NOISE MITIGATION FOR HEAD-MOUNTED DEVICE

    公开(公告)号:US20220394889A1

    公开(公告)日:2022-12-08

    申请号:US16783049

    申请日:2020-02-05

    Applicant: Apple Inc.

    Abstract: A head-mounted device can effectively manage heat while also managing noise output in a manner that reduces the user's perception thereof. For example, a support member extending across a flow channel can provide multiple sections with different profiles and/or cross-sectional dimensions within the flow channel. Each of the profiles and/or cross-sectional dimensions can generate tonal noises at different frequencies, so that the tonal noises generated are distributed across multiple frequencies to mask such tonal noises among broadband noises that are generated by the head-mounted device. Such a support member can be moveably positioned within the flow channel and rigidly coupled to other components of the head-mounted device. Such a support member can also be used to draw heat away from other components of the head-mounted device to be dissipated by the flow of air within the flow channel.

    Electronic devices with stacked circuitry

    公开(公告)号:US11871517B1

    公开(公告)日:2024-01-09

    申请号:US17200608

    申请日:2021-03-12

    Applicant: Apple Inc.

    CPC classification number: H05K1/147 H05K1/189 H05K2201/10128

    Abstract: An electronic device may have a display with an array of pixels for displaying images. The electronic device may also have a lens through which the images are viewable on the display. The display may have a display panel that is mounted to a printed circuit stack. The printed circuit stack may include multiple printed circuit layers to which components are mounted. The components may include an orientation sensor overlapped by the display panel. A camera may be mounted to a printed circuit stack and may overlap one or more electrical components such as an orientation sensor. The printed circuit stacks may include rigid and flexible printed circuits coupled together using solder and other conductive connections. Air gaps may be created between stacked printed circuit layers.

Patent Agency Ranking