公开(公告)号：US20250056920A1

公开(公告)日：2025-02-13

申请号：US18797189

申请日：2024-08-07

Applicant: Applied Materials, Inc.

Inventor： Peiwen LIU ,  Uma SRIDHAR ,  Hyunsung BANG ,  Kai DING ,  Jeffrey L. FRANKLIN ,  Mingwei ZHU ,  Hou T. NG ,  Nag B. PATIBANDLA

IPC: H01L33/00 ,  H01L25/075

Abstract: The present disclosure provides devices and methods for repairing dice during micro-LED display fabrication. The devices include a backplane. The backplane has a plurality of backplane electrodes. Each backplane electrode includes a first material. A plurality of micro-LEDs having a plurality of micro-LED electrodes is included in the device. Each micro-LED electrode includes a second material. Each micro-LED electrode is bonded to each backplane electrode with an alloy of the first material and the second material therebetween. At least one backplane electrode is bonded to the micro-LED electrode via a repair material. The device includes a plurality of subpixel isolation (SI) structures formed over the backplane. The SI structures define wells of sub-pixels. Each well includes a respective micro-LED between adjacent SI structures. The sub-pixels have a color conversion material disposed in the wells.