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    BURLS WITH ALTERED SURFACE TOPOGRAPHY FOR HOLDING AN OBJECT IN LITHOGRAPHY APPLICATIONS
    1.
    发明申请
    BURLS WITH ALTERED SURFACE TOPOGRAPHY FOR HOLDING AN OBJECT IN LITHOGRAPHY APPLICATIONS 有权

    公开(公告)号：US20210202293A1

    公开(公告)日：2021-07-01

    申请号：US16756907

    申请日：2018-10-04

    Applicant: ASML HOLDING N.V.

    Inventor： Mehmet Ali AKBAS ,  David Hart PETERSON ,  Tammo UITTERDIJK ,  Michael PERRY ,  Richard Bryan LEWIS ,  Iliya SIGAL

    IPC: H01L21/687 ,  G03F7/20

    Abstract: Various burl designs for holding an object in a lithographic apparatus are described. A lithographic apparatus includes an illumination system, a first support structure, a second support structure, and a projection system. The illumination system is designed to receive radiation and to direct the radiation towards a patterning device that forms patterned radiation. The first support structure is designed to support the patterning device on the first support structure. The second support structure has a plurality of burls and is designed to support the substrate on the plurality of burls. A topography of a top surface of each of the plurality of burls is not substantially flat, such that a contact area between the substrate and each of the plurality of burls is reduced. The projection system is designed to receive the patterned radiation and to direct the patterned radiation towards the substrate.

    WAFER CLAMP HARD BURL PRODUCTION AND REFURBISHMENT
    2.
    发明申请
    WAFER CLAMP HARD BURL PRODUCTION AND REFURBISHMENT 有权

    公开(公告)号：US20230031443A1

    公开(公告)日：2023-02-02

    申请号：US17788806

    申请日：2020-12-08

    Applicant: ASML Holding N.V.

    Inventor： Matthew LIPSON ,  Mehmet Ali AKBAS ,  Tammo UITTERDIJK ,  Fei ZHAO

    IPC: G03F7/20

    Abstract: Systems, apparatuses, and methods are provided for manufacturing a wafer clamp having hard burls. The method can include providing a first layer that includes a first surface. The method can further include forming a plurality of burls over the first surface of the first layer. The forming of the plurality of burls can include forming a subset of the plurality of burls to a hardness of greater than about 6.0 gigapascals (GPa).

    SUB MICRON PARTICLE DETECTION ON BURL TOPS BY APPLYING A VARIABLE VOLTAGE TO AN OXIDIZED WAFER
    5.
    发明公开
    SUB MICRON PARTICLE DETECTION ON BURL TOPS BY APPLYING A VARIABLE VOLTAGE TO AN OXIDIZED WAFER 审中-公开

    公开(公告)号：US20230314962A1

    公开(公告)日：2023-10-05

    申请号：US18012317

    申请日：2021-06-04

    Applicant: ASML Holding N.V.

    Inventor： Tammo UITTERDIJK

    IPC: G03F7/20 ,  H01L21/67 ,  H01L21/683

    CPC classification number: G03F7/70783 ,  G03F7/70708 ,  H01L21/67288 ,  H01L21/6831

    Abstract: Systems, apparatuses, methods, and computer program products are provided for determining a free form flatness of a substrate table. An example system can include a substrate table that includes a first substrate table surface and a grounded substrate table electrical connection configured to ground the substrate table. The system can further include a substrate that includes a semiconducting layer, a thermally-grown insulating layer, a first substrate surface disposed on the insulating layer, and a substrate electrical connection configured to transmit a voltage to the semiconducting layer. The system can further include a metrology system configured to apply a voltage to the substrate electrical connection to electrostatically clamp the substrate to the substrate table, measure a flatness of the first substrate surface, and determine a free form flatness of the first substrate table surface based on the measured flatness of the first substrate surface.

    Lithographic Apparatus and Method
    10.
    发明申请
    Lithographic Apparatus and Method 有权
    平版印刷设备和方法

    公开(公告)号：US20150370180A1

    公开(公告)日：2015-12-24

    申请号：US14762452

    申请日：2014-02-05

    Applicant: ASML HOLDING N.V. ,  ASML NETHERLANDS B.V.

    Inventor： Santiago E. DEL PUERTO ,  Matthew LIPSON ,  Kenneth C. HENDERSON ,  Raymond Wilhelmus Louis LAFARRE ,  Louis John MARKOYA ,  Tammo UITTERDIJK ,  Johannes VERMEULEN ,  Antonius Franciscus Johannes DE GROOT ,  Ronald VAN DER WILK

    IPC: G03F7/20

    CPC classification number: G03F7/70875 ,  G03F7/70708 ,  H01L21/67109 ,  H01L21/6831 ,  H01L21/6875

    Abstract: A support such as a clamp (310) is configured to releasably hold a patterning device such as a reticle (300) to secure it and prevent heat-induced deformation of it. For example, an electrostatic clamp includes a first substrate (312) having opposing first (313) and second (315) surfaces, a plurality of burls (316) located on the first surface and configured to contact the reticle, a second substrate (314) having opposing first (317) and second (319) surfaces. The first surface of the second substrate is coupled to the second surface of the first substrate. A plurality of cooling elements (318) are located between the first surface of the second substrate and the second surface of the first substrate. The cooling elements are configured to cause electrons to travel from the second surface of the first substrate to the first surface of the second substrate. Each cooling element is substantially aligned with a respective burl.

    Abstract translation: 诸如夹具（310）的支撑件构造成可释放地保持图案形成装置例如掩模版（300）以固定它并防止其热引起的变形。 例如，静电夹具包括具有相对的第一（313）和第二（315）表面的第一基底（312），位于第一表面上并被构造成接触光罩的多个毛刺（316），第二基底 ）具有相对的第一（317）和第二（319）表面。 第二衬底的第一表面耦合到第一衬底的第二表面。 多个冷却元件（318）位于第二基板的第一表面和第一基板的第二表面之间。 冷却元件构造成使电子从第一衬底的第二表面行进到第二衬底的第一表面。 每个冷却元件基本上与相应的毛刺对齐。

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