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公开(公告)号：US20070211763A1
公开(公告)日：2007-09-13
申请号：US11637808
申请日：2006-12-13
Applicant: David Solomon , Stephen Brolin
Inventor： David Solomon , Stephen Brolin
IPC: H04J3/00
CPC classification number: H04L43/50 , H04J3/1694 , H04J2203/0094 , H04L12/18 , H04L41/0213 , H04L41/024 , H04L41/042 , H04L41/0806 , H04L41/0856 , H04L41/5054 , H04L41/509 , H04L45/16 , H04L49/15 , H04L49/1523 , H04L49/30 , H04L49/351 , H04L49/352 , H04L49/357 , H04L49/50 , H04Q11/0062 , H04Q11/0067 , H04Q11/0071 , H04Q2011/0079 , H04Q2011/0083 , H04Q2011/0084 , H05K7/20009 , H05K7/202 , Y04S40/162 , Y04S40/168
Abstract: The present invention provides TDM service, such as DS1, E1, or DS3, in a GPON system that is cost-effective, flexible, and that is easily configured and reconfigured. A system for telecommunications comprises circuitry operable to receive time division multiplexed data traffic, circuitry operable to form Virtual Tributary encapsulated data traffic including the time division multiplexed data traffic, circuitry operable to transmit the Virtual Tributary encapsulated data traffic, circuitry operable to receive the Virtual Tributary encapsulated data traffic, and circuitry operable to extract the time division multiplexed data traffic from the Virtual Tributary encapsulated data traffic.
Abstract translation: 本发明在GPON系统中提供诸如DS1，E1或DS3之类的TDM业务，其性价比高，灵活，并且易于配置和重新配置。 一种用于电信的系统包括可操作以接收时分多路复用数据业务的电路，可操作以形成包括时分复用数据业务的虚拟支路封装数据业务的电路，可操作以传输虚拟支路封装数据业务的电路，可操作以接收虚拟支路的电路 封装的数据业务，以及可操作以从虚拟支路封装的数据业务中提取时分多路复用数据业务的电路。
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公开(公告)号：US07206202B2
公开(公告)日：2007-04-17
申请号：US11071551
申请日：2005-03-03
Applicant: I-Jung Yang
Inventor： I-Jung Yang
IPC: H05K7/20
CPC classification number: H05K7/20009 , H01L23/467 , H01L2924/0002 , H01L2924/00
Abstract: An electronic apparatus with a heat-dissipating structure is disclosed. The electronic apparatus with a heat-dissipating structure comprises a main body having a plurality of apertures, a resilient component having two ends fixed to the main body, and an insulation component disposed between the main body and the resilient component, connected with the resilient component and covering the surface of the apertures. When the temperature of the electronic apparatus is increased, the resilient component expands and bends outward so as to carry the insulation component apart from the surface of the apertures and further form a space, thereby enabling air to flow through the apertures of the electronic apparatus and the space to dissipate heat of the electronic apparatus.
Abstract translation: 公开了一种具有散热结构的电子设备。 具有散热结构的电子设备包括具有多个孔的主体，具有固定到主体上的两端的弹性部件和设置在主体和弹性部件之间的绝缘部件，与弹性部件连接 并覆盖孔的表面。 当电子设备的温度升高时，弹性部件向外膨胀并向外弯曲，从而将绝缘部件与孔的表面隔开并进一步形成空间，从而使空气能够流过电子设备的孔，并且 散发电子设备的热量的空间。
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63.发明申请
公开(公告)号：US20050178526A1
公开(公告)日：2005-08-18
申请号：US10792719
申请日：2004-03-05
Applicant: Takashi Naganawa , Rintaro Minamitani , Shigeo Ohashi , Atsuo Nishihara
Inventor： Takashi Naganawa , Rintaro Minamitani , Shigeo Ohashi , Atsuo Nishihara
CPC classification number: H05K7/20009 , F04D9/007 , F04D13/0673 , G06F1/20 , G06F2200/201 , H01L23/473 , H01L2924/0002 , H01L2924/00
Abstract: In a cooling system of liquid type, dissolving a problem upon starting when applying a centrifugal pump therein, and being freely applicable into various kinds of electronic apparatuses, easily, for cooling a CPU in need of cooling thereof, which is mounted within a housing 100, the system comprises: a cooling jacket 50, a radiator 60 and a circulation pump, wherein the circulation pump is built up with a centrifugal pump, in which a rotor 730 having a plural number of blades formed in a centrifugal manner, a pump chamber 741 receiving the rotor in an inside thereof, and a field coil 712 of an electric motor for driving the rotor rotationally are formed into one body, and the pump chamber is disposed to located below the electric motor, thereby achieving the structure so that a liquid coolant fills up the pump chamber when stopping, in spite of the disposition of the circulation pump, thereby dissolving the problem of idling when starting.
Abstract translation: 在液体冷却系统中，当在其中施加离心泵时解决了起动问题，并且可以容易地适用于各种电子设备，用于冷却安装在壳体100内的需要冷却的CPU 该系统包括：冷却套50，散热器60和循环泵，其中循环泵由离心泵构成，其中具有以离心方式形成的多个叶片的转子730，泵室 741，其内部接收转子，并且用于驱动转子的电动机的励磁线圈712旋转地形成为一体，并且泵室设置在电动机的下方，从而实现了液体 尽管循环泵的布置，冷却剂在停止时填充泵室，从而解决了起动时的空转问题。
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公开(公告)号：US20050152116A1
公开(公告)日：2005-07-14
申请号：US10755775
申请日：2004-01-12
Applicant: Charles McClary
Inventor： Charles McClary
CPC classification number: H05K7/1412 , H05K7/20009 , H05K7/20563
Abstract: A cooling apparatus for an electronic unit is described which includes a first plate, a second plate, and a controlling mechanism. The first and second plates are generally planar and have holes formed therethrough. The controlling mechanism is operable to move the first plate with respect to the second plate. A first position for movement is where more of the holes in the first plate and the second plate are substantially aligned than are not aligned. A second position is where more of the holes in the first plate and the second plate are not aligned than are aligned.
Abstract translation: 描述了一种用于电子单元的冷却装置，其包括第一板，第二板和控制机构。 第一和第二板通常是平面的并且具有通过其形成的孔。 控制机构可操作以相对于第二板移动第一板。 移动的第一位置是第一板和第二板中的更多的孔基本上对准而不对齐。 第二位置是第一板和第二板中的多个孔不比对准的对准。
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65.发明申请COMPUTER SYSTEM WITH A LIQUID-COOLING THERMAL MODULE HAVING A PLURALITY OF PUMPS 有权具有多个泵浦的液体冷却模块的计算机系统
公开(公告)号：US20040233632A1
公开(公告)日：2004-11-25
申请号：US10605851
申请日：2003-10-30
Inventor： Hung Chang
IPC: H05K007/20
CPC classification number: G06F1/20 , G06F2200/201 , H05K7/20009 , H05K7/20836
Abstract: A computer system includes a processor for processing data, a storage unit for storing data, and a liquid-cooling thermal module for dissipating heat generated by the processor. The thermal module has a heat pipe adjacent to the processor for conducting heat, and a cooling device. The cooling device has a plurality of tanks, which are connected with each other.
Abstract translation: 计算机系统包括用于处理数据的处理器，用于存储数据的存储单元和用于散热由处理器产生的热的液冷热模块。 热模块具有与处理器相邻的用于传导热量的热管，以及冷却装置。 冷却装置具有彼此连接的多个罐。
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公开(公告)号：US06798660B2
公开(公告)日：2004-09-28
申请号：US10365915
申请日：2003-02-13
Applicant: David L. Moss , Ty R. Schmitt
Inventor： David L. Moss , Ty R. Schmitt
IPC: H05K720
CPC classification number: G06F1/20 , G06F2200/201 , H05K7/20009
Abstract: A liquid cooling module is disclosed. A module for providing a coolant to circulate within a computer system includes a housing, at least two connection ports and a coolant line. The housing may be formed and sized to fit within an auxiliary bay in the computer system. The connection ports may be formed in the housing of the module and couple to a cooling system. The coolant line may also be formed in the housing and connect with the connection ports for circulating the coolant such that the coolant receives heat generated by a computer device placed within the computer system.
Abstract translation: 公开了一种液体冷却模块。 用于提供在计算机系统内循环的冷却剂的模块包括壳体，至少两个连接端口和冷却剂管线。 壳体可以形成并定尺寸成适合于计算机系统中的辅助隔间。 连接端口可以形成在模块的壳体中并且耦合到冷却系统。 冷却剂管线也可以形成在壳体中并与用于使冷却剂循环的连接端口连接，使得冷却剂接收由放置在计算机系统内的计算机设备产生的热量。
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公开(公告)号：US20040160741A1
公开(公告)日：2004-08-19
申请号：US10365915
申请日：2003-02-13
Applicant: Dell Products L.P.
Inventor： David L. Moss , Ty R. Schmitt
IPC: H05K007/20
CPC classification number: G06F1/20 , G06F2200/201 , H05K7/20009
Abstract: A liquid cooling module is disclosed. A module for providing a coolant to circulate within a computer system includes a housing, at least two connection ports and a coolant line. The housing may be formed and sized to fit within an auxiliary bay in the computer system. The connection ports may be formed in the housing of the module and couple to a cooling system. The coolant line may also be formed in the housing and connect with the connection ports for circulating the coolant such that the coolant receives heat generated by a computer device placed within the computer system.
Abstract translation: 公开了一种液体冷却模块。 用于提供在计算机系统内循环的冷却剂的模块包括壳体，至少两个连接端口和冷却剂管线。 壳体可以形成并定尺寸成适合于计算机系统中的辅助隔间。 连接端口可以形成在模块的壳体中并且耦合到冷却系统。 冷却剂管线也可以形成在壳体中并与用于使冷却剂循环的连接端口连接，使得冷却剂接收由放置在计算机系统内的计算机设备产生的热量。
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公开(公告)号：US20040094115A1
公开(公告)日：2004-05-20
申请号：US10649506
申请日：2003-08-27
Inventor： Stefan Jatzke , Paul White
IPC: B60K013/02 , B60R016/04 , H02J007/00
CPC classification number: B60R16/0239 , H05K7/20009
Abstract: An assembly comprises a housing (10) for a battery (16) and a control module (18). The housing has an air inlet (20, 20null) and an air outlet (22). The air outlet (22) is adapted to be connected with the intake system of an engine of a motor vehicle.
Abstract translation: 组件包括用于电池（16）的壳体（10）和控制模块（18）。 壳体具有空气入口（20,20'）和空气出口（22）。 空气出口（22）适于与机动车辆的发动机的进气系统连接。
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公开(公告)号：US06459577B1
公开(公告)日：2002-10-01
申请号：US09899553
申请日：2001-07-06
Applicant: Steve Holmes , Wayne Miller , Girish Upadhya , Richard Smith
Inventor： Steve Holmes , Wayne Miller , Girish Upadhya , Richard Smith
IPC: H05K720
CPC classification number: G06F1/20 , H05K7/20009
Abstract: A heat removal system for a computer comprising a casing enclosing a hard drive and a microprocessor, the casing including an opening in an exterior surface thereof; a heat sink positioned between the hard drive and the microprocessor, the heat sink being aligned with the opening in the casing so as to form a thermal chimney; and a spreader plate disposed between the microprocessor and the heat sink, the spreader plate conducting heat from the microprocessor to the heat sink.
Abstract translation: 一种用于计算机的散热系统，包括一个包围硬盘驱动器和一个微处理器的壳体，该壳体在其外表面上包括一个开口; 位于所述硬盘驱动器和所述微处理器之间的散热器，所述散热器与所述壳体中的开口对准，以形成热烟囱; 以及设置在微处理器和散热器之间的扩展板，散热板将热量从微处理器传导到散热器。
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公开(公告)号：US20020046853A1
公开(公告)日：2002-04-25
申请号：US09471045
申请日：1999-12-22
Inventor： RICHARD J. STENDARDO , WILLIAM W. KERR JR. , MELANIE A. LEWIS , THOMAS F. VRNAK , GENARO FLORES ALBA
IPC: H01J005/00 , H01J015/00
CPC classification number: H01F27/02 , H02B1/28 , H05K7/20009
Abstract: A waterproof enclosure (100) for electrical devices includes a front frame (114), a base plate (116), and a roof assembly (118) attached to a component mounting section (120). Front frame (114) extends from the front of component mounting section (120), and includes doors (122) for protecting electrical components mounted within the component mounting section (120). Roof assembly (118) is attached to the top of front frame (114) and component mounting section (120) for preventing the ingress moisture into front frame (114) and component mounting section (120). Roof assembly (118) includes ventilation channels (124, 126, 128, 130) disposed along the length of caps (132, 134, 136) to increase air flow through the enclosure (100) for cooling the electrical components mounted therein.
Abstract translation: 用于电气设备的防水外壳（100）包括前框架（114），基板（116）和附接到部件安装部分（120）的顶盖组件（118）。 前框架（114）从部件安装部分（120）的前部延伸，并且包括用于保护安装在部件安装部分（120）内的电气部件的门（122）。 屋顶组件（118）附接到前框架（114）的顶部和部件安装部分（120），用于防止湿气进入前框架（114）和部件安装部分（120）。 屋顶组件（118）包括沿着盖子（132,134,136）的长度设置的通风通道（124,126,128,130），以增加通过外壳（100）的空气流，用于冷却安装在其中的电气部件。
