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1.发明申请HYBRID SYSTEM AND METHOD FOR DETERMINING PERFORMANCE LEVELS BASED ON THERMAL CONDITIONS WITHIN A PROCESSOR 有权基于处理器中的热条件确定性能水平的混合系统和方法公开(公告)号：US20150331433A1
公开(公告)日：2015-11-19
申请号：US14277394
申请日：2014-05-14
Applicant: ADVANCED MICRO DEVICES, INC.
Inventor： Samuel D. Naffziger , Benjamin D. Bates , Praveen K. Dongara
CPC classification number: G05B15/02 , G05D23/306 , G06F1/206 , G06F1/3206 , G06F1/324 , G06F1/3243 , G06F1/3296 , Y02D10/126 , Y02D10/152 , Y02D10/16 , Y02D10/172
Abstract: A system and method for efficient management of operating modes within an integrated circuit (IC) for optimal power and performance targets. A semiconductor chip includes one or more processing units each of which operates with respective operating parameters. One or more temperature sensors are included to measure a temperature of the one or more processing units during operation. When the measured temperature exceeds a threshold, a power manager on the chip determines a temperature headroom utilizing temperature values based on worst-case ambient temperature. When the measured temperature does not exceed the threshold, the power manager determines the temperature headroom utilizing at least one temperature value based on room ambient temperature. Following, the power manager adjusts the respective operating parameters based on at least the temperature headroom.
Abstract translation: 一种用于在集成电路（IC）内高效管理工作模式以实现最佳功率和性能目标的系统和方法。 半导体芯片包括一个或多个处理单元，每个处理单元以各自的操作参数进行操作。 包括一个或多个温度传感器以测量操作期间一个或多个处理单元的温度。 当测量温度超过阈值时，芯片上的电源管理器使用基于最坏情况环境温度的温度值来确定温度上升空间。 当测量的温度不超过阈值时，功率管理器使用基于室内环境温度的至少一个温度值来确定温度净空。 以下，功率管理器至少基于温度上升空间来调节相应的操作参数。
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公开(公告)号：US09652019B2
公开(公告)日：2017-05-16
申请号：US14293520
申请日：2014-06-02
Applicant: Advanced Micro Devices, Inc. , ATI Technologies ULC
Inventor： Praveen K. Dongara , Aniruddha Dasgupta , Adam Clark
CPC classification number: G06F1/3206 , G06F1/206 , G06F1/324 , G06F1/3296 , Y02D10/126 , Y02D10/16 , Y02D10/172
Abstract: A system and method for efficient management of operating modes within an integrated circuit (IC) for optimal power and performance targets. A semiconductor chip includes processing units each of which operates with respective operating parameters. Temperature sensors are included to measure a temperature of the one or more processing units during operation. A power manager determines a calculated power value independent of thermal conditions and current draw. The power manager reads each of a first thermal design power (TDP) value for the processing units and a second TDP value for a platform housing the semiconductor chip. The power manager determines a ratio of the first TDP value to the second TDP value. Additionally, the power manager determines another ratio of the first TDP value to the calculated power value. Using the measured temperature, the ratios and the calculated power value, the power manager determines a manner to adjust the operating parameters.
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公开(公告)号：US09671767B2
公开(公告)日：2017-06-06
申请号：US14277394
申请日：2014-05-14
Applicant: Advanced Micro Devices, Inc.
Inventor： Samuel D. Naffziger , Benjamin D. Bates , Praveen K. Dongara
CPC classification number: G05B15/02 , G05D23/306 , G06F1/206 , G06F1/3206 , G06F1/324 , G06F1/3243 , G06F1/3296 , Y02D10/126 , Y02D10/152 , Y02D10/16 , Y02D10/172
Abstract: A system and method for efficient management of operating modes within an integrated circuit (IC) for optimal power and performance targets. A semiconductor chip includes one or more processing units each of which operates with respective operating parameters. One or more temperature sensors are included to measure a temperature of the one or more processing units during operation. When the measured temperature exceeds a threshold, a power manager on the chip determines a temperature headroom utilizing temperature values based on worst-case ambient temperature. When the measured temperature does not exceed the threshold, the power manager determines the temperature headroom utilizing at least one temperature value based on room ambient temperature. Following, the power manager adjusts the respective operating parameters based on at least the temperature headroom.
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4.发明申请SYSTEM AND METHOD FOR ADJUSTING PERFORMANCE BASED ON THERMAL CONDITIONS WITHIN A PROCESSOR 有权基于处理器中的热条件调节性能的系统和方法公开(公告)号：US20150346798A1
公开(公告)日：2015-12-03
申请号：US14293520
申请日：2014-06-02
Applicant: Advanced Micro Devices, Inc. , ATI Technologies ULC
Inventor： Praveen K. Dongara , Aniruddha Dasgupta , Adam Clark
CPC classification number: G06F1/3206 , G06F1/206 , G06F1/324 , G06F1/3296 , Y02D10/126 , Y02D10/16 , Y02D10/172
Abstract: A system and method for efficient management of operating modes within an integrated circuit (IC) for optimal power and performance targets. A semiconductor chip includes processing units each of which operates with respective operating parameters. Temperature sensors are included to measure a temperature of the one or more processing units during operation. A power manager determines a calculated power value independent of thermal conditions and current draw. The power manager reads each of a first thermal design power (TDP) value for the processing units and a second TDP value for a platform housing the semiconductor chip. The power manager determines a ratio of the first TDP value to the second TDP value. Additionally, the power manager determines another ratio of the first TDP value to the calculated power value. Using the measured temperature, the ratios and the calculated power value, the power manager determines a manner to adjust the operating parameters.
Abstract translation: 一种用于在集成电路（IC）内高效管理工作模式以实现最佳功率和性能目标的系统和方法。 半导体芯片包括处理单元，每个处理单元以各自的操作参数进行操作。 包括温度传感器以测量操作期间一个或多个处理单元的温度。 功率管理器确定独立于热条件和电流消耗的计算功率值。 功率管理器读取处理单元的第一热设计功率（TDP）值和用于容纳半导体芯片的平台的第二TDP值。 电源管理器确定第一TDP值与第二TDP值的比率。 此外，功率管理器确定第一TDP值与计算的功率值的另一比率。 使用测量的温度，比率和计算的功率值，功率管理器确定调整操作参数的方式。
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