公开(公告)号：US11049755B2

公开(公告)日：2021-06-29

申请号：US16131972

申请日：2018-09-14

Applicant: Applied Materials, Inc.

Inventor： David Benjaminson ,  Michael Grace ,  Soonam Park ,  Dmitry Lubomirsky ,  Jaeyong Cho ,  Nikolai Kalnin ,  Don Channa K Kaluarachchi

IPC: H01L21/683 ,  H01L21/67 ,  H01J37/32

Abstract: Exemplary support assemblies may include a top puck defining a substrate support surface, where the top puck is also characterized by a height. The assemblies may include a stem coupled with the top puck on a second surface of the top puck opposite the substrate support surface. The assemblies may include an RF electrode embedded within the top puck proximate the substrate support surface. The assemblies may include a heater embedded within the top puck. The assemblies may also include a ground shield embedded within the top puck. The ground shield may be characterized by an inner region extending radially through the top puck. The ground shield may further be characterized by an outer region extending perpendicular to the inner region.