Abstract:
A connector with latch protection includes a metal casing, an insulating body, plural metal terminals and a partition. The insulating body covers the interior of the metal casing and has a tab extended forwardly from the front of the insulating body and disposed apart on the top and bottom of the tab respectively, and both sides of the tab corresponding to a connecting plug form an inwardly concave portion, and both sides of the partition have a protection plate corresponding to each inwardly concave portion and the front of the tab and bent and extended forwardly. When the partition is embedded into the insulating body by a molding method, a portion of the two metal protection plates exposed from the tab forms a pair of latch grooves for latching the connecting plug to effectively improve the durability and life and lower the manufacturing cost of the connector significantly.
Abstract:
In a voltage detecting circuit, a transistor is configured as a P-type MOSFET, and includes a source connected with an input terminal, a gate connected with a ground voltage terminal and a drain connected with an output terminal. A transistor is configured as a P-type MOSFET, and includes a gate and a source connected with the output terminal and a drain connected with the ground terminal. Gate width and gate length of the transistor and gate width and gate length of the transistor are adjusted so that source-drain current flowing between the source and the drain of the transistor becomes equal to source-drain current flowing between the source and the drain of the transistor when the voltage applied to the input terminal is set to be preset trigger voltage. This configuration accomplishes detecting that the input voltage exceeds the trigger voltage with simple configuration.
Abstract:
A circuit includes a fuse and a sensing and control circuit. The fuse is coupled between a MOS transistor and a current source node. The sensing and control circuit is configured to receive a programming pulse and output a modified programming signal to the gate of the MOS transistor for programming the fuse. The modified programming signal has a pulse width based on a magnitude of a current through the first fuse.
Abstract:
In a voltage detecting circuit, a transistor is configured as a P-type MOSFET, and includes a source connected with an input terminal, a gate connected with a ground voltage terminal and a drain connected with an output terminal. A transistor is configured as a P-type MOSFET, and includes a gate and a source connected with the output terminal and a drain connected with the ground terminal. Gate width and gate length of the transistor and gate width and gate length of the transistor are adjusted so that source-drain current flowing between the source and the drain of the transistor becomes equal to source-drain current flowing between the source and the drain of the transistor when the voltage applied to the input terminal is set to be preset trigger voltage. This configuration accomplishes detecting that the input voltage exceeds the trigger voltage with simple configuration.
Abstract:
A cache controller, a method for controlling the cache controller, and a computing system comprising the same are provided. The computer system comprises a processor and a cache controller. The cache controller is electrically connected to the processor and comprises a first port, a second port, and at least one cache. The first port is configured to receive an address of a content, wherein a type of the content is one of instruction and data. The second port is configured to receive an information bit corresponding to the content, wherein the information bit indicates the type of the content. The at least one cache comprises at least one cache lines. Each of the cache lines comprises a content field and corresponding to an information field. The content and the information bit is stored in the content field of one of the cache lines and the corresponding information field respectively according to the information bit and the address. Thereby, instruction and data are separated in a unified cache.
Abstract:
A display device and a manufacturing method thereof are provided. The display device includes a light guide, a light source, and a brightness enhancement film (BEF), and a dual brightness enhancement film (DBEF). The light guide has a first edge along a first direction and a second edge adjacent to the first edge corresponding to the light source. The BEF is disposed on the light guide and has a plurality of prisms along a second direction which rotates from 0 to 90 degrees with respect to the first direction. The DBEF has a transmission axis along a third direction which also rotates from 0 to 90 degrees with respect to the first direction.
Abstract:
A method of testing a fuse element for a memory device is provided. A first test probe is electrically connected to a program terminal of the memory device. A second test probe is electrically connected to a ground terminal. The fuse element is on an electrical circuit path between the program terminal and the ground terminal. The first and second test probes are electrically connected to a testing device. A first voltage is applied with the testing device between the program terminal and the ground terminal. At least part of a first current of the first voltage flows across the fuse element. The first voltage and the at least part of the first current that flows across the fuse element is not large enough to change the conductivity state of the fuse element. The first current is measured and used to evaluated the conductive state of the fuse element.
Abstract:
The present invention discloses a packaging method of a light-sensing semiconductor device and a packaging structure thereof, wherein a matrix of spacer walls is formed on a light-sensing wafer, which has multiple light-sensing chips, and the adhesive is directly applied to between two neighboring spacer walls on the non-light-sensing regions. Thus, when the light transparent cover is installed, there is no more adhesive dropping onto the light-sensing regions of the light-sensing chips. Further, when the light transparent cover is pressed to join with the spacer walls, with the trenches formed at the tops of the spacer walls, the adhesive will not overflow from the joint seams into the light-sensing regions.
Abstract:
The present invention relates to a package structure for an optical sensor having a base set with the plurality of metallization traces on its upper and under surface and several conductors passing through the base electrically connects to the plurality of metallization traces on the surface; at least one optical sensor and its peripheral frame are set upon the base in which the conductors can be located within the frame area or the area between the optical sensor and the frame; and a light-pervious lid encapsulates the frame and completes the package structure. In addition, an enclosing base having a containing capacity can be adopted to replace the base and the frame. The present invention can efficiently raise the reliability of elements and yield and quality by said package structure.
Abstract:
A vacuum thermal cooker comprising an outer cooler, an inner cooker, a sealing lid unit and an insulating disc, the inner cooker being used for boiling food and then to be placed in the outer cooker sealed by the sealing lid unit and then the air in the outer cooker being sucked out by a separate simple sucking pump operated by hand, the interior of the outer cooker becoming vacuum so that the heat of the food and the inner cooker may be kept for a long period of time, not easily cooled off by function of the vacuum condition of the outer cooker.