知搜-全球专利检索

  1. Login
  2. Sign Up

Search Results

10 records (took 0.035 seconds)

    Apparatus and method for temperature-constrained frequency control and scheduling
    1.
    发明授权
    Apparatus and method for temperature-constrained frequency control and scheduling 有权

    公开(公告)号：US12235792B2

    公开(公告)日：2025-02-25

    申请号：US18128852

    申请日：2023-03-30

    Applicant: Intel Corporation

    Inventor： Jianwei Dai ,  Somvir Singh Dahiya ,  Mahesh Kumar P ,  Stephen H. Gunther ,  Sapumal Wijeratne ,  Mark Gallina

    IPC: G06F9/50 ,  G06F1/324 ,  G06F9/48 ,  G06F15/78

    Abstract: An apparatus and method for temperature-constrained frequency control and scheduling. For example, one embodiment of a processor comprises: a plurality of cores; power management circuitry to control a frequency of each core of the plurality of cores based, at least in part, on a temperature associated with one or more cores of the plurality of cores, the power management circuitry comprising: a temperature limit-driven frequency controller to determine a first frequency limit value based on a temperature of a corresponding core reaching a first threshold; frequency prediction hardware logic to predict a temperature-constrained frequency of the corresponding core based on the first frequency limit value and an initial frequency limit value; and performance determination hardware logic to determine a new performance value for the corresponding core based on the temperature-constrained frequency, the new performance value to be provided to a task scheduler.

    METHODS AND APPARATUS FOR IN-FIELD THERMAL CALIBRATION
    5.
    发明申请
    METHODS AND APPARATUS FOR IN-FIELD THERMAL CALIBRATION 有权

    公开(公告)号：US20220114318A1

    公开(公告)日：2022-04-14

    申请号：US17557031

    申请日：2021-12-20

    Applicant: Intel Corporation

    Inventor： Mark Gallina ,  Jianfang Zhu ,  Kristoffer Fleming ,  Akhllesh Rallabandi ,  Jianwei Dai

    IPC: G06F30/39 ,  G01K15/00

    Abstract: Methods and apparatus for in-field thermal calibration are disclosed. A disclosed example apparatus includes instructions, memory in the apparatus, and processor circuitry. The processor circuitry is to execute the instructions to determine that a system on chip (SOC) package is deployed, the SOC package deployed with a default first thermal model, in response to the determination that the SOC package is deployed, monitor at least one temperature of the SOC package from a sensor and power usage of the SOC package, calibrate a second thermal model based on the at least one temperature and the power usage, and publish the calibrated second thermal model for control of the SOC package.

    Enhanced systems and methods for improved heat transfer from semiconductor packages
    7.
    发明授权
    Enhanced systems and methods for improved heat transfer from semiconductor packages 有权

    公开(公告)号：US11545410B2

    公开(公告)日：2023-01-03

    申请号：US16222854

    申请日：2018-12-17

    Applicant: Intel Corporation

    Inventor： Mark MacDonald ,  David Pidwerbecki ,  Mark Gallina ,  Jerrod Peterson

    IPC: H01L23/34 ,  H01L23/367 ,  H01L23/373 ,  H01L23/42 ,  H01L23/40 ,  H01L23/24 ,  H01L23/473

    Abstract: Enhanced thermal energy transfer systems for semiconductor packages are provided. A thermally conductive member is disposed in the interstitial space between an upper surface of a semiconductor package and a lower surface of a thermal member. The thermally conductive member is disposed above a first portion of the upper surface of the semiconductor package having a relatively higher thermal energy output when the semiconductor package is operating. A thermal interface material is disposed in the interstitial space and a force applied to the thermal member. The thermally conductive member forms a relatively higher pressure region above the first portion of the semiconductor package and a relatively lower pressure region in other portions of the semiconductor package remote from the thermally conductive member. The increased pressure region proximate the thermally conductive member beneficially enhances the flow of thermal energy from the first portion of the semiconductor package to the thermal member.

    ENHANCED SYSTEMS AND METHODS FOR IMPROVED HEAT TRANSFER FROM SEMICONDUCTOR PACKAGES
    9.
    发明申请
    ENHANCED SYSTEMS AND METHODS FOR IMPROVED HEAT TRANSFER FROM SEMICONDUCTOR PACKAGES 审中-公开

    公开(公告)号：US20190139855A1

    公开(公告)日：2019-05-09

    申请号：US16222854

    申请日：2018-12-17

    Applicant: Intel Corporation

    Inventor： Mark MacDonald ,  David Pidwerbecki ,  Mark Gallina ,  Jerrod Peterson

    IPC: H01L23/367 ,  H01L23/373

    Abstract: Enhanced thermal energy transfer systems for semiconductor packages are provided. A thermally conductive member is disposed in the interstitial space between an upper surface of a semiconductor package and a lower surface of a thermal member. The thermally conductive member is disposed above a first portion of the upper surface of the semiconductor package having a relatively higher thermal energy output when the semiconductor package is operating. A thermal interface material is disposed in the interstitial space and a force applied to the thermal member. The thermally conductive member forms a relatively higher pressure region above the first portion of the semiconductor package and a relatively lower pressure region in other portions of the semiconductor package remote from the thermally conductive member. The increased pressure region proximate the thermally conductive member beneficially enhances the flow of thermal energy from the first portion of the semiconductor package to the thermal member.

    Thermal energy storage, dissipation and EMI suppression for integrated circuits using porous graphite sheets and phase change material
    10.
    发明授权
    Thermal energy storage, dissipation and EMI suppression for integrated circuits using porous graphite sheets and phase change material 有权
    使用多孔石墨片和相变材料的集成电路的热能储存，消散和EMI抑制

    公开(公告)号：US09501112B2

    公开(公告)日：2016-11-22

    申请号：US14125654

    申请日：2013-08-10

    Applicant: Intel Corporation

    Inventor： Daryl Nelson ,  Kevin Daniel ,  Daniel Chiang ,  Mark Gallina ,  Steven Lofland

    IPC: G06F1/20

    CPC classification number: G06F1/206 ,  G06F1/203 ,  G06F2200/201

    Abstract: Mobile platforms and methods may provide for an integrated circuit such as a system on chip (SoC), a first heat spreader thermally coupled to the integrated circuit and a phase change material configuration thermally coupled to the first heat spreader. The integrated circuit may include logic to operate the integrated circuit in a performance burst mode according to a duty cycle, wherein the performance burst mode causes a phase change material to enter a liquid state within a graphite matrix of the phase change material configuration.

    Abstract translation: 移动平台和方法可以提供诸如片上系统（SoC）的集成电路，热耦合到集成电路的第一散热器和热耦合到第一散热器的相变材料配置。 集成电路可以包括根据占空比以性能突发模式操作集成电路的逻辑，其中性能突发模式导致相变材料在相变材料配置的石墨矩阵内进入液态。

Patent Agency Ranking