically connected to a common connection terminal; and a plurality of electronic elements disposed on the heat dissipation substrate, wherein the electronic elements have varying spaces therebetween.

Abstract translation: 提供了功率半导体模块，其中由于加热而可能难以集成的功率半导体元件被模块化。 功率半导体模块包括：电连接到公共连接端子的散热基板; 以及设置在所述散热基板上的多个电子元件，其中，所述电子元件之间具有不同的间隔。

公开(公告)号：US20140175631A1

公开(公告)日：2014-06-26

申请号：US13779502

申请日：2013-02-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Ki LEE ,  Kwang Soo KIM ,  Young Hoon KWAK ,  Sun Woo YUN

IPC: H01L23/34 ,  H01L21/56

CPC classification number: H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L23/24 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/072 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/1203 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15192 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: There is provided a semiconductor module capable of being easily manufactured and a manufacturing method thereof, the semiconductor module including a module substrate on which at least one electronic element is mounted, at least one external connection terminal fastened to the module substrate, and a case formed by coupling a first case and a second case, wherein the first case and the second case accommodate the module substrate at both ends of the module substrate and are coupled to each other.

Abstract translation: 提供一种能够容易地制造的半导体模块及其制造方法，该半导体模块包括其上安装有至少一个电子元件的模块基板，至少一个固定到模块基板的外部连接端子和形成的壳体 通过联接第一壳体和第二壳体，其中第一壳体和第二壳体在模块衬底的两端容纳模块衬底并且彼此耦合。

公开(公告)号：US20170061189A1

公开(公告)日：2017-03-02

申请号：US15093997

申请日：2016-04-08

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yong Il KWON ,  Chang Bae LEE ,  Hyun Jun KIM ,  Young Ki LEE

IPC: G06K9/00

CPC classification number: G06K9/0002

Abstract: Disclosed are sensors for detecting a fingerprint and methods of manufacturing the sensor. The sensor for detecting a fingerprint includes a substrate, first conductor lines formed on a surface of the substrate, an insulating layer formed on the first conductor lines, and second conductor lines formed on the insulating layer. A width of the first conductor lines or a width of the second conductor lines is 1-10 μm.

Abstract translation: 公开了用于检测指纹的传感器和制造传感器的方法。 用于检测指纹的传感器包括基板，形成在基板的表面上的第一导体线，形成在第一导体线上的绝缘层，以及形成在绝缘层上的第二导体线。 第一导体线的宽度或第二导体线的宽度为1-10μm。