公开(公告)号：US20170363969A1

公开(公告)日：2017-12-21

申请号：US15527645

申请日：2015-09-21

Applicant: ASML NETHERLANDS B.V.

Inventor： Marc HAUPTMANN ,  Dylan John David DAVIES ,  Paul JANSSEN ,  Naoko TSUGAMA ,  Richard Joseph BRULS ,  Kornelis Tijmen HOEKERD ,  Edwin Johannes Maria JANSSEN ,  Petrus Johannes VAN DEN OEVER ,  Ronald VAN DER WILK ,  Antonius Hubertus VAN SCHIJNDEL ,  Jorge Alberto VIEYRA SALAS

IPC: G03F7/20 ,  G01N27/61

CPC classification number: G03F7/70616 ,  G01N21/9501 ,  G01N27/61 ,  G01N2021/95676 ,  G03F1/84 ,  G03F7/70508 ,  G03F7/70783 ,  H01L22/12 ,  H01L22/20

Abstract: A diagnostic apparatus monitors a lithographic manufacturing system. First measurement data representing local deviations of some characteristic across a substrate is obtained using sensors within a lithographic apparatus, and/or a separate metrology tool. Other inspection tools perform substrate backside inspection to produce second measurement data. A high-resolution backside defect image is processed into a form in which it can be compared with lower resolution information from the first measurement data. Cross-correlation is performed to identify which of the observed defects are correlated spatially with the deviations represented in the first measurement data. A correlation map is used to identify potentially relevant clusters of defects in the more detailed original defect map. The responsible apparatus can be identified by pattern recognition as part of an automated root cause analysis. Alternatively, reticle inspection data may be used as second measurement data.

公开(公告)号：US20220028648A1

公开(公告)日：2022-01-27

申请号：US17497761

申请日：2021-10-08

Applicant: ASML Netherlands B.V.

Inventor： Han Willem Hendrik SEVERT ,  Jan-Gerard Cornelis VAN DER TOORN ,  Ronald VAN DER WILK ,  Allard Eelco KOOIKER

IPC: H01J37/20 ,  H01J37/26 ,  H01J37/28

Abstract: A stage apparatus for a particle-beam apparatus is disclosed. A particle beam apparatus may comprise a conductive object and an object table, the object table being configured to support an object. The object table comprises a table body and a conductive coating, the conductive coating being provided on at least a portion of a surface of the table body. The conductive object is disposed proximate to the conductive coating and the table body is provided with a feature proximate to an edge portion of the conductive coating. Said feature is arranged so as to reduce an electric field strength in the vicinity of the edge portion of the conductive coating when a voltage is applied to both the conductive object and the conductive coating.

公开(公告)号：US20220277926A1

公开(公告)日：2022-09-01

申请号：US17753298

申请日：2020-08-25

Applicant: ASML Netherlands B.V.

Inventor： Yixiang WANG ,  Shibing LIU ,  Shanhui CAO ,  Kangsheng QIU ,  Juying DOU ,  Ying LUO ,  Yinglong LI ,  Qiang LI ,  Ronald VAN DER WILK ,  Jan-Gerard Cornelis VAN DER TOORN

IPC: H01J37/20 ,  H01L21/683

Abstract: Systems and methods for wafer grounding and wafer grounding location adjustment are disclosed. A first method may include receiving a first value of an electric characteristic associated with the wafer being grounded by an electric signal; determining a first control parameter using at least the first value; and controlling a characteristic of the electric signal using the first control parameter and the first value. A second method for adjusting a grounding location for a wafer may include terminating an electric connection between the wafer and at least one grounding pin in contact the wafer; adjusting a relative position between the wafer and the grounding pin; and restoring the electric connection between the grounding pin and the wafer. A third method may include causing a grounding pin to penetrate through a coating on the wafer by impact; and establishing an electrical connection between the grounding pin and the wafer.

公开(公告)号：US20210175041A1

公开(公告)日：2021-06-10

申请号：US17140699

申请日：2021-01-04

Applicant: ASML Netherlands B.V.

Inventor： Ronald VAN DER WILK

IPC: H01J5/46 ,  C03C27/04 ,  H01J5/36 ,  H01J9/28

Abstract: A feedthrough for providing an electrical connection is provided. The feedthrough comprises a conductor and a quartz or a glass structure configured to surround at least a portion of the conductor and provide isolation to the conductor. The conductor and the quartz or glass structure may be coaxially arranged. The feedthrough can provide an electrical connection between an inside and outside of a vacuum chamber that contains a sample.

公开(公告)号：US20200185183A1

公开(公告)日：2020-06-11

申请号：US16703729

申请日：2019-12-04

Applicant: ASML Netherlands B.V.

Inventor： Ronald VAN DER WILK

IPC: H01J5/46 ,  H01J5/36 ,  C03C27/04 ,  H01J9/28

Abstract: A feedthrough for providing an electrical connection is provided. The feedthrough comprises a conductor and a quartz or a glass structure configured to surround at least a portion of the conductor and provide isolation to the conductor. The conductor and the quartz or glass structure may be coaxially arranged. The feedthrough can provide an electrical connection between an inside and outside of a vacuum chamber that contains a sample.

公开(公告)号：US20170205717A1

公开(公告)日：2017-07-20

申请号：US15302146

申请日：2015-03-02

Applicant: ASML NETHERLANDS B.V.

Inventor： Ronald VAN DER WILK ,  Ger-Wim Jan GOORHUIS

IPC: G03F7/20

CPC classification number: G03F7/70925 ,  H01L21/67028

Abstract: An apparatus for cleaning an object, the apparatus including: an object support for supporting the object; a low pressure chamber for exposing a first surface of the object to a low pressure when the object is arranged on the object support, an electrode arranged adjacent to and separated from the first surface of the object when the object is arranged on the object support, the electrode being in electrical communication with a surface of the object support which is adjacent the first surface of the object; and a power supply arranged to apply a voltage between the electrode and the object; thereby generating a discharge between the object and the electrode.

公开(公告)号：US20150370180A1

公开(公告)日：2015-12-24

申请号：US14762452

申请日：2014-02-05

Applicant: ASML HOLDING N.V. ,  ASML NETHERLANDS B.V.

Inventor： Santiago E. DEL PUERTO ,  Matthew LIPSON ,  Kenneth C. HENDERSON ,  Raymond Wilhelmus Louis LAFARRE ,  Louis John MARKOYA ,  Tammo UITTERDIJK ,  Johannes VERMEULEN ,  Antonius Franciscus Johannes DE GROOT ,  Ronald VAN DER WILK

IPC: G03F7/20

CPC classification number: G03F7/70875 ,  G03F7/70708 ,  H01L21/67109 ,  H01L21/6831 ,  H01L21/6875

Abstract: A support such as a clamp (310) is configured to releasably hold a patterning device such as a reticle (300) to secure it and prevent heat-induced deformation of it. For example, an electrostatic clamp includes a first substrate (312) having opposing first (313) and second (315) surfaces, a plurality of burls (316) located on the first surface and configured to contact the reticle, a second substrate (314) having opposing first (317) and second (319) surfaces. The first surface of the second substrate is coupled to the second surface of the first substrate. A plurality of cooling elements (318) are located between the first surface of the second substrate and the second surface of the first substrate. The cooling elements are configured to cause electrons to travel from the second surface of the first substrate to the first surface of the second substrate. Each cooling element is substantially aligned with a respective burl.

Abstract translation: 诸如夹具（310）的支撑件构造成可释放地保持图案形成装置例如掩模版（300）以固定它并防止其热引起的变形。 例如，静电夹具包括具有相对的第一（313）和第二（315）表面的第一基底（312），位于第一表面上并被构造成接触光罩的多个毛刺（316），第二基底 ）具有相对的第一（317）和第二（319）表面。 第二衬底的第一表面耦合到第一衬底的第二表面。 多个冷却元件（318）位于第二基板的第一表面和第一基板的第二表面之间。 冷却元件构造成使电子从第一衬底的第二表面行进到第二衬底的第一表面。 每个冷却元件基本上与相应的毛刺对齐。