公开(公告)号：US20200071832A1

公开(公告)日：2020-03-05

申请号：US16539317

申请日：2019-08-13

Applicant: Applied Materials, Inc.

Inventor： Shu-Kwan LAU ,  Lit Ping LAM ,  Preetham RAO ,  Kartik SHAH ,  Ian ONG ,  Nyi O. MYO ,  Brian H. BURROWS

IPC: C23C16/455 ,  C23C16/458 ,  C23C16/46

Abstract: Embodiments described herein generally relate to apparatus for fabricating semiconductor devices. A gas injection apparatus is coupled to a first gas source and a second gas source. Gases from the first gas source and second gas source may remain separated until the gases enter a process volume in a process chamber. A coolant is flowed through a channel in the gas injection apparatus to cool the first gas and the second gas in the gas injection apparatus. The coolant functions to prevent thermal decomposition of the gases by mitigating the influence of thermal radiation from the process chamber. In one embodiment, the channel surrounds a first conduit with the first gas and a second conduit with the second gas.

公开(公告)号：US20230027683A1

公开(公告)日：2023-01-26

申请号：US17961040

申请日：2022-10-06

Applicant: Applied Materials, Inc.

Inventor： Shu-Kwan LAU ,  Lit Ping LAM ,  Preetham RAO ,  Kartik SHAH ,  Ian ONG ,  Nyi O. MYO ,  Brian H. BURROWS

IPC: C23C16/455 ,  C23C16/46 ,  C23C16/458

Abstract: Embodiments described herein generally relate to apparatus for fabricating semiconductor devices. A gas injection apparatus is coupled to a first gas source and a second gas source. Gases from the first gas source and second gas source may remain separated until the gases enter a process volume in a process chamber. A coolant is flowed through a channel in the gas injection apparatus to cool the first gas and the second gas in the gas injection apparatus. The coolant functions to prevent thermal decomposition of the gases by mitigating the influence of thermal radiation from the process chamber. In one embodiment, the channel surrounds a first conduit with the first gas and a second conduit with the second gas.

公开(公告)号：US20210130948A1

公开(公告)日：2021-05-06

申请号：US16673196

申请日：2019-11-04

Applicant: Applied Materials, Inc.

Inventor： Lit Ping LAM ,  Sriskantharajah THIRUNAVUKARASU ,  Ian ONG

IPC: C23C16/44 ,  B33Y80/00 ,  B22F3/105 ,  B81C1/00

Abstract: Disclosed are embodiments for an engineered feature formed as a part of or on a chamber component. In one embodiment, a chamber component for a processing chamber includes a component part body having unitary monolithic construction. The component part body has an outer surface. An engineered complex surface is formed on the outer surface. The engineered complex surface has a first lattice framework formed from a plurality of first interconnected laths and a plurality of first openings are bounded by three or more laths of the plurality of laths.