PROJECTION EQUIPMENT
    1.
    发明申请

    公开(公告)号:US20190179217A1

    公开(公告)日:2019-06-13

    申请号:US16023225

    申请日:2018-06-29

    CPC classification number: G03B21/16 G03B21/008 G03B21/145

    Abstract: A projection equipment may including a housing arranged with a first opening and a DMD circuit board arranged with a DMD chip on a side facing the housing, where the DMD chip is arranged with an operational region and a non-operational region. The non-operational region may be located in the periphery of the operational region, and the operational region may modulate a portion of a beam that passes through the first opening when the portion of the beam irradiates onto the operational region. A first heat dissipation member may be arranged between the DMD chip and the housing such that there is a space between the first heat dissipation member and the DMD chip. The first heat dissipation member may be arranged with a second opening which provides a passage for the portion of the beam, while blocking the other portion of the beam.

    Projection equipment
    2.
    发明授权

    公开(公告)号:US10599023B2

    公开(公告)日:2020-03-24

    申请号:US16023225

    申请日:2018-06-29

    Abstract: A projection equipment may including a housing arranged with a first opening and a DMD circuit board arranged with a DMD chip on a side facing the housing, where the DMD chip is arranged with an operational region and a non-operational region. The non-operational region may be located in the periphery of the operational region, and the operational region may modulate a portion of a beam that passes through the first opening when the portion of the beam irradiates onto the operational region. A first heat dissipation member may be arranged between the DMD chip and the housing such that there is a space between the first heat dissipation member and the DMD chip. The first heat dissipation member may be arranged with a second opening which provides a passage for the portion of the beam, while blocking the other portion of the beam.

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