公开(公告)号：US08637138B2

公开(公告)日：2014-01-28

申请号：US11318975

申请日：2005-12-27

申请人： Michal V. Wolkin ,  Ana C. Arias

发明人： Michal V. Wolkin ,  Ana C. Arias

IPC分类号： B41M5/52 ,  G01K17/00 ,  G01K7/24

CPC分类号： B41M5/52 ,  B05D5/12 ,  G01K7/16 ,  G01K17/006 ,  G01K2211/00 ,  H01L21/02565 ,  H05K3/048 ,  H05K3/061 ,  H05K3/12 ,  Y10T428/24802

摘要： A thin substrate has a layered structure on one surface, and can also have a layered structure on the other. Each layered structure can include a part of at least one patterned layer that, if patterned by photolithography, would frequently result in damage to the substrate due to fragility. For example, the substrate could be a 3 mil (76.2 μm) or thinner polyimide film and one patterned layer could be a semiconductor material such as vanadium oxide, while another could be metal in electrical contact with semiconductor material. The layer part, however, can be patterned by a printing operation or can include a printed patterned artifact such as an uneven boundary or an alignment. The printing operation can be direct printing or printing of a mask for etching or liftoff or both. The layered structure can include an array of cells, each with layer parts on each substrate surface.

摘要翻译： 薄基板在一个表面上具有层状结构，并且另外可以具有层状结构。 每个分层结构可以包括至少一个图案化层的一部分，如果通过光刻图案，则会由于脆性而频繁地导致对基底的损伤。 例如，衬底可以是3密耳（76.2μm）或更薄的聚酰亚胺膜，并且一个图案化层可以是诸如氧化钒的半导体材料，而另一个可以是与半导体材料电接触的金属。 然而，层部分可以通过打印操作来图案化，或者可以包括印刷的图案化伪像，例如不均匀边界或对准。 打印操作可以是直接打印或打印用于蚀刻或剥离的掩模或两者。 层状结构可以包括每个在每个衬底表面上具有层部分的单元阵列。