NOVEL BACTERIOSTATIC AND ANTI-COLLAGENOLYTIC DENTAL MATERIALS THROUGH THE INCORPORATION OF POLYACRYLIC ACID MODIFIED CuQ NANOPARTICLES
    1.
    发明申请
    NOVEL BACTERIOSTATIC AND ANTI-COLLAGENOLYTIC DENTAL MATERIALS THROUGH THE INCORPORATION OF POLYACRYLIC ACID MODIFIED CuQ NANOPARTICLES 有权
    通过加入聚丙烯酸改性的CuQ纳米粒子制备新型的生物和抗菌胶原物质

    公开(公告)号:US20140037705A1

    公开(公告)日:2014-02-06

    申请号:US13900942

    申请日:2013-05-23

    Abstract: Provided are antibacterial and antimicrobial surface coatings and dental materials by utilizing the antimicrobial properties of copper chalcogenide and/or copper halide (CuQ, where Q=chalcogens including oxygen, or halogens, or nothing). An antimicrobial barrier is created by incorporation of CuQ nanoparticles of an appropriate size and at a concentration necessary and sufficient to create a unique bioelectrical environment. The unique bioelectrical environment results in biocidal effectiveness through a multi-factorial mechanism comprising a combination of the intrinsic quantum flux of copper (Cu0, Cu1+, Cu2+) ions and the high surface-to-volume electron sink facilitated by the nanoparticle. The result is the constant quantum flux of copper which manifests and establishes the antimicrobial environment preventing or inhibiting the growth of bacteria. The presence of CuQ results in inhibiting or delaying bacterial destruction and endogenous enzymatic breakdown of the zone of resin inter-diffusion, the integrity of which is essential for dental restoration longevity.

    Abstract translation: 通过利用铜硫属化物和/或铜卤化物(CuQ,其中Q =包括氧或卤素的硫属元素,或任何物质)的抗微生物性质,提供抗菌和抗微生物表面涂层和牙科材料。 通过掺入适当尺寸的CuQ纳米颗粒并以必要和足够的浓度产生独特的生物电气环境来产生抗微生物屏障。 独特的生物电气环境通过包含铜(CuO,Cu1 +,Cu2 +)的固有量子通量和由纳米颗粒促进的高表面 - 体积电子吸收的组合的多因素机制产生杀生物效果。 结果是铜的恒定量子通量显示并建立了防止或抑制细菌生长的抗微生物环境。 CuQ的存在导致抑制或延迟细菌破坏和树脂互扩散区域的内源性酶分解,其完整性对于牙齿修复寿命至关重要。

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