公开(公告)号：US20230305057A1

公开(公告)日：2023-09-28

申请号：US17701323

申请日：2022-03-22

Applicant: Intel Corporation

Inventor： Xianghong Tong ,  Martin Von Haartman ,  Zhiyong Ma ,  Jennifer J. Huening ,  Hyuk Ju Ryu ,  Christopher Morgan ,  Shuai Zhao ,  Ramune Nagisetty ,  Tuyen K. Tran ,  Wen-Hsien Chuang

IPC: G01R31/307 ,  G01R1/073

CPC classification number: G01R31/307 ,  G01R1/07342

Abstract: Wafer level electron beam prober systems, devices, and techniques, are described herein related to providing wafer level testing for fabricated device structures. Such wafer level testing contacts a first side of a die of a wafer with a probe to provide test signals to the die under test and performs e-beam imaging of the first side of the die while the test signals are provided to the die under test.