公开(公告)号：US20200251462A1

公开(公告)日：2020-08-06

申请号：US16679696

申请日：2019-11-11

Applicant: Intel Corporation

Inventor： Russell Mortensen ,  Robert Nickerson ,  Nicholas R. Watts

IPC: H01L25/18 ,  H01L25/065 ,  H01L25/00 ,  H01L23/00 ,  H01L23/498 ,  H01L21/48 ,  H05K3/40 ,  H05K1/11 ,  H01L25/10

Abstract: An offset interposer includes a land side including land-side ball-grid array (BGA) and a package-on-package (POP) side including a POP-side BGA. The land-side BGA includes two adjacent, spaced-apart land-side pads, and the POP-side BGA includes two adjacent, spaced-apart POP-side pads that are coupled to the respective two land-side BGA pads through the offset interposer. The land-side BGA is configured to interface with a first-level interconnect. The POP-side BGA is configured to interface with a POP substrate. Each of the two land-side pads has a different footprint than the respective two POP-side pads.