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公开(公告)号：US20190319063A1
公开(公告)日：2019-10-17
申请号：US15951407
申请日：2018-04-12
Applicant: Palo Alto Research Center Incorporated
Inventor： Robert A. Street , Julie A. Bert , John C. Knights
IPC: H01L27/146 , H01L27/12 , H01L31/0224 , H01L31/18 , H01L31/0376 , G01T1/20 , G01T7/00
Abstract: Transitioning conventional x-ray detector materials and structures to bendable or flexible (e.g., plastic) substrates makes them rugged against breakage when dropped but exposes the detectors to damage if bent. Disclosed are bendable digital x-ray detector structures that are rugged with regard to bending as well as dropping. The structures provide strain matching between layers so that a detector backplane is in and/or near the mechanical neutral plane and therefore less susceptible to bending stress.
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2.发明申请
公开(公告)号：US20140374912A1
公开(公告)日：2014-12-25
申请号：US13925753
申请日：2013-06-24
Applicant: Palo Alto Research Center Incorporated
Inventor： John C. Knights
IPC: H01L23/00
CPC classification number: H01L24/06 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/81 , H01L2224/0401 , H01L2224/05568 , H01L2224/06051 , H01L2224/06154 , H01L2224/06515 , H01L2224/1111 , H01L2224/13016 , H01L2224/13023 , H01L2224/13027 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13118 , H01L2224/1312 , H01L2224/13139 , H01L2224/13147 , H01L2224/13155 , H01L2224/13166 , H01L2224/13171 , H01L2224/1318 , H01L2224/13184 , H01L2224/1403 , H01L2224/14051 , H01L2224/14154 , H01L2224/14505 , H01L2224/16105 , H01L2224/16235 , H01L2224/16238 , H01L2224/17517 , H01L2224/81193 , H01L2224/81815 , H01L2224/81902 , H01L2224/81905 , H01L2924/12041 , H05K3/32 , H05K3/341 , H05K2201/0311 , H05K2201/10674 , H01L2924/013 , H01L2924/00014 , H01L2924/01024 , H01L2924/01074 , H01L2924/0104 , H01L2924/00012 , H01L2924/014 , H01L2924/00
Abstract: Standard solder-based interconnect structures are utilized as mechanical fasteners to attach an IC die in a “flip-chip” orientation to a support structure (e.g., a package base substrate or printed circuit board). Electrical connections between the support structure and the IC die are achieved by curved micro-springs that are disposed in peripheral regions of the IC die and extend through a gap region separating the upper structure surface and the processed surface of the IC die. The micro-springs are fixedly attached to one of the support structure and the IC die, and have a free (tip) end that contacts an associated contact pad disposed on the other structure/IC die. Conventional solder-based connection structures (e.g., solder-bumps/balls) are disposed on “dummy” (non-functional) pads disposed in a central region of the IC die. After placing the IC die on the support structure, a standard solder reflow process is performed to complete the mechanical connection.
Abstract translation: 标准的基于焊料的互连结构被用作机械紧固件，以将“芯片”取向的IC管芯连接到支撑结构（例如，封装基底或印刷电路板）上。 支撑结构和IC芯片之间的电连接通过设置在IC管芯的周边区域中的弯曲的微型弹簧实现，并且延伸穿过分离IC模具的上部结构表面和加工表面的间隙区域。 微弹簧固定地附接到支撑结构和IC模具中的一个，并且具有与设置在另一个结构/ IC芯片上的相关接触焊盘接触的自由（尖端）端。 常规的基于焊料的连接结构（例如，焊料凸起/球）设置在设置在IC管芯的中心区域中的“虚拟”（非功能）焊盘上。 将IC管芯放置在支撑结构上之后，进行标准的回流焊工艺以完成机械连接。
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公开(公告)号：US20130239349A1
公开(公告)日：2013-09-19
申请号：US13746267
申请日：2013-01-21
Applicant: PALO ALTO RESEARCH CENTER INCORPORATED
Inventor： John C. Knights , Tse Nga Ng
IPC: A46B9/04
CPC classification number: A46B9/04 , A46B15/0006 , A46B15/0012 , A46B15/0038 , A46B2200/1066
Abstract: A toothbrush assembly can include a plurality of bristles and a toothbrush body. The toothbrush body can include an indicator to provide information to a user using the toothbrush during a teeth cleaning session. A sensing mechanism can include at least one electroded sheet and provide an electric signal to the indicator responsive to the user using the toothbrush assembly during the teeth cleaning session.
Abstract translation: 牙刷组件可以包括多个刷毛和牙刷本体。 牙刷体可以包括指示器，以在牙齿清洁会话期间使用牙刷向使用者提供信息。 感测机构可以包括至少一个电镀片材，并且在牙齿清洁会话期间响应于使用者使用牙刷组件向指示器提供电信号。
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公开(公告)号：US10825855B2
公开(公告)日：2020-11-03
申请号：US16218905
申请日：2018-12-13
Applicant: Palo Alto Research Center Incorporated
Inventor： Julie A. Bert , Robert A. Street , John C. Knights
IPC: H01L27/146 , G01B7/16 , H01L29/786 , H04N5/32
Abstract: Bending a flexible x-ray detector to image a curved structure or object will distort the object appearance when compared to an image captured by a flat/rigid detector. An image distortion of this type can be corrected when the shape (relative bend position) of the x-ray detector is known. Incorporating strain sensors on the flexible x-ray detector makes it possible to record the local bend of the flexible x-ray detector when an image is taken. This shape information can be used to either label or correct for the image distortions created by bending the x-ray detector to assist users more accustomed to viewing images produced by flat/rigid x-ray detectors.
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公开(公告)号：US10608041B2
公开(公告)日：2020-03-31
申请号：US15951407
申请日：2018-04-12
Applicant: Palo Alto Research Center Incorporated
Inventor： Robert A. Street , Julie A. Bert , John C. Knights
IPC: H01L27/146 , H01L27/12 , H01L31/0224 , G01T7/00 , H01L31/18 , H01L31/0376 , G01T1/20
Abstract: Transitioning conventional x-ray detector materials and structures to bendable or flexible (e.g., plastic) substrates makes them rugged against breakage when dropped but exposes the detectors to damage if bent. Disclosed are bendable digital x-ray detector structures that are rugged with regard to bending as well as dropping. The structures provide strain matching between layers so that a detector backplane is in and/or near the mechanical neutral plane and therefore less susceptible to bending stress.
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公开(公告)号：US10930677B2
公开(公告)日：2021-02-23
申请号：US15951301
申请日：2018-04-12
Applicant: Palo Alto Research Center Incorporated
Inventor： Julie A. Bert , Robert A. Street , John C. Knights
IPC: H01H47/00 , H01L27/12 , H01L25/10 , H01L29/786 , H01L27/146 , H01L25/00
Abstract: Various designs are provided to mitigate or solve limitation on the bendability of an active matrix backplanes: including breaking large rigid silicon chips (ICs) into smaller rigid ICs, changing the orientation of rigid ICs, changing the placement of the ICs on the array, thinning the ICs to the point where the Si is flexible, and replacing the ICs with high quality TFT processing which can be done on flexible substrates.
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7.发明申请
公开(公告)号：US20190319049A1
公开(公告)日：2019-10-17
申请号：US15951301
申请日：2018-04-12
Applicant: Palo Alto Research Center Incorporated
Inventor： Julie A. Bert , Robert A. Street , John C. Knights
IPC: H01L27/12 , H01L25/10 , H01L29/786 , H01L27/146 , H01L25/00
Abstract: Various designs are provided to mitigate or solve limitation on the bendability of an active matrix backplanes: including breaking large rigid silicon chips (ICs) into smaller rigid ICs, changing the orientation of rigid ICs, changing the placement of the ICs on the array, thinning the ICs to the point where the Si is flexible, and replacing the ICs with high quality TFT processing which can be done on flexible substrates.
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公开(公告)号：US10197831B1
公开(公告)日：2019-02-05
申请号：US15845058
申请日：2017-12-18
Applicant: Palo Alto Research Center Incorporated
Inventor： Robert A. Street , Julie A. Bert , John C. Knights
IPC: H01L29/10 , G02F1/1333 , G02F1/1362 , G02F1/1343 , H01L29/786 , H01L29/417 , H01L29/66 , H01L27/12
Abstract: A flexible TFT backplane includes, a flexible substrate, a first set of address line contacts associated with the substrate, and a second set of address line contacts associated with the substrate. The first set of address line contacts and the second set of address line contacts are located at opposite sides of the substrate from each other, defining a vertical direction. A first set of address lines designed to run in one of the vertical direction and a diagonal or non-vertical direction with respect to the defined vertical direction, with the first set of address lines connected to the first set of address line contacts. Also provided is a second set of address lines designed to run in one of a diagonal or non-vertical direction with respect to the defined vertical direction, and a combination of diagonal and horizontal directions with respect to the vertical direction, with the second set of address lines connected to the second set of address line contacts. At least one insulating layer is located between the first set of address lines and the second set of address lines, and a plurality of TFTs arranged in an array, within the boundaries of the substrate, wherein the TFTs are addressed by the first set of address lines and the second set of address lines.
