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公开(公告)号:US11118993B2
公开(公告)日:2021-09-14
申请号:US16362883
申请日:2019-03-25
申请人: AKWEL
摘要: The device includes a distal connector portion with a connector for electrical connection to an external electrical circuit, a proximal measuring portion including a detector of the physical parameter configured to be in fluid contact, the detector has a general shape of a wafer delimiting a first electrical contact face and a second opposite measuring face, a member for electrically joining the detector and the connector. The detector is configured in the device such that both faces of the detector are immersed and in direct fluid contact.
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公开(公告)号:US20210262885A1
公开(公告)日:2021-08-26
申请号:US16972702
申请日:2019-06-03
申请人: Robert Bosch GmbH
发明人: Masaya Eto , Yasuhiro Kawai
摘要: The present invention provides a pressure sensor module capable of improving work efficiency during assembly.
The pressure sensor module detects a fluid pressure on the basis of a differential pressure between a reference pressure and the fluid pressure, and includes: a housing; a sensor element that can contact each of the reference pressure and the fluid pressure; a support member that supports the sensor element and is held in the housing; a first pressure passage that guides the fluid pressure to a first contact surface of the sensor element; and a second pressure passage that is sealed from the first pressure passage and guides the reference pressure to a second contact surface of the sensor element. The support member is a structure that is formed by integrating an elastic material section exerting sealing performance on the first pressure passage and the second pressure passage and capable of being elastically deformed and a hard material section, rigidity of which is higher than the elastic material section.-
公开(公告)号:US11089688B2
公开(公告)日:2021-08-10
申请号:US16397594
申请日:2019-04-29
申请人: TT Electronics PLC
IPC分类号: H05K1/18 , H05K1/02 , G01L19/14 , G01L19/00 , H05K1/09 , H05K1/11 , H05K3/28 , H05K3/32 , H05K7/02 , H05K1/16 , G01L13/02
摘要: A sensor device includes a printed circuit board (PCB) substrate having a top surface, a bottom surface, a slot between the top and bottom surfaces, and two holes through the top surface and reaching into the slot. The sensor device further includes a sensor chip mounted on the top surface of the PCB substrate and above one of the two holes. The sensor device further includes a molding compound covering the sensor chip and sidewall surfaces and the top surface of the PCB substrate.
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公开(公告)号:US11085429B2
公开(公告)日:2021-08-10
申请号:US16428466
申请日:2019-05-31
申请人: KOBE STEEL, LTD.
发明人: Koichiro Hashimoto , Naofumi Kanei , Takuya Washio , Daisuke Wada , Ryosuke Mori
摘要: A compression device (1) includes compression portions, a suction line, connection lines, a discharge line, and display portions (d) configured to display pressure values, pressure gauges (PG1 to PG6) provided for at least one of the suction line, the connection lines, and the discharge line and a housing (40). The housing (40) includes a peripheral wall (42) and a door (44). The pressure gauges (PG1 to PG6) are situated at positions to face the door (44).
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公开(公告)号:US11073438B2
公开(公告)日:2021-07-27
申请号:US16147203
申请日:2018-09-28
发明人: Richard Jin Yao
摘要: A manifold assembly configured to measure differential pressure of fluid. The manifold assembly may have a monolithic body with an internally drilled fluid pathway. The body supports a differential pressure transducer that communicates, on either end, with the internally drilled fluid pathway. This configuration can generate data that defines pressure drop across impellers or other mechanisms on metrology hardware (or “gas meters”). Utilities can use this data to diagnose health or other conditions on the gas meter in the field.
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76.
公开(公告)号:US20210219851A1
公开(公告)日:2021-07-22
申请号:US17223090
申请日:2021-04-06
发明人: Paul Douglas CORL
IPC分类号: A61B5/0215 , A61B5/00 , G01L9/00 , G01L19/14
摘要: An intravascular pressure sensor assembly is disclosed herein that is produced in part using photolithography and DRIE solid-state device production processes. Using DRIE production processes facilitates a number of features that could not be readily incorporated in sensor chips fabricated using mechanical saws. In accordance with a first feature, sensor chips are created with non-rectangular outlines. The sensor chip includes a widened portion that substantially abuts an inner wall of a sensor housing, and a cantilevered portion that is relatively narrow in relation to the widened portion. The non-rectangular outline of the sensor chip is formed using photolithography in combination with DRIE processing. In accordance with another feature, the sensor chip is positioned width-wise in the housing, thereby reducing a required length for the housing. In accordance with yet another feature, the sensor chip comprises one or more cutouts for receiving signal wires for connection to signal lead lines on the sensor chip. The outline of the sensor chip and the cutouts are formed using photolithography in combination with DRIE processing.
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77.
公开(公告)号:US11047759B2
公开(公告)日:2021-06-29
申请号:US16687742
申请日:2019-11-19
申请人: INGU Solutions Inc.
摘要: There is provided a sensor device for measuring fluid and fluid conduit properties, and a method for activating the sensor device. The sensor device comprises an outer capsule for providing fluid-tight containment to an interior compartment of the sensor device in a closed position. The outer capsule comprises a first capsule portion and a second capsule portion. An aperture is located in the second capsule portion and fluidly connects the inner compartment to an exterior of the outer capsule. A mounting bracket is disposed within the inner compartment, the mounting bracket connects the first capsule portion to the second capsule portion and provides structural integrity and pressure resistivity for the outer capsule. At least one pressure sensor is constrained between the mounting bracket and an inner surface of the second capsule portion and is aligned with the aperture of the second capsule portion.
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公开(公告)号:US11041775B2
公开(公告)日:2021-06-22
申请号:US16224330
申请日:2018-12-18
摘要: An apparatus is described and in one embodiment includes a first portion comprising an inner diameter, a first outer diameter, and a first length and a second portion, wherein the first portion and the second portion are integrally connected together, the second portion comprising the inner diameter, at least one second outer diameter, and a second length. The embodiment further includes a flange comprising a contact surface, wherein the inner diameter of the first portion and the second portion provides a hollow pathway through the apparatus.
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公开(公告)号:US11021952B2
公开(公告)日:2021-06-01
申请号:US16927035
申请日:2020-07-13
IPC分类号: E21B49/10 , E21B47/06 , G01N1/14 , G01L19/00 , G01L19/14 , E21B47/12 , E21B49/00 , E21B49/08
摘要: A pressure testing module separable from and configured to be coupled with a tool base that is to be coupled along a downhole tool string to be conveyed within a wellbore extending into a subterranean formation. The pressure testing module includes a chamber and a piston assembly slidably disposed within the chamber, thus dividing the chamber into a first chamber portion and a second chamber portion. The piston assembly is operable to move in response to hydraulic fluid being pumped into the first chamber portion and to draw formation fluid of the wellbore into the second chamber portion in response to the movement of the piston assembly.
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公开(公告)号:US10983023B2
公开(公告)日:2021-04-20
申请号:US15779802
申请日:2016-08-02
摘要: A pressure sensor assembly includes a tube, wherein a membrane to which the pressure to be measured is applied is arranged in the cross-section of the tube, where the membrane has a high flexural rigidity in a central region and is mounted resiliently in the edge region in the tube via two limbs, and includes a device for detecting the axial displacement which is easily accessible from the outside on the outer side of the tube and is advantageously not in contact with the process medium, and where the pressure sensor assembly has a particularly simple structural configuration, and can be used advantageously in measurement transducers for process instrumentation.
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