公开(公告)号：US10453657B2

公开(公告)日：2019-10-22

申请号：US15642002

申请日：2017-07-05

Applicant: APPLIED MATERIALS, INC.

Inventor： Daping Yao ,  Hyman W. H. Lam ,  John C. Forster ,  Jiang Lu ,  Can Xu ,  Dien-Yeh Wu ,  Paul F. Ma ,  Mei Chang

IPC: H01J37/32 ,  C23C16/513 ,  C23C16/505 ,  C23C16/52 ,  C23C16/455 ,  C23C16/509 ,  C23C16/06

Abstract: Embodiments of a gas delivery apparatus for use in a radio frequency (RF) processing apparatus are provided herein. In some embodiments, a gas delivery apparatus for use in a radio frequency (RF) processing apparatus includes: a conductive gas line having a first end and a second end; a first flange coupled to the first end; a second flange coupled to the second end, wherein the conductive gas line extends through and between the first and second flanges; and a block of ferrite material surrounding the conductive gas line between the first and second flanges.

公开(公告)号：US11133155B2

公开(公告)日：2021-09-28

申请号：US16578602

申请日：2019-09-23

Applicant: APPLIED MATERIALS, INC.

Inventor： Daping Yao ,  Hyman W. H. Lam ,  John C. Forster ,  Jiang Lu ,  Can Xu ,  Dien-Yeh Wu ,  Paul F. Ma ,  Mei Chang

IPC: C23C16/52 ,  H01J37/32 ,  C23C16/513 ,  C23C16/505 ,  C23C16/455 ,  C23C16/509 ,  C23C16/06

Abstract: Embodiments of a gas delivery apparatus for use in a radio frequency (RF) processing apparatus are provided herein. In some embodiments, a gas delivery apparatus for use in a radio frequency (RF) processing apparatus includes: a conductive gas line having a first end and a second end; a first flange coupled to the first end; a second flange coupled to the second end, wherein the conductive gas line extends through and between the first and second flanges; and a block of ferrite material surrounding the conductive gas line between the first and second flanges.

公开(公告)号：US10752990B2

公开(公告)日：2020-08-25

申请号：US15471291

申请日：2017-03-28

Applicant: Applied Materials, Inc.

Inventor： Daping Yao ,  Kenric Choi ,  Xiaoxiong Yuan ,  Jiang Lu ,  Can Xu ,  Paul F. Ma ,  Mei Chang

IPC: C23C16/455 ,  C23C16/44 ,  C23C16/448 ,  C23C16/18 ,  F16K31/12 ,  F16K31/60

Abstract: Apparatus and methods for supplying a gas to a processing chamber are described. The apparatus comprises an inlet line and an outlet line, each with two valves, in fluid communication an ampoule. A bypass line connects the inlet valve and outlet valve closest to the ampoule. The apparatus and methods of use allow a precursor residue to be removed from the delivery lines of a processing chamber.

公开(公告)号：US10600685B2

公开(公告)日：2020-03-24

申请号：US15823422

申请日：2017-11-27

Applicant: APPLIED MATERIALS, INC.

Inventor： Daping Yao ,  Jiang Lu ,  Can Xu ,  Paul F. Ma ,  Mei Chang

IPC: H01L21/44 ,  H01L21/768 ,  H01L23/532 ,  H01L21/285

Abstract: In some embodiments, a method of forming a cobalt layer on a substrate disposed in a process chamber, includes: (a) exposing the substrate to a first process gas comprising a cobalt precursor and a hydrogen containing gas to grow a smooth cobalt layer on a first surface of the substrate and on sidewalls and a bottom surface of a feature formed in the first surface of the substrate; (b) purging the first process gas from the process chamber; and (c) annealing the substrate in a hydrogen atmosphere to fill in voids within the cobalt layer to form a void-free cobalt layer. In some embodiments, plasma treating the substrate in gas under low pressure and/or thermally baking the substrate in gas in an atmosphere under a low pressure, may be performed prior to anneal.

公开(公告)号：US20170275754A1

公开(公告)日：2017-09-28

申请号：US15471291

申请日：2017-03-28

Applicant: Applied Materials, Inc.

Inventor： Daping Yao ,  Kenric Choi ,  Xiaoxiong Yuan ,  Jiang Lu ,  Can Xu ,  Paul F. Ma ,  Mei Chang

IPC: C23C16/455 ,  F16K31/60 ,  F16K31/12

Abstract: Apparatus and methods for supplying a gas to a processing chamber are described. The apparatus comprises an inlet line and an outlet line, each with two valves, in fluid communication an ampoule. A bypass line connects the inlet valve and outlet valve closest to the ampoule. The apparatus and methods of use allow a precursor residue to be removed from the delivery lines of a processing chamber.