公开(公告)号：US20170015804A1

公开(公告)日：2017-01-19

申请号：US14800932

申请日：2015-07-16

Applicant: Dow Global Technologies LLC ,  Rohm and Haas Electronic Materials LLC ,  Rohm and Haas Company

Inventor： Mubasher A. Bashir ,  Michael A. De Graaf ,  Lujia Bu ,  Kinga Scieranka ,  Marianne P. Creamer

IPC: C08K3/08 ,  B05D1/12 ,  B05D7/14 ,  B05D3/10 ,  B05D5/00 ,  B05D1/06 ,  B05D3/02

CPC classification number: C08K3/08 ,  B05D1/06 ,  B05D1/12 ,  B05D3/0254 ,  B05D3/107 ,  B05D5/00 ,  B05D7/14 ,  B22F1/0022 ,  B22F2998/10 ,  B82Y30/00 ,  C08K9/08 ,  C08K2003/0806 ,  C09D5/38 ,  C09D7/62 ,  C09D7/67 ,  C09D11/00 ,  C09D11/322 ,  C09D11/52 ,  B22F3/10

Abstract: Compositions of nanoparticles are stabilized by capping agents which are composed of methacrylic acid and n-butylmethacrylate random copolymers having hydrophobic and hydrophilic moieties and low molecular weight. The nanoparticle compositions have low viscosity, high nanoparticle loading and may be selectively applied to substrates by methods such as inkjet, aerosol and electrospinning

Abstract translation: 纳米颗粒的组成由具有疏水和亲水部分和低分子量的甲基丙烯酸和甲基丙烯酸正丁酯无规共聚物组成的封端剂稳定化。 纳米颗粒组合物具有低粘度，高纳米颗粒负载，并且可以通过诸如喷墨，气溶胶和静电纺丝的方法选择性地施加到基底

公开(公告)号：US20180147603A1

公开(公告)日：2018-05-31

申请号：US15578311

申请日：2016-06-21

Applicant: Dow Global Technologies LLC

Inventor： Joseph Renny ,  Michael A. De Graaf ,  Mubasher A. Bashir ,  Jerome Claracq ,  Stefan J. Prot

IPC: B05D3/06 ,  C09D11/52 ,  C08J7/06 ,  B05D1/00 ,  B05D3/10 ,  B22F1/00 ,  H01B1/22 ,  H05B3/14 ,  H05B3/26

CPC classification number: B05D3/06 ,  B05D1/007 ,  B05D3/107 ,  B22F1/0018 ,  B22F1/0022 ,  B22F1/0062 ,  B22F9/24 ,  B22F2003/1052 ,  B22F2007/042 ,  B22F2301/255 ,  B22F2304/054 ,  B22F2998/10 ,  C08J7/06 ,  C08J2367/02 ,  C09D5/24 ,  C09D11/037 ,  C09D11/322 ,  C09D11/52 ,  C22C5/00 ,  C22C5/06 ,  H01B1/22 ,  H05B3/141 ,  H05B3/145 ,  H05B3/262 ,  H05B3/267 ,  H05B3/84 ,  H05B2203/013 ,  H05B2203/017 ,  H05B2214/04 ,  H05K1/097 ,  H05K3/1283 ,  H05K2203/1131 ,  B22F3/1025 ,  B22F2003/241 ,  B22F2003/1042

Abstract: The material properties of structures made with conductive nanoparticles are enhanced by radiation sintering followed by chemical sintering. The conductive nanoparticles may be applied to substrates by methods such as screen printing, inkjet, aerosol and electrospinning and then sintering the conductive nanoparticles on the substrates.