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公开(公告)号：US20180122561A1
公开(公告)日：2018-05-03
申请号：US15684903
申请日：2017-08-23
Applicant: Realtek Semiconductor Corporation
Inventor： Hsiao-Tsung YEN , Yuh-Sheng JEAN , Ta-Hsun YEH
CPC classification number: H01F27/29 , H01F27/2804 , H01F27/2828 , H01F2027/2838
Abstract: A transformer includes an input terminal, an output terminal, a first wire, and a second wire. The input and output terminals are disposed at two sides of the transformer with respect to a middle point of the transformer. The two sides of the transformer are opposite to each other. On the basis of a middle line which is disposed between the input terminal and the output terminal and passes through the middle point of the transformer, the two opposite sides include a first side and a second side which are disposed at opposite sides of the middle line. The first wire is winded to form circles. The second wire is winded correspondingly to the first wire to form circles. The first wire and/or the second wire are winded in an interlaced manner at location of the input terminal, location of the output terminal, the first side, and the second side.
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公开(公告)号：US20200321158A1
公开(公告)日：2020-10-08
申请号：US16908894
申请日：2020-06-23
Applicant: Realtek Semiconductor Corporation
Inventor： Hsiao-Tsung YEN , Yuh-Sheng JEAN , Ta-Hsun YEH
Abstract: An integrated inductor is disclosed herein. The integrated inductor includes a substrate, an insulation layer, and an inductor. The substrate includes a trench. At least a portion of the insulation layer is formed in the trench. The inductor is disposed in the trench, and the inductor is disposed on the insulation layer.
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公开(公告)号：US20170365560A1
公开(公告)日：2017-12-21
申请号：US15623370
申请日：2017-06-14
Applicant: Realtek Semiconductor Corporation
Inventor： Hsiao-Tsung YEN , Cheng-Wei LUO , Yuh-Sheng JEAN , Ta-Hsun YEH
IPC: H01L23/552 , H01L49/02
CPC classification number: H01L23/552 , H01L23/5225 , H01L23/5227 , H01L28/10
Abstract: A patterned shield structure applied to an integrated circuit (IC) is disposed between an inductor and a substrate of the integrated circuit. The patterned shield structure includes a center structure unit, a first patterned structure unit, and a second patterned structure unit. The center structure unit includes a first sub-center structure unit and a second sub-center structure unit. The second sub-center structure unit and the first sub-center structure unit are symmetrically disposed with respect to a middle of the center structure unit. The first patterned structure unit is disposed on one side of the center structure unit. The second patterned structure unit is disposed on another side of the center structure unit. The second patterned structure unit and the first patterned structure unit are symmetrically disposed with respect to the center structure unit.
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公开(公告)号：US20170125160A1
公开(公告)日：2017-05-04
申请号：US15096296
申请日：2016-04-12
Applicant: Realtek Semiconductor Corporation
Inventor： Hsiao-Tsung YEN , Yuh-Sheng JEAN , Ta-Hsun YEH
CPC classification number: H01F27/362 , H01F17/0006 , H01F27/2804 , H01F2017/0073 , H01F2017/008
Abstract: An integrated circuit includes a first inductor, a second inductor, and a blocker. The first inductor is disposed in a metal layer, and the second is disposed in the metal layer. The blocker is disposed on the metal layer and located between the first inductor and the second inductor. The blocker is configured to block coupling occurring between the first inductor and the second inductor.
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公开(公告)号：US20190237238A1
公开(公告)日：2019-08-01
申请号：US16157456
申请日：2018-10-11
Applicant: Realtek Semiconductor Corporation
Inventor： Hsiao-Tsung YEN , Yuh-Sheng JEAN , Ta-Hsun YEH
IPC: H01F27/28
CPC classification number: H01F27/2804 , H01F2027/2809
Abstract: A transformer structure includes a first inductor and a second inductor. The first inductor has first turns. The second inductor has second turns. The first inductor and the second inductor are disposed in an interlaced manner. Except jump wires, the first and the second inductors are substantially disposed on a first layer. At least one of the first turns is substantially disposed between another first turn and one of the second turns.
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公开(公告)号：US20190221350A1
公开(公告)日：2019-07-18
申请号：US16155058
申请日：2018-10-09
Applicant: Realtek Semiconductor Corporation
Inventor： Hsiao-Tsung YEN , Yuh-Sheng JEAN , Ta-Hsun YEH
CPC classification number: H01F27/006 , H01F27/2804 , H01F27/29 , H01F2027/2819 , H01L28/10
Abstract: An 8-shaped inductive coil device that includes a first and a second spiral coils and a connection segment structure is provided. The first spiral coil includes first metal segments and crossing connection segments disposed at a first and a second metal layers respectively and includes first connection terminals. The second spiral coil includes second connection terminals. The connection segment structure electrically couples the first and the second connection terminals. The first and the second spiral coils are disposed along an imaginary line passing through a central region of each of ranges surrounded by the first and the second spiral coils. The connection segment structure and the crossing connection segments electrically couple the part of the first metal segments substantially vertical to the imaginary line, and the connection segment structure and the crossing connection segments are disposed substantially on the imaginary line.
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公开(公告)号：US20180330872A1
公开(公告)日：2018-11-15
申请号：US15975753
申请日：2018-05-09
Applicant: Realtek Semiconductor Corporation
Inventor： Hsiao-Tsung YEN , Cheng-Wei LUO , Yuh-Sheng JEAN , Ta-Hsun YEH
CPC classification number: H01F27/34 , H01F17/0006 , H01F27/2823 , H01F27/29 , H01F2017/004
Abstract: An inductor device includes a first and a second inductor unit. The first inductor unit includes a first and a second wire. The first wire is winded to form circles. The second wire is winded with the first wire to form circles. The first and/or the second wire are winded in an interlaced manner at a first terminal, a second terminal, a first side, and a second side. The second inductor unit includes a third and a fourth wire. The third wire is winded to form circles. The fourth wire is winded with the third wire to form circles. The third and/or the fourth wire are winded in an interlaced manner at a third terminal, a fourth terminal, a third side, and a fourth side. The first wired is coupled to the fourth wired, and the second wired is coupled to the third wired.
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公开(公告)号：US20180323154A1
公开(公告)日：2018-11-08
申请号：US15925792
申请日：2018-03-20
Applicant: Realtek Semiconductor Corporation
Inventor： Hsiao-Tsung YEN , Yuh-Sheng JEAN , Ta-Hsun YEH
IPC: H01L23/552 , H01L23/48 , H01L23/00 , H01L49/02
CPC classification number: H01L23/552 , H01L23/481 , H01L24/14 , H01L24/16 , H01L24/17 , H01L28/10 , H01L2224/1411 , H01L2224/16145 , H01L2224/16227 , H01L2224/17107
Abstract: An electronic device includes a first semiconductor die, a plurality of bumps, and a substrate. The first semiconductor die includes a first conductive feature. The bumps are disposed on the first semiconductor die and are connected to the first conductive feature. The substrate includes a second conductive feature. The bumps are electrically connected to the second conductive feature. The first conductive feature, the bumps, and the second conductive feature are configured to form at least one ring structure.
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公开(公告)号：US20180261565A1
公开(公告)日：2018-09-13
申请号：US15877400
申请日：2018-01-23
Applicant: Realtek Semiconductor Corporation
Inventor： Hsiao-Tsung YEN , Ping-Yuan DENG , Yuh-Sheng JEAN , Ta-Hsun YEH
IPC: H01L23/00
Abstract: A semiconductor package structure is disclosed. The semiconductor package structure comprises a plurality of layered structures, a plurality of wires, and a first ring structure. The wires are connected to each of the layered structures. The first ring structure is coupled to at least one of the layered structures and positioned between the wires.
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公开(公告)号：US20160343502A1
公开(公告)日：2016-11-24
申请号：US15016287
申请日：2016-02-05
Applicant: Realtek Semiconductor Corporation
Inventor： Hsiao-Tsung YEN , Yuh-Sheng JEAN , Ta-Hsun YEH
CPC classification number: H01F21/12 , H01F2017/0073
Abstract: An inductor device includes a conductor and a connector. The conductor includes a first ring-type structure and a second ring-type structure. The second ring-type structure is coupled to the first ring-type structure. The connector is coupled to the first ring-type structure and the second ring-type structure, and is configured to selectively connect the first ring-type structure and the second ring-type structure such that the conductor forms single loop.
Abstract translation: 电感器件包括导体和连接器。 导体包括第一环型结构和第二环型结构。 第二环型结构耦合到第一环型结构。 连接器连接到第一环形结构和第二环形结构，并且被配置为选择性地连接第一环形结构和第二环形结构，使得导体形成单个环。
