NANORIBBON-BASED QUANTUM DOT DEVICES
    4.
    发明公开

    公开(公告)号:US20230197833A1

    公开(公告)日:2023-06-22

    申请号:US17558207

    申请日:2021-12-21

    Abstract: Quantum dot devices and related methods and systems that use semiconductor nanoribbons arranged in a grid where a plurality of first nanoribbons, substantially parallel to one another, intersect a plurality of second nanoribbons, also substantially parallel to one another but at an angle with respect to the first nanoribbons, are disclosed. Different gates at least partially wrap around individual portions of the first and second nanoribbons, and at least some of the gates are provided at intersections of the first and second nanoribbons. Unlike previous approaches to quantum dot formation and manipulation, nanoribbon-based quantum dot devices provide strong spatial localization of the quantum dots, good scalability in the number of quantum dots included in the device, and/or design flexibility in making electrical connections to the quantum dot devices to integrate the quantum dot devices in larger computing devices.

    LOW-RESISTANCE VIA STRUCTURES
    8.
    发明申请

    公开(公告)号:US20250006592A1

    公开(公告)日:2025-01-02

    申请号:US18217208

    申请日:2023-06-30

    Abstract: Techniques to form low-resistance vias are discussed. In an example, semiconductor devices of a given row each include a semiconductor region extending in a first direction between corresponding source or drain regions, and a gate structure extending in a second direction over the semiconductor regions. Any semiconductor device may be separated from an adjacent semiconductor device along the second direction by a dielectric structure, through which a via passes. The via may include a conductive portion that extends through a dielectric wall in a third direction along at least an entire thickness of the gate structure. The conductive portion includes a conductive liner directly on the dielectric wall and a conductive fill on the conductive liner. The conductive liner comprises a pure elemental metal, such as tungsten, molybdenum, ruthenium, or a nickel aluminum alloy, with no metal nitride or barrier layer present between the conductive liner and the dielectric wall.

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