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    LASER-ASSISTED MICROMACHINING SYSTEMS AND METHODS
    3.
    发明申请
    LASER-ASSISTED MICROMACHINING SYSTEMS AND METHODS 审中-公开

    公开(公告)号：US20170320164A1

    公开(公告)日：2017-11-09

    申请号：US15584140

    申请日：2017-05-02

    Applicant: Purdue Research Foundation

    Inventor： Yung C. Shin ,  Xiangyang Dong

    IPC: B23K26/00 ,  B23P25/00 ,  B23K26/06

    CPC classification number: B23K26/0093 ,  B23K26/0643 ,  B23K26/36 ,  B23P25/006

    Abstract: Laser-assisted micromachining methods and systems capable of providing flexible beam positioning and low incident angles. Such laser-assisted micromachining systems preferably include a laser beam source, a cutting tool, means for engaging a workpiece with the cutting tool, optical elements arranged to define a path of a laser beam emitted by the laser beam source wherein the optical elements include at least a first mirror mounted in fixed relation to the laser beam source, and means for adjustably mounting a second mirror to project the laser beam onto the workpiece in proximity to the cutting tool and at an incidence angle relative to a surface of the workpiece.

    METHODS OF FORMING HOLES AND ETCHING SURFACES IN SUBSTRATES AND SUBSTRATES FORMED THEREBY
    4.
    发明申请
    METHODS OF FORMING HOLES AND ETCHING SURFACES IN SUBSTRATES AND SUBSTRATES FORMED THEREBY 审中-公开
    形成基体的孔和蚀刻表面的方法及其形成的基底

    公开(公告)号：US20170028510A1

    公开(公告)日：2017-02-02

    申请号：US15222336

    申请日：2016-07-28

    Applicant: Purdue Research Foundation

    Inventor： Yung C. Shin

    IPC: B23K26/362 ,  B29C59/16 ,  B23K26/402 ,  B29C59/14 ,  B23K26/00 ,  B23K26/384

    CPC classification number: B23K26/362 ,  B23K26/0608 ,  B23K26/0624 ,  B23K26/361 ,  B23K26/384 ,  B23K26/402 ,  B23K2103/04 ,  B23K2103/08 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/166 ,  B23K2103/30 ,  B23K2103/50 ,  B29C59/14 ,  B29C59/16 ,  B29C2059/023 ,  B29C2791/009 ,  B29K2105/06 ,  B29K2307/04

    Abstract: Methods capable of forming holes in, etching the surface of, or otherwise ablating substrates, and substrates formed thereby. A first method includes directing a first laser beam pulse towards a substrate to form a hole in a surface thereof and to form a plasma plume at least partially within the hole wherein the plasma plume has insufficient thermal energy and expansion velocity to etch sidewall of the hole, and directing a second laser beam pulse into the plasma plume to increase the temperature and expansion velocity of the plasma plume such that the sidewall is etched causing an increase in the cross-sectional dimension of the hole. A second method includes applying a liquid to a surface of a substrate, and directing a laser beam pulse into the liquid to create plasma on the surface of the substrate that etches portions of the surface of the substrate.

    Abstract translation: 能够形成孔，蚀刻表面或以其他方式消融基底的方法以及由此形成的基底。 第一种方法包括将第一激光束脉冲引向衬底以在其表面中形成孔并且至少部分地在孔内形成等离子体羽毛，其中等离子体羽毛具有不足的热能和膨胀速度以蚀刻孔的侧壁 并且将第二激光束脉冲引导到等离子体羽流中以增加等离子体羽流的温度和膨胀速度，使得侧壁被蚀刻从而导致孔的横截面尺寸的增加。 第二种方法包括将液体施加到基板的表面，以及将激光束脉冲引导到液体中，以在蚀刻基板表面的部分的基板的表面上产生等离子体。

    Laser-assisted micromachining systems and methods
    5.
    发明授权
    Laser-assisted micromachining systems and methods 有权

    公开(公告)号：US10549382B2

    公开(公告)日：2020-02-04

    申请号：US15584140

    申请日：2017-05-02

    Applicant: Purdue Research Foundation

    Inventor： Yung C. Shin ,  Xiangyang Dong

    IPC: B23K26/06 ,  B23K26/02 ,  B23K26/00 ,  B23P25/00 ,  B23K26/36

    Abstract: Laser-assisted micromachining methods and systems capable of providing flexible beam positioning and low incident angles. Such laser-assisted micromachining systems preferably include a laser beam source, a cutting tool, means for engaging a workpiece with the cutting tool, optical elements arranged to define a path of a laser beam emitted by the laser beam source wherein the optical elements include at least a first mirror mounted in fixed relation to the laser beam source, and means for adjustably mounting a second mirror to project the laser beam onto the workpiece in proximity to the cutting tool and at an incidence angle relative to a surface of the workpiece.

    Integrated laser material processing cell
    7.
    发明授权
    Integrated laser material processing cell 有权
    集成激光材料处理电池

    公开(公告)号：US09381603B2

    公开(公告)日：2016-07-05

    申请号：US14100855

    申请日：2013-12-09

    Applicant: PURDUE RESEARCH FOUNDATION

    Inventor： Yung C. Shin

    IPC: B23K26/00 ,  B23P25/00 ,  B23K26/34 ,  B23C1/00 ,  B23K28/02 ,  B23K26/14 ,  B23K35/02

    CPC classification number: B23P25/006 ,  B23C1/002 ,  B23K26/00 ,  B23K26/0093 ,  B23K26/147 ,  B23K26/34 ,  B23K28/02 ,  B23K35/0244 ,  Y10T409/303752 ,  Y10T409/303976

    Abstract: An integrated laser material processing cell allowing laser-assisted machining to be used in conjunction with directed material deposition in a single setup, achieving greater geometric accuracy and better surface finish than currently possible in existing laser freeform fabrication techniques. The integration of these two processes takes advantage of their common use of laser beam heat to process materials. The cell involves a multi-axis laser-assisted milling machine having a work spindle, a laser emitter, and means for positioning the emitter with respect to the spindle so as to direct a laser beam onto a localized area of a work piece in proximity to a cutting tool mounted in the spindle. A powder delivery nozzle mounted on the machine and positioned adjacent to the emitter delivers powder to a deposition zone in the path of the beam, such that material deposition and laser-assisted milling may be performed substantially simultaneously in a single workspace.

    Abstract translation: 一种集成激光材料处理单元，允许激光辅助加工与单一设置中的定向材料沉积结合使用，实现比现有的激光自由形状制造技术中目前可能的更大的几何精度和更好的表面光洁度。 这两个过程的整合利用了它们常用的激光束热来处理材料。 该电池涉及具有工作主轴，激光发射器和用于相对于主轴定位发射器的装置的多轴激光辅助铣床，以便将激光束引导到接近于工件的工件的局部区域 安装在主轴上的切割工具。 安装在机器上并邻近发射器定位的粉末输送喷嘴将粉末输送到梁的路径中的沉积区域，使得材料沉积和激光辅助研磨可以在单个工作空间中基本上同时进行。

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