公开(公告)号：US10763218B2

公开(公告)日：2020-09-01

申请号：US16079105

申请日：2016-03-24

Applicant: Intel Corporation

Inventor： Sruti Chigullapalli ,  Leslie Fitch ,  Boping Wu

IPC: H01L23/552 ,  H01L23/60 ,  H01L23/10 ,  H01L23/367 ,  H01L23/498 ,  H01L25/065 ,  H05K9/00 ,  H05K7/20 ,  H01L23/42

Abstract: An electrical device includes at least one electrical component arranged on a carrier substrate and sidewalls of an electromagnetic shielding encapsulation arranged on the carrier substrate. The sidewalls of the electromagnetic shielding encapsulation laterally surround the at least one electrical component. Further, the electrical device includes a heat sink mounted to the sidewalls of the electromagnetic shielding encapsulation. The heat sink forms a cap of the electromagnetic shielding encapsulation and the heat sink includes surface-enlarging structures at a front side of the heat sink.

公开(公告)号：US10228418B2

公开(公告)日：2019-03-12

申请号：US15126988

申请日：2014-04-21

Applicant: INTEL CORPORATION

Inventor： Sruti Chigullapalli ,  Rene J. Sanchez ,  Nader N. Abazarnia ,  Todd R. Coons ,  Tuan Hoong Goh

IPC: G01R31/28 ,  G01R1/04

Abstract: Embodiments of alignment fixtures for integrated circuit (IC) packages, and related techniques, are disclosed herein. In some embodiments, an alignment fixture for an IC package may include: a first socket having a recess dimensioned to receive a first surface of the IC package and having a first magnet arrangement disposed outside of the recess, wherein the IC package has a second surface opposite to the first surface and has a first electrical contact element on the second surface; and a second socket having a second electrical contact element and having a second magnet arrangement. The first and second electrical contact elements may be aligned when the IC package is disposed in the recess, the IC package is disposed between the first and second sockets, and the first magnet arrangement is in a predetermined equilibrium relation with the second magnet arrangement to mate the first and second sockets.

公开(公告)号：US20190074252A1

公开(公告)日：2019-03-07

申请号：US16079105

申请日：2016-03-24

Applicant: Intel Corporation

Inventor： Sruti Chigullapalli ,  Leslie Fitch ,  Boping Wu

IPC: H01L23/552 ,  H01L23/10 ,  H01L23/367 ,  H01L23/60

CPC classification number: H01L23/552 ,  H01L23/10 ,  H01L23/367 ,  H01L23/42 ,  H01L23/49827 ,  H01L23/60 ,  H01L25/065 ,  H01L25/0655 ,  H01L2224/16227 ,  H01L2224/73253 ,  H05K7/20409 ,  H05K9/0015 ,  H05K9/0032

Abstract: An electrical device includes at least one electrical component arranged on a carrier substrate and sidewalls of an electromagnetic shielding encapsulation arranged on the carrier substrate. The sidewalls of the electromagnetic shielding encapsulation laterally surround the at least one electrical component. Further, the electrical device includes a heat sink mounted to the sidewalls of the electromagnetic shielding encapsulation. The heat sink forms a cap of the electromagnetic shielding encapsulation and the heat sink includes surface-enlarging structures at a front side of the heat sink.