公开(公告)号：US20130264667A1

公开(公告)日：2013-10-10

申请号：US13838131

申请日：2013-03-15

Applicant: Allegro Microsystems, LLC

Inventor： Virgil Ararao ,  Nirmal Sharma ,  Raymond W. Engel ,  Jay Gagnon ,  John B. Sauber ,  William P. Taylor ,  Elsa Kam-Lum

IPC: H01L43/02

CPC classification number: H01L43/02 ,  G01R33/0047 ,  G01R33/02 ,  H01L43/12 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/10156 ,  H01L2924/1815 ,  H01L2924/00014

Abstract: Magnetic field sensors and associated methods of manufacturing the magnetic field sensors include molded structures to encapsulate a magnetic field sensing element and an associated die attach pad of a lead frame and to also encapsulate or form a magnet or a flux concentrator.

Abstract translation: 制造磁场传感器的磁场传感器和相关联的方法包括模制结构，以封装磁场感测元件和相关联的引线框架的管芯附接垫并且还封装或形成磁体或集流器。

公开(公告)号：US20150285874A1

公开(公告)日：2015-10-08

申请号：US14741644

申请日：2015-06-17

Applicant: ALLEGRO MICROSYSTEMS, LLC

Inventor： William P. Taylor ,  Virgil Ararao ,  Leonardo Magpantay ,  Raymond W. Engel ,  Nirmal Sharma ,  Kirsten Doogue ,  Jay Gagnon

IPC: G01R33/07 ,  G01R33/09 ,  H01L23/495 ,  H01L43/04 ,  H01L43/06

CPC classification number: G01D11/245 ,  G01R33/07 ,  G01R33/09 ,  H01L23/49589 ,  H01L43/04 ,  H01L43/06 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: Methods and apparatus for a sensor having a die supporting a magnetic field sensor element, a leadframe having opposed first and second surfaces and leadfingers, a passive component coupled to the first and second ones of the leadfingers such that the component is an integrated part of an IC package, and a magnet adjacent to the second surface of leadframe to back bias the magnetic field sensor element.

Abstract translation: 用于具有支撑磁场传感器元件的模具的传感器的方法和装置，具有相对的第一和第二表面的引线框架和引导线，被耦合到所述第一和第二引导引脚的无源部件，使得所述部件是 IC封装，以及与引线框架的第二表面相邻的磁体，以使磁场传感器元件反向偏置。

公开(公告)号：US20130267043A1

公开(公告)日：2013-10-10

申请号：US13838864

申请日：2013-03-15

Applicant: Allegro Microsystems, LLC

Inventor： Virgil Ararao ,  Nirmal Sharma ,  Raymond W. Engel ,  Jay Gagnon ,  John B. Sauber ,  William P. Taylor ,  Elsa Kam-Lum

IPC: H01L43/12

CPC classification number: H01L43/02 ,  G01R33/0047 ,  G01R33/02 ,  H01L43/12 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/10156 ,  H01L2924/1815 ,  H01L2924/00014

Abstract: Magnetic field sensors and associated methods of manufacturing the magnetic field sensors include molded structures to encapsulate a magnetic field sensing element and an associated die attach pad of a lead frame and to also encapsulate or form a magnet or a flux concentrator.