公开(公告)号：US20180321602A1

公开(公告)日：2018-11-08

申请号：US15764594

申请日：2016-10-05

Applicant: ASML HOLDING N.V. ,  ASML NETHERLANDS B.V.

Inventor： Raymond Wilhelmus Louis LAFARRE ,  Adrianus Hendrik KOEVOETS ,  Michael Leo NELSON ,  Jacobus Cornelis Gerardus VAN DER SANDEN ,  Geoffrey O'CONNOR ,  Michael Andrew CHIEDA ,  Tammo UITTERDIJK

IPC: G03F7/20 ,  H01L21/683

CPC classification number: G03F7/70875 ,  G03F7/707 ,  G03F7/70783 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/67248 ,  H01L21/6831

Abstract: A lithographic apparatus includes a clamp (406) configured to receive an object (402). The clamp defines at least one channel (408) configured to pass a fluid at a first fluid temperature. The lithographic apparatus also includes a chuck (404) coupled to the clamp. The chuck (404) defines at least one void (464) configured to thermally insulate the chuck from the clamp.

公开(公告)号：US20200348606A1

公开(公告)日：2020-11-05

申请号：US16642927

申请日：2018-07-31

Applicant: ASML Holding N.V.

Inventor： Victor Antonio PEREZ-FALCON ,  Michael Andrew CHIEDA

IPC: G03F7/20

Abstract: Methods and systems are described for cleaning a support such as a clamp of a chuck that holds a patterning device or a wafer in a lithographic apparatus. The method includes loading a electrostatic cleaning substrate into a lithographic apparatus. The electrostatic cleaning substrate includes at least one electrode. The method further includes bringing the electrostatic cleaning substrate near to the clamping surface to be cleaned and connecting the electrode to a voltage source. Particles present on the support are then transferred to the electrostatic cleaning substrate.

公开(公告)号：US20220057723A1

公开(公告)日：2022-02-24

申请号：US17415715

申请日：2019-12-12

Applicant: ASML Holding N.V.

Inventor： Eric Justin MONKMAN ,  Michael Andrew CHIEDA ,  Stephen ROUX ,  Victor Antonio PEREZ-FALCON

IPC: G03F7/20

Abstract: An apparatus for reticle sub-field thermal control in a lithography system is disclosed. The apparatus includes a clamp configured to fix an object. The clamp includes a plurality of gas distribution features that are spatially arranged in a pattern. The apparatus further includes a gas pressure controller configured to individually control a gas flow rate through each of the plurality of gas distribution features to spatially modulate a gas pressure distribution in a space between the clamp and the object. The gas distribution features include a plurality of trenches or holes arranged in an array form.