公开(公告)号：US20080194064A1

公开(公告)日：2008-08-14

申请号：US12105366

申请日：2008-04-18

Applicant: Dinesh A. Badami ,  Tom C. Lee ,  Baozhen Li ,  Gerald Matusiewicz ,  William T. Motsiff ,  Christopher D. Muzzy ,  Kimball M. Watson ,  Jean E. Wynne

Inventor： Dinesh A. Badami ,  Tom C. Lee ,  Baozhen Li ,  Gerald Matusiewicz ,  William T. Motsiff ,  Christopher D. Muzzy ,  Kimball M. Watson ,  Jean E. Wynne

IPC: H01L21/268

CPC classification number: H01L23/5258 ,  H01L23/525 ,  H01L23/5254 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for programming a laser fuse. The laser fuse has a fuse link including a material having a characteristic of changing its electrical resistance after being exposed to a laser beam. The laser beam is directed to the fuse link, the laser beam being controlled such that, in response to the impact of the laser beam upon the fuse link, the electrical resistance of the fuse link changes but the fuse link is not blown off.

Abstract translation: 激光熔丝编程方法。 激光熔丝具有包括具有在暴露于激光束之后改变其电阻的特性的材料的熔断体。 激光束被引导到熔丝链，激光束被控制，使得响应于激光束对熔丝链的冲击，熔丝链的电阻改变，但是熔丝链不会被吹掉。

公开(公告)号：US07166913B2

公开(公告)日：2007-01-23

申请号：US10907873

申请日：2005-04-19

Applicant: Anil K. Chinthakindi ,  Lawrence A. Clevenger ,  Tom C. Lee ,  Gerald Matusiewicz ,  Conal E. Murray ,  Chih-Chao Yang

Inventor： Anil K. Chinthakindi ,  Lawrence A. Clevenger ,  Tom C. Lee ,  Gerald Matusiewicz ,  Conal E. Murray ,  Chih-Chao Yang

IPC: H01L23/34

CPC classification number: H01L23/5228 ,  H01L23/3677 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A structure and method are disclosed for heat dissipation relative to a heat generating element in a semiconductor device. The structure includes a plurality of heat transmitting lines partially vertically coincidental with the heat generating element, and at least one interconnecting path from each heat transmitting line to a substrate of the semiconductor device. In one embodiment, the heat generating element includes a resistor in a non-first metal level. The invention is compatible with conventional BEOL interconnect schemes, minimizes the amount of heat transfer from the resistor to the surrounding interconnect wiring, thus eliminating the loss of current carrying capability in the wiring.

Abstract translation: 公开了相对于半导体器件中的发热元件的散热的结构和方法。 该结构包括多个与发热元件垂直一致的传热线，以及从每个传热线到半导体器件的基板的至少一个互连路径。 在一个实施例中，发热元件包括非第一金属水平的电阻器。 本发明与传统的BEOL互连方案兼容，使得从电阻器到周围互连布线的传热量最小化，从而消除了布线中的载流能力的损失。